【レポートの概要（一部）】
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
• 2.1 Preface
• 2.2 Preface
• 2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY APPLICATION
• Market segmentation by application
• Comparison by application
• UPS and PS systems – Market size and forecast 2018-2023
• PV inverters – Market size and forecast 2018-2023
• IMDs – Market size and forecast 2018-2023
• EVs/HEVs – Market size and forecast 2018-2023
• Others – Market size and forecast 2018-2023
• Market opportunity by application
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 11: TRENDS
• Growing implementation of signal processing applications
• Increasing number of foundry services for WBG power semiconductor devices
• Focus on moving toward larger wafers
PART 12: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 13: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Cree
• Infineon Technologies
• ROHM SEMICONDUCTOR
• STMicroelectronics
• Transphorm
PART 14: APPENDIX
• Research methodology
• List of abbreviations
PART 15: EXPLORE TECHNAVIO
Exhibit 01: Years in consideration
Exhibit 02: Global semiconductor market
Exhibit 03: Segments of global semiconductor market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Comparison of properties of semiconductor materials
Exhibit 07: Market definition – Inclusions and exclusions checklist
Exhibit 08: Market size 2018
Exhibit 09: Bandwidth comparison of 1G to 5G technologies
Exhibit 10: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 11: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 12: Five forces analysis 2018
Exhibit 13: Five forces analysis 2023
Exhibit 14: Bargaining power of buyers
Exhibit 15: Bargaining power of suppliers
Exhibit 16: Threat of new entrants
Exhibit 17: Threat of substitutes
Exhibit 18: Threat of rivalry
Exhibit 19: Market condition – Five forces 2018
Exhibit 20: Application – Market share 2018-2023 (%)
Exhibit 21: Comparison by application
Exhibit 22: UPS and PS systems – Market size and forecast 2018-2023 ($ millions)
Exhibit 23: UPS and PS systems – Year-over-year growth 2019-2023 (%)
Exhibit 24: PV inverters – Market size and forecast 2018-2023 ($ millions)
Exhibit 25: PV inverters – Year-over-year growth 2019-2023 (%)
Exhibit 26: IMDs – Market size and forecast 2018-2023 ($ millions)
Exhibit 27: IMDs – Year-over-year growth 2019-2023 (%)
Exhibit 28: EVs/HEVs – Market size and forecast 2018-2023 ($ millions)
Exhibit 29: EVs/HEVs – Year-over-year growth 2019-2023 (%)
Exhibit 30: Others – Market size and forecast 2018-2023 ($ millions)
Exhibit 31: Others – Year-over-year growth 2019-2023 (%)
Exhibit 32: Market opportunity by application
Exhibit 33: Customer landscape
Exhibit 34: Market share by geography 2018-2023 (%)
Exhibit 35: Geographic comparison
Exhibit 36: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 37: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 38: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 39: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 40: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 41: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 42: Key leading countries
Exhibit 43: Market opportunity
Exhibit 44: Impact of drivers and challenges
Exhibit 45: Vendor landscape
Exhibit 46: Landscape disruption
Exhibit 47: Vendors covered
Exhibit 48: Vendor_analysis1
Exhibit 49: Vendor classification
Exhibit 50: Market positioning of vendors
Exhibit 51: Cree – Vendor overview
Exhibit 52: Cree – Business segments
Exhibit 53: Cree – Organizational developments
Exhibit 54: Cree – Geographic focus
Exhibit 55: Cree – Segment focus
Exhibit 56: Cree – Key offerings
Exhibit 57: Infineon Technologies – Vendor overview
Exhibit 58: Infineon Technologies – Business segments
Exhibit 59: Infineon Technologies – Organizational developments
Exhibit 60: Infineon Technologies – Geographic focus
Exhibit 61: Infineon Technologies – Segment focus
Exhibit 62: Infineon Technologies – Key offerings
Exhibit 63: ROHM SEMICONDUCTOR – Vendor overview
Exhibit 64: ROHM SEMICONDUCTOR – Business segments
Exhibit 65: ROHM SEMICONDUCTOR – Organizational developments
Exhibit 66: ROHM SEMICONDUCTOR – Geographic focus
Exhibit 67: ROHM SEMICONDUCTOR – Segment focus
Exhibit 68: ROHM SEMICONDUCTOR – Key offerings
Exhibit 69: STMicroelectronics – Vendor overview
Exhibit 70: STMicroelectronics – Business segments
Exhibit 71: STMicroelectronics – Organizational developments
Exhibit 72: STMicroelectronics – Geographic focus
Exhibit 73: STMicroelectronics – Segment focus
Exhibit 74: STMicroelectronics – Key offerings
Exhibit 75: Transphorm – Vendor overview
Exhibit 76: Transphorm – Organizational developments
Exhibit 77: Transphorm – Key offerings
Exhibit 78: Research framework
Exhibit 79: Validation techniques employed for market sizing
Exhibit 80: Information sources
Exhibit 81: List of abbreviations
【レポート販売概要】
■ タイトル：ワイドバンドギャップ（WBG）パワー半導体デバイスの世界市場2019-2023■ 英文：Global Wide-Bandgap (WBG) Power Semiconductor Devices Market 2019-2023
■ 発行日：2018年11月22日
■ 調査会社：Technavio
■ 商品コード：IRTNTR30306
■ 調査対象地域：グローバル、アジア、北米、ヨーロッパ（EMEA）
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