【レポートの概要（一部）】
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market segmentation analysis
• Market characteristics
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY TECHNOLOGY
• Market segmentation by technology
• Comparison by technology
• Optical wafer inspection – Market size and forecast 2018-2023
• E-beam wafer inspection – Market size and forecast 2018-2023
• Market opportunity by technology
PART 07: CUSTOMER LANDSCAPE
PART 08: MARKET SEGMENTATION BY END-USER
• Market segmentation by end-user
• Comparison by end-user
• Foundries – Market size and forecast 2018-2023
• IDMs – Market size and forecast 2018-2023
• Market opportunity by end-user
PART 09: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 12: MARKET TRENDS
• Increasing focus on large diameter wafer size
• Growing investments in lower technology node
• Growing investment in 3D NAND and FinFET technologies
PART 13: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 14: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Applied Materials
• ASML
• Hitachi High-Technologies
• KLA-Tencor
• Rudolph Technologies
PART 15: APPENDIX
• Research methodology
• List of abbreviations
PART 16: EXPLORE TECHNAVIO
Exhibit 01: Global semiconductor manufacturing equipment market
Exhibit 02: Segments of global semiconductor manufacturing equipment market
Exhibit 03: Market segments
Exhibit 04: Market characteristics
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2018
Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 09: Five forces analysis 2018
Exhibit 10: Five forces analysis 2023
Exhibit 11: Bargaining power of buyers
Exhibit 12: Bargaining power of suppliers
Exhibit 13: Threat of new entrants
Exhibit 14: Threat of substitutes
Exhibit 15: Threat of rivalry
Exhibit 16: Market condition – Five forces 2018
Exhibit 17: Technology – Market share 2018-2023 (%)
Exhibit 18: Comparison by technology
Exhibit 19: Optical wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 20: Optical wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 21: E-beam wafer inspection – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: E-beam wafer inspection – Year-over-year growth 2019-2023 (%)
Exhibit 23: Market opportunity by technology
Exhibit 24: Customer landscape
Exhibit 25: End-user – Market share 2018-2023 (%)
Exhibit 26: Comparison by end-user
Exhibit 27: Foundries – Market size and forecast 2018-2023 ($ millions)
Exhibit 28: Foundries – Year-over-year growth 2019-2023 (%)
Exhibit 29: IDMs – Market size and forecast 2018-2023 ($ millions)
Exhibit 30: IDMs – Year-over-year growth 2019-2023 (%)
Exhibit 31: Market opportunity by end-user
Exhibit 32: Market share by geography 2018-2023 (%)
Exhibit 33: Geographic comparison
Exhibit 34: Major semiconductor foundries in APAC
Exhibit 35: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 36: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 37: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 38: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 39: Major foundries in EMEA
Exhibit 40: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 41: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 42: Key leading countries
Exhibit 43: Market opportunity
Exhibit 44: Impact of drivers and challenges
Exhibit 45: Vendor landscape
Exhibit 46: Landscape disruption
Exhibit 47: Vendors covered
Exhibit 48: Vendor classification
Exhibit 49: Market positioning of vendors
Exhibit 50: Applied Materials – Vendor overview
Exhibit 51: Applied Materials – Business segments
Exhibit 52: Applied Materials – Organizational developments
Exhibit 53: Applied Materials – Geographic focus
Exhibit 54: Applied Materials – Segment focus
Exhibit 55: Applied Materials – Key offerings
Exhibit 56: ASML – Vendor overview
Exhibit 57: ASML – Organizational developments
Exhibit 58: ASML – Geographic focus
Exhibit 59: ASML – Key offerings
Exhibit 60: Hitachi High-Technologies – Vendor overview
Exhibit 61: Hitachi High-Technologies – Business segments
Exhibit 62: Hitachi High-Technologies – Organizational developments
Exhibit 63: Hitachi High-Technologies – Segment focus
Exhibit 64: Hitachi High-Technologies – Key offerings
Exhibit 65: KLA-Tencor – Vendor overview
Exhibit 66: KLA-Tencor – Organizational developments
Exhibit 67: KLA-Tencor – Geographic focus
Exhibit 68: KLA-Tencor – Key offerings
Exhibit 69: Rudolph Technologies – Vendor overview
Exhibit 70: Rudolph Technologies – Organizational developments
Exhibit 71: Rudolph Technologies – Geographic focus
Exhibit 72: Rudolph Technologies – Key offerings
【レポート販売概要】
■ タイトル：ウエハー検査装置の世界市場2019-2023■ 英文：Global Wafer Inspection Equipment Market 2019-2023
■ 発行日：2018年11月15日
■ 調査会社：Technavio
■ 商品コード：IRTNTR30265
■ 調査対象地域：グローバル、アジア、北米、ヨーロッパ（EMEA）
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