サブストレートライクPCB(SLP)の世界市場予測(~2024年)...市場調査レポートについてご紹介

【英文タイトル】Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

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【レポートの概要(一部)】

TABLE OF CONTENTS

1 INTRODUCTION 14
1.1 STUDY OBJECTIVES 14
1.2 DEFINITION 14
1.3 STUDY SCOPE 15
1.3.1 MARKETS COVERED 15
1.4 YEARS CONSIDERED 15
1.5 CURRENCY 16
1.6 STAKEHOLDERS 16
2 RESEARCH METHODOLOGY 17
2.1 RESEARCH DATA 17
2.1.1 SECONDARY DATA 19
2.1.1.1 Key data from secondary sources 19
2.1.2 PRIMARY DATA 19
2.1.2.1 Primary interviews with experts 20
2.1.2.2 Breakdown of primaries 20
2.1.2.3 Key data from primary sources 21
2.1.2.4 Key industry insights 22
2.2 MARKET SIZE ESTIMATION 22
2.2.1 BOTTOM-UP APPROACH 22
2.2.1.1 Approach for capturing market size by bottom-up analysis
(demand side) 23
2.2.2 TOP-DOWN APPROACH 24
2.2.2.1 Approach for capturing market size by top-down analysis
(supply side) 24
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 26
2.4 RESEARCH ASSUMPTIONS 27
3 EXECUTIVE SUMMARY 28
4 PREMIUM INSIGHTS 31
4.1 ATTRACTIVE OPPORTUNITIES IN SUBSTRATE-LIKE PCB MARKET 31
4.2 SUBSTRATE LIKE PCB MARKET IN APAC, BY APPLICATION AND COUNTRY 32
4.3 COUNTRY-WISE SUBSTRATE-LIKE PCB MARKET GROWTH RATE 33
5 MARKET OVERVIEW 34
5.1 INTRODUCTION 34
5.2 MARKET DYNAMICS 34
5.2.1 DRIVERS 35
5.2.1.1 High adoption of SLPs by leading OEMs 35
5.2.1.2 Surge in demand for smart consumer electronics and wearable devices 35
5.2.1.3 Impactful benefits of SLPs 35
5.2.2 RESTRAINTS 36
5.2.2.1 Higher setup costs associated with SLPs 36
5.2.3 OPPORTUNITIES 36
5.2.3.1 Increasing use of advanced printed circuit boards in high-end technology-based products 36
5.2.3.2 Rising adoption of SLP technology by smartphone players owing to transition from 4G to 5G technology 36
5.2.3.3 Growing use of mSAP and SAP processes in PCB manufacturing 37
5.2.4 CHALLENGES 37
5.2.4.1 Increasing complexity of printed circuit boards 37
6 SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE 38
6.1 INTRODUCTION 39
6.2 25/25µM AND 30/30µM LINE/SPACE 40
6.2.1 25/25µM & 30/30µM LINE/SPACE SEGMENT DOMINATE SLP MARKET, IN TERMS OF SIZE, OWING TO THE RISING ADOPTION OF MINIATURE DEVICES 40
6.3 LESS THAN 25/25 µM LINE/SPACE 42
6.3.1 SUBSTANTIAL GROWTH RATE OF MARKET FOR SLPS WITH LESS THAN 25/25 µM LINE/SPACE DUE TO ADOPTION OF ADDITIVE PROCESS IN MANUFACTURING THESE SLPS 42
7 SUBSTRATE-LIKE PCB MARKET, BY APPLICATION 45
7.1 INTRODUCTION 46
7.2 CONSUMER ELECTRONICS 48
7.2.1 CONSUMER ELECTRONICS EXPECTED TO HOLD LARGEST SIZE OF SLP MARKET OWING TO ADOPTION OF SLP BY LEADING ORIGINAL EQUIPMENT MANUFACTURERS IN THEIR SMARTPHONES 48
7.3 COMPUTING AND COMMUNICATIONS 49
7.3.1 INCREASING ADOPTION OF ADVANCED COMMUNICATION TECHNOLOGIES WOULD LEAD TO HIGH DEMAND FOR SLP FOR COMPUTING AND COMMUNICATIONS APPLICATIONS 49
7.4 AUTOMOTIVE 51
7.4.1 INCREASING DEMAND FOR MULTILAYER PRINTED CIRCUIT BOARDS IN AUTOMOTIVE ELECTRONICS WILL SPUR SLP MARKET GROWTH 51
7.5 MEDICAL 53
7.5.1 RISING TREND OF MINIATURIZATION OF ADVANCED MEDICAL EQUIPMENT AND DEVICES EXPECTED TO PROVIDE OPPORTUNITIES FOR SLP MARKET PLAYERS 53
7.6 INDUSTRIAL 55
7.6.1 GROWING TREND OF IIOT AND INDUSTRY 4.0 TO DRIVE DEMAND FOR SLP IN INDUSTRIAL APPLICATIONS 55

7.7 MILITARY, DEFENSE, AND AEROSPACE 56
7.7.1 NORTH AMERICA TO LEAD SLP MARKET FOR MILITARY, DEFENSE AND AEROSPACE APPLICATIONS DUE TO INCREASING DEMAND FOR
HIGH-PERFORMANCE PRINTED CIRCUIT BOARDS 56
8 SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY 59
8.1 INTRODUCTION 60
8.2 AUTOMATED OPTICAL INSPECTION (AOI) 62
8.2.1 AOI TECHNOLOGY TO HOLD LARGEST SHARE OF SLP MARKET OWING TO INCREASED INTEREST OF SLP MANUFACTURERS IN ADOPTING ADVANCED INSPECTION TECHNOLOGIES 62
8.3 DIRECT IMAGING (DI) OR LASER DIRECT IMAGING (LDI) 64
8.3.1 STURDY GROWTH OF DI IN SLP MARKET BASED ON INSPECTION TECHNOLOGY AS IT OFFERS OPTIMAL QUALITY AT HIGH SPEED 64
8.4 AUTOMATED OPTICAL SHAPING (AOS) 65
8.4.1 SLP MARKET FOR AOS TECHNOLOGY TO GROW AT HIGHEST CAGR DUE TO ITS HIGH POTENTIAL FOR FINDINGS FAULTS AND SHAPING COPPER TRACKS 65
9 GEOGRAPHIC ANALYSIS 67
9.1 INTRODUCTION 68
9.2 NORTH AMERICA 69
9.2.1 US 71
9.2.1.1 High adoption of SLPs in consumer electronics applications to boost market growth in US 71
9.2.2 CANADA 72
9.2.2.1 Automotive and healthcare segments expected to provide opportunity for SLP market 72
9.2.3 MEXICO 72
9.2.3.1 Mexican market expected to grow at steady rate due to increasing government initiatives in industrial sector 72
9.3 EUROPE 73
9.3.1 GERMANY 75
9.3.1.1 Germany expected to dominate European SLP market owing to growing automotive industry in country 75
9.3.2 UK 76
9.3.2.1 Increasing importance of smart manufacturing would augment SLP market growth in UK 76
9.3.3 FRANCE 76
9.3.3.1 Steady market growth in France owing to rising demand for SLPs in computing and communications applications 76
9.3.4 ITALY 76
9.3.4.1 Strong market growth in Italy owing to high adoption of SLPs by manufacturers of premium cars 76
9.3.5 REST OF EUROPE 76

9.4 ASIA PACIFIC 77
9.4.1 CHINA 80
9.4.1.1 China would witness highest growth rate in SLP market in APAC due to rising demand for consumer electronics in the country 80
9.4.2 JAPAN 81
9.4.2.1 Growth of SLP market in Japan will be driven by rising adoption of SLPs in communications, automotive, and medical applications 81
9.4.3 SOUTH KOREA 81
9.4.3.1 SLP market in South Korea would grow due to presence of OEMs such as Samsung in country 81
9.4.4 TAIWAN 82
9.4.4.1 Taiwan has strong presence of PCB providers who are likely to enter in SLP market 82
9.4.5 REST OF APAC 82
9.5 ROW 82
9.5.1 MIDDLE EAST AND AFRICA 83
9.5.1.1 SLP market growth in Middle East and Africa would be driven by rising adoption of SLPs in computing and communications applications 83
9.5.2 SOUTH AMERICA 84
9.5.2.1 South American market to witness highest CAGR in substrate-like PCB market in RoW 84
10 COMPETITIVE LANDSCAPE 85
10.1 OVERVIEW 85
10.2 RANKING ANALYSIS OF MARKET PLAYERS 86
10.2.1 PRODUCT LAUNCHES/DEVELOPMENTS 87
10.2.2 AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS 87
10.2.3 ACQUISITIONS 88
10.2.4 EXPANSIONS 88
11 COMPANY PROFILES 89
11.1 OVERVIEW 89
11.2 KEY PLAYERS 90
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
11.2.1 KINSUS INTERCONNECT TECHNOLOGY 90
11.2.2 IBIDEN 93
11.2.3 COMPEQ 95
11.2.4 UNIMICRON 97
11.2.5 AT&S 100
11.2.6 TTM TECHNOLOGIES 103
11.2.7 SAMSUNG ELECTRO-MECHANICS 106

11.2.8 KOREA CIRCUIT 108
11.2.9 ZHEN DING TECHNOLOGY 110
* Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View might not be captured in case of unlisted companies.
11.3 OTHER PLAYERS 112
11.3.1 DAEDUCK GDS COMPANY 112
11.3.2 ISU PETASYS 112
11.3.3 TRIPOD TECHNOLOGY CORP 113
11.3.4 LG INNOTEK 113
12 APPENDIX 114
12.1 DISCUSSION GUIDE 114
12.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 117
12.3 RELATED REPORTS 119
12.4 AUTHOR DETAILS 120


【レポート販売概要】

■ タイトル:サブストレートライクPCB(SLP)の世界市場予測(~2024年)
■ 英文:Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024
■ 発行日:2019年1月11日
■ 調査会社:MarketsandMarkets
■ 商品コード:SE 6851
■ 調査対象地域:グローバル
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