【レポートの概要（一部）】
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
• 2.1 Preface
• 2.2 Preface
• 2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY TYPE
• Market segmentation by type
• Comparison by type
• Wafer-level manufacturing equipment – Market size and forecast 2018-2023
• Packaging and assembly equipment – Market size and forecast 2018-2023
• Automated test equipment – Market size and forecast 2018-2023
• Market opportunity by type
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 11: MARKET TRENDS
• Advances in wafer size
• Growing demand for 14-nm/16-nm FinFET technology
• Increased need for semiconductor memory devices
PART 12: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 13: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Applied Materials
• ASML
• Hitachi High-Technologies
• LAM RESEARCH
• Tokyo Electron
PART 14: APPENDIX
• Research methodology
• List of abbreviations
PART 15: EXPLORE TECHNAVIO
Exhibit 01: Years in consideration
Exhibit 02: Global semiconductor capital spending market
Exhibit 03: Segments of global semiconductor capital spending market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Market definition – Inclusions and exclusions checklist
Exhibit 07: Market size 2018
Exhibit 08: Global market: Size and forecast 2018-2023 ($ billions)
Exhibit 09: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 10: Five forces analysis 2018
Exhibit 11: Five forces analysis 2023
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition – Five forces 2018
Exhibit 18: Type – Market share 2018-2023 (%)
Exhibit 19: Comparison by type
Exhibit 20: Wafer-level manufacturing equipment – Market size and forecast 2018-2023 ($ billions)
Exhibit 21: Wafer-level manufacturing equipment – Year-over-year growth 2019-2023 (%)
Exhibit 22: Packaging and assembly equipment – Market size and forecast 2018-2023 ($ billions)
Exhibit 23: Packaging and assembly equipment – Year-over-year growth 2019-2023 (%)
Exhibit 24: Automated test equipment – Market size and forecast 2018-2023 ($ billions)
Exhibit 25: Automated test equipment – Year-over-year growth 2019-2023 (%)
Exhibit 26: Market opportunity by type
Exhibit 27: Customer landscape
Exhibit 28: Market share by geography 2018-2023 (%)
Exhibit 29: Geographic comparison
Exhibit 30: APAC – Market size and forecast 2018-2023 ($ billions)
Exhibit 31: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 32: Americas – Market size and forecast 2018-2023 ($ billions)
Exhibit 33: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 34: EMEA – Market size and forecast 2018-2023 ($ billions)
Exhibit 35: Foundries in EMEA
Exhibit 36: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 37: Key leading countries
Exhibit 38: Market opportunity
Exhibit 39: Decision framework
Exhibit 40: Impact of drivers and challenges
Exhibit 41: Timeline of changes in semiconductor wafer sizes
Exhibit 42: Vendor landscape
Exhibit 43: Landscape disruption
Exhibit 44: Vendors covered
Exhibit 45: Vendor_analysis1
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Applied Materials – Vendor overview
Exhibit 49: Applied Materials – Business segments
Exhibit 50: Applied Materials – Organizational developments
Exhibit 51: Applied Materials – Geographic focus
Exhibit 52: Applied Materials – Segment focus
Exhibit 53: Applied Materials – Key offerings
Exhibit 54: ASML – Vendor overview
Exhibit 55: ASML – Organizational developments
Exhibit 56: ASML – Geographic focus
Exhibit 57: ASML – Key offerings
Exhibit 58: Hitachi High-Technologies – Vendor overview
Exhibit 59: Hitachi High-Technologies – Business segments
Exhibit 60: Hitachi High-Technologies – Organizational developments
Exhibit 61: Hitachi High-Technologies – Geographic focus
Exhibit 62: Hitachi High-Technologies – Segment focus
Exhibit 63: Hitachi High-Technologies – Key offerings
Exhibit 64: LAM RESEARCH – Vendor overview
Exhibit 65: LAM RESEARCH – Geographic focus
Exhibit 66: LAM RESEARCH – Key offerings
Exhibit 67: Tokyo Electron – Vendor overview
Exhibit 68: Tokyo Electron – Business segments
Exhibit 69: Tokyo Electron – Organizational developments
Exhibit 70: Tokyo Electron – Geographic focus
Exhibit 71: Tokyo Electron – Segment focus
Exhibit 72: Tokyo Electron – Key offerings
Exhibit 73: Research framework
Exhibit 74: Validation techniques employed for market sizing
Exhibit 75: Information sources
Exhibit 76: List of abbreviations
【レポート販売概要】
■ タイトル：半導体資本設備の世界市場2019-2023■ 英文：Global Semiconductor Capital Equipment Market 2019-2023
■ 発行日：2018年11月20日
■ 調査会社：Technavio
■ 商品コード：IRTNTR30316
■ 調査対象地域：グローバル、アジア、北米、ヨーロッパ（EMEA）
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