【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market overview
• Segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Technology overview
• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Evolution of semiconductor packaging industry
• Eco-system of semiconductor IC packaging industry
PART 06: Market landscape
• Market overview
• Comparison between SoC, SiP, and chip-on-board (CoB)
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by application
• Communications sector
• Consumer electronics sector
• Computers sector
• Automotive sector
• Medical sector
PART 08: Market segmentation by interconnect technology
• Wire bond packaging
• Flip-chip packaging
PART 09: Market segmentation by end-user
• Foundries
• IDMs
PART 10: Geographical segmentation
• APAC
• Americas
• EMEA
PART 11: Market drivers
• Need to control rising costs
• Emergence of advanced and compact consumer electronic devices
• Rise in number of fabs
• Increasing number of IoT devices
• Design complexities in SoC
PART 12: Impact of drivers
PART 13: Market challenges
• High inventory levels in supply chain
• Fluctuation of foreign exchange rates
• High investment market
PART 14: Impact of drivers and challenges
PART 15: Market trends
• Growth of OSAT vendors
• Emergence of FOWLP technology
• Automation in automobiles
PART 16: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors
PART 17: Appendix
• List of abbreviations
PART 18: Explore Technavio
[List of Exhibits]
Exhibit 01: Global SiP market segmentation
Exhibit 02: List of countries in key geographies
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Back-end chip formation steps
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters
Exhibit 12: Global SiP market 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Percentage share of SiP usage in applications (2015-2020)
Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions)
Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions)
Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions)
Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions)
Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions)
Exhibit 20: Expected automotive shipment forecast y-o-y (%)
Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions)
Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share)
Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions)
Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions)
Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions)
Exhibit 26: Global SiP market by end-user 2015-2020 (% share)
Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions)
Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions)
Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions)
Exhibit 30: Global SiP market by geography 2015-2020 (% share)
Exhibit 31: Global SiP market by geography 2015-2020 (% share)
Exhibit 32: SiP market in APAC 2015-2020 ($ billions)
Exhibit 33: SiP market in Americas 2015-2020 ($ billions)
Exhibit 34: SiP market in EMEA 2015-2020 ($ billions)
Exhibit 35: Impact of drivers
Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 37: Impact of drivers and challenges
Exhibit 38: Other vendors in global SiP market
【レポート販売概要】
■ タイトル：システム・イン・パッケージ（SiP）の世界市場2016-2020■ 英文：Global System-in-Package Market 2016-2020
■ 発行日：2016年10月19日
■ 調査会社：Technavio
■ 商品コード：IRTNTR10639
■ 調査対象地域：グローバル
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