【レポートの概要（一部）】
Table of Contents
1 Introduction (Page No. – 21)
1.1 Key Objectives
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Research Methodology
1.5.1 Market Size Estimation
1.5.2 Market Crackdown &Data Triangulation
1.5.3 Key Points Taken From Secondary Sources
1.5.4 Key Points Taken From Primary Sources
1.5.5 List of Companies Covered During Study
1.6 Report Assumptions
2 Executive Summary (Page No. – 35)
3 Market Overview (Page No. – 39)
3.1 Introduction
3.2 History & Evolution of SIP
3.2.1 Soc (System on Chip)
3.2.2 Mcm (Multi Chip Module)
3.2.3 SIP (System in Package)
3.2.4 Soc Vs. SIP
3.3 Emerging Trends
3.3.1 System on Package (SOP)
3.3.2 Photonics Convergence for Interchip Interconnects
4 Market Analysis (Page No. – 49)
4.1 Introduction
4.2 System in Package (SIP) Industry Value Chain Analysis
4.3 Market Dynamics
4.3.1 Introduction
4.3.2 Market Drivers
4.3.2.1 Increasing Demand for Miniaturized & High Performance Electronic Devices
4.3.2.2 Strong Penetration in Consumer Electronics Sector to Drive the SIP Market
4.3.2.3 Faster Time-to-Market and Lower Development Costs Acts As An Attractive Prospect for the Electronic Manufacturers
4.3.3 Market Restraints
4.3.3.1 ‘Known Good Die’– Big Challenge for SIP (System in Package)
4.3.3.2 Reliability Challenges
4.3.4 Opportunity
4.3.4.1 Rapid Adoption of Smartphone & Tablets in Emerging Countries
4.4 Burning Issue
4.4.1 Lack of Industry Infrastructure
4.5 Winning Imperative
4.5.1 Need of thermal Management for Packaged Chips
4.6 Porter’s Five forces Model
4.6.1 Degree of Competition
4.6.2 Bargaining Power of Buyers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat From Substitutes
4.6.5 Threat From New Entrants
5 Global System in Package (SIP) Market Segmentation (Page No. – 69)
5.1 Introduction
5.2 System in Package (SIP) – By Packaging Technology
5.2.1 2D Ic Packaging Technology
5.2.2 2.5D Ic Packaging Technology
5.2.2.1 Major Benefits of 2.5D Ic Packaging Over the Traditional 2D Packaging Practices
5.2.3 3D Ic Packaging Technology
5.2.4 2D Vs. 2.5D Vs. 3D Ic Packaging Technology
5.3 System in Package (SIP) – By Packaging Type
5.3.1 Ball Grid Array
5.3.1.1 Pbga (Plastic Ball Grid Array)
5.3.1.2 Sbga (Super Ball Grid Array)
5.3.1.3 Fbga (Fine Pitch Ball Grid Array)
5.3.1.4 Fcbga (Flip Chip Ball Grid Array)
5.3.1.5 Others
5.3.2 Surface Mount Package
5.3.2.1 Lga (Land Grid Array)
5.3.2.2 Ccga (Ceramic Column Grid Array)
5.3.2.3 Others
5.3.3 Pin Grid Array (Pga)
5.3.3.1 Flip Chip Pin Grid Array (FCPGA)
5.3.3.2 Ceramic Pin Grid Array (CPGA)
5.3.3.3 Others
5.3.4 Flat Packages
5.3.4.1 Qfn (Quad Flat No-Leads)
5.3.4.2 Utqfn (Ultra Thin Quad Flat No-Leads)
5.3.4.3 Others
5.3.5 Small Outline Package
5.3.5.1 Tsop(Thin Small Outline Package)
5.3.5.2 Tssop (Thin Shrink Small Outline Package)
5.3.5.3 Others
5.4 System in Package (SIP) – By interconnection Technology
5.4.1 Wire Bond Technology
5.4.2 Flip Chip Technology
5.4.2.1 Advantages of Flip Chip Technology Over the Traditional Interconnection Technology:
5.4.3 Others
6 Market By Application (Page No. – 106)
6.1 Introduction
6.2 Consumer Electronics Sector
6.2.1 Smartphone & Tablets
6.2.2 Portable Media Players
6.2.3 Set-top Boxes & Digital Tvs
6.2.4 Dvd & Blu-Ray Players
6.2.5 Others
6.3 Communications Sector
6.3.1 Network Processors
6.3.2 Wireless Communication Equipment
6.3.3 Others
6.4 Automotive & Transportation Sector
6.4.1 Automotive Radar
6.4.2 Automotive Smart Sensors
6.4.3 Automotive Local Interconnect Network (LIN)
6.4.4 Others
6.5 Industrial Sector
6.5.1 Industrial Wireless Sensor Networks (IWSN)
6.5.2 Industrial Automation Devices
6.5.3 Others
6.6 Military, Defense & Aerospace (MDA) Sector
6.6.1 Radar Equipment
6.6.2 Satellite Communication Devices
6.6.3 Others
6.7 Medical Sector
6.7.1 Patient Monitoring Devices
6.7.2 Medical Smart Sensor System
6.7.3 Others
6.8 Emerging & Other Applications Sector
7 Market By Geography (Page No. – 146)
7.1 Introduction
7.2 North America
7.2.1 U.S.
7.2.2 Canada
7.3 APAC
7.3.1 Japan
7.3.2 Taiwan
7.3.3 China
7.3.4 Others
7.4 Europe
7.4.1 U.K.
7.4.2 Germany
7.4.3 France
7.4.4 Others
7.5 Rest of The World
7.5.1 Middle East
7.5.2 Russia
7.5.3 Others
8 Competitive Landscape (Page No. – 172)
8.1 Overview
8.2 Competitive Analysis
8.2.1 Market Share Ranking Analysis
8.3 Competitive Situation &Trends
8.3.1 New Product Launch, New Product Development&Expansion
8.3.2 Agreements, Partnerships, Joint Ventures, & Collaborations
8.3.3 Mergers &Acquisitions
8.3.4 Other Developments
9 Company Profiles (Overview, Products and Services, Financials, Strategy & Development)* (Page No. – 191)
9.1 Amkor Technology Inc.
9.2 ASE Inc.
9.3 Chipmos Tech. Inc.
9.4 Chipbond Technology Corporation
9.5 Fujitsu Ltd.
9.6 GS Nanotech
9.7 Insight SIP
9.8 Jiangsu Changjiang Electronics Technology Co. Ltd.
9.9 Nanium S.A.
9.10 Powertech Technologies Inc.
9.11 Qualcomm Incorporated
9.12 Siliconware Precision Industries Co., Ltd.
9.13 Stats Chippac Ltd.
9.14 Toshiba Corporation
9.15 WI2WI Corporation
*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Capturedin Case of Unlisted Companies.
【レポート販売概要】
■ タイトル：システム・イン・パッケージ(SIP)のグローバル市場（2014 – 2020）■ 英文：System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020
■ 発行日：2014年4月
■ 調査会社：MarketsandMarkets
■ 商品コード：Markets-SE-2384
■ 調査対象地域：グローバル
- 世界の綿実市場：製品別、地域別Global Cottonseed Market: About this market Technavio’s cottonseed market analysis considers sales from upland cottonseed, extra-long-staple cottonseed, and other products. Our study also finds the sales of cottonseed in APAC, Europe, MEA, North America, and South America. In 2018, the upland cottonseed segment had a significant market share, and this trend is expected to continue over the forecas …
- 通信用プロセッサの世界市場2015-2019About Communication Processor Communication processors are used in embedded systems, such as data or voice switches, routers, and wireless base stations, and enhance the functionalities of general-purpose processors. In 2014, the market was dominated by the telecommunication segment. Technavio’s analysts forecast that the global communication processors market will grow at a CAGR of 4.86%, by reve …
- 農業用活性剤アジュバントの世界市場：界面活性剤、オイルアジュバント、アンモニウム肥料The global agricultural activator adjuvants market is estimated to witness a CAGR of 5.9% during the forecast period, 2014 to 2019. The North American region dominated the global agricultural activator adjuvants market in 2014, followed by Europe. The North American and the European regions are technologically advanced regions. As such, the remarkable growth and research in both biotechnological a …
- 運用支援システム(OSS)/事業支援システム(BSS)ソフトウェアの世界市場About OSS/BSS OSS is a software application that supports back-office activities of a telecom network and maintains customer service. It comprises specialized software that assists telecom companies in network operations and management, service management, and provisioning services. BSS is a software application that supports activities such as customer relationship management (CRM), order managem …
- 神経性過食症：グローバル臨床試験レビュー（2014年上半期）Bulimia Nervosa Global Clinical Trials Review, H1, 2014 Summary GlobalData's clinical trial report, “Bulimia Nervosa Global Clinical Trials Review, H1, 2014" provides data on the Bulimia Nervosa clinical trial scenario. This report provides elemental information and data relating to the clinical trials on Bulimia Nervosa. It includes an overview of the trial numbers and their recruitment status as …
- 2G/3G/4G無線ネットワークインフラ市場2012-2017（The 2G, 3G & 4G Wireless Network Infrastructure Market: 2012～2017）The wireless network infrastructure market is currently in a phase of transition as mobile network operators seek to address increasing mobile traffic demands amidst global economic uncertainties. This paradigm shift is bringing new challenges and opportunities to infrastructure vendors. In 2011, global 2G , 3G and 4G wireless infrastructure revenues stood at $45.9 billion. Signals and Systems Tel …
- 自動車用ポンプの世界市場予測（～2027年）“High focus of automakers to introduce fuel-efficient vehicles coupled with stringent emission norms in several countries are anticipated to trigger the demand for automotive pumps.” The global automotive pump market is estimated to grow from USD 16.3 billion in 2019 to USD 26.5 billion by 2027, at a CAGR of 6.3%. Major vehicle manufacturers across the globe are focusing on introducing fuel-effici …
- 世界の製薬ビジネス・コンフィデンス・レポート（2013年4Q）Why was the report written? This report is the result of an extensive survey drawn from Kable’s exclusive panel of leading global pharmaceutical industry executives. The report analyzes current economic conditions prevailing across the globe and their impact on the pharmaceutical industry, and forecasts company and industry growth prospects over the next six months. Furthermore, it also provides i …
- 世界のジオテキスタイル（地盤用シート）市場Geotextiles market is a major category within the global geosynthetics industry. It is the most dominating market within geosynthetics with a healthy market growth. The geotextiles market report gives a holistic view about the geotextiles industry while covering diverse market segments which include product types, applications, and materials. There has been a drastic usage of geotextiles in civil …
- Home Automation: Solutions and Suppliers 2010Home Automation is the automatic control of a home's electronic systems, such as security, heating and air conditioning, entertainment, and lighting. A home automation system is one in which these systems are integrated into one, easy-to-use system. The purpose of a home automation system is to enable residents to perform normal daily tasks in a simpler manner. A home automation system will use sc …
- デルタロボットの世界市場2019-2023About this market Advanced software and control systems to improve performance to drive market growth. In the case of industrial robots, the control system is programmed to ensure that the devices' movements and performance to suit the end-user’s needs. End-users or system integrators write the robot programs. Vendors ensure that the necessary development in robots includes features that make prog …
- 放射線検知機械市場21st century civilization will rely more and more on effectively harnessing and developing the technologies that ionizing radiation has to offer. Even if weapons and power plants went away in the next 100 years, humanity would still rely on ionizing radiation to diagnose and treat disease, deliver safe food, and seek out carbon based energy sources. Sensors would still be employed in transportatio …
- 世界の農地整地機械および稲作機械市場（～2019）The expansion of the global soil preparation and cultivation machine industry is forecast to reach 2.2% p.a. in the coming years. Between 2008 and 2014 the market increased with an average annual growth of 6.3%. Currently, cultivators, weeders, hoes and scarifiers account for 17.1% of the global demand while the remaining market share is divided between disc harrows (3.7%), fertilizer distributors …
- 世界の電気集じん器市場2015The Global Electrostatic Precipitator Industry Report 2015 is a professional and in-depth study on the current state of the Electrostatic Precipitator industry. The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure.The Electrostatic Precipitator market analysis is provided for the international markets including devel …
- ICT予算及び人員配置動向：政府部門 – 企業のICT投資計画Why was the report written? In order to provide a depth of insight into ICT vendors’ and service providers’ potential customers. What is the current market landscape and what is changing? Government institutions have been investing a considerable percentage of their total ICT budgets in hardware, software, and IT services in 2012 and 2013. Although investment in software is dominated by spending o …
