【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Market overview
• Definitions
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
• Standards
• Go-to-market approach using COM: The OEM’s perspective
PART 05: Market landscape
• Market overview
• Market size and forecast by shipment
• Market size and forecast by revenue
• Five forces analysis
PART 06: Market segmentation by application
• COM for industrial automation segment
• COM for medical segment
• COM for transportation segment
• COM for gaming segment
• COM for communication segment
• COM for others segment
PART 07: Market segmentation by standard
• COM for COM Express segment
• COM for SMARC segment
• COM for Qseven segment
• COM for ETX segment
• COM for other standards segment
PART 08: Geographical segmentation
• COM market in EMEA
• COM market in Americas
• COM market in APAC
PART 09: Market drivers
• Increased demand for fast product development
• Longevity and reliability of COMs
• Multichannel retailing
PART 10: Impact of drivers
PART 11: Market challenges
• Failure in forecasting market demand
• High lead time
• High risk factors
PART 12: Impact of drivers and challenges
PART 13: Market trends
• Advances in transistor technology
• Emergence of IoT
• Growing market for small SWaP designs
PART 14: Vendor landscape
• Competitive scenario
• Pricing for COMs
• TCO of developing COMs in-house
• Sector independence
• Congatec
• Kontron
• MSC Technologies
• Other prominent vendors
PART 15: Appendix
• List of abbreviations
PART 16: Explore Technavio
[List of Exhibits]
Exhibit 01: Product offerings
Exhibit 02: COM standards
Exhibit 03: COM market landscape
Exhibit 04: Global COM market 2015-2020 (millions of units)
Exhibit 05: Global COM market 2015-2020 ($ billions)
Exhibit 06: Five forces analysis
Exhibit 07: Segmentation of global COM market by application 2015
Exhibit 08: Global COM market by standard 2015
Exhibit 09: Different form factors of COM Express
Exhibit 10: SMARC module summary
Exhibit 11: Pinout configuration for different standards
Exhibit 12: Qseven: Minimum and maximum required configurations of the feature set
Exhibit 13: Qseven revision history
Exhibit 14: Global COM market by standard 2020
Exhibit 15: Global COM market by geography 2015
Exhibit 16: Global COM market by geography 2015
Exhibit 17: Impact of drivers
Exhibit 18: Product revenue ($ millions) and growth rate (%) for Congatec
Exhibit 19: Lead time resulting in lower revenue conversion and more backlog
Exhibit 20: List of microprocessor manufacturers
Exhibit 21: Impact of drivers and challenges
Exhibit 22: Intel’s tri-gate manufacturing roadmap
Exhibit 23: Comparison of 14 nm technology with traditional technology
Exhibit 24: Normalized cost of transistor on per unit basis (nm)
Exhibit 25: Global connected device market by product shipment 2015-2020 (millions of units)
Exhibit 26: Kontron: Market potential 2014 ($ millions)
Exhibit 27: Tentative pricing list of COM cards ($)
Exhibit 28: Comparative break-even calculation for the sale of 2,000 and 3,000 units of COMs
Exhibit 29: Impact of Kontron-Ennoconn partnership on Kontron’s business strategies
【レポート販売概要】
■ タイトル：コンピュータオンモジュール（COM）の世界市場2016-2020■ 英文：Global Computer on Module Market 2016-2020
■ 発行日：2016年6月2日
■ 調査会社：Technavio
■ 商品コード：IRTNTR9588
■ 調査対象地域：グローバル
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