【レポートの概要（一部）】
Table of Contents
1 INTRODUCTION
1.1 KEY-TAKE AWAY
1.2 REPORT DESCRIPTION
1.3 REPORT SCOPE
1.4 MARKET SEGMENTS COVERED
1.5 STAKEHOLDERS
1.6 REPORT ASSUMPTIONS
1.6.1 GENERAL ASSUMPTIONS
1.6.2 YEAR-WISE AND FORECAST ASSUMPTIONS
1.7 RESEARCH METHODOLOGY
1.7.1 MARKET SIZE
1.7.2 MARKET CRACK DOWN AND DATA TRIANGULATION
1.7.3 KEY POINTS TAKEN FROM THE SECONDARY SOURCES
1.7.4 KEY POINTS TAKEN FROM PRIMARY SOURCES
1.7.5 KEY COMPANIES COVERED DURING THE STUDY
2 EXECUTIVE SUMMARY
3 COVER STORY: PRIMARY RESEARCH INTERVIEWS
4 PREMIUM INSIGHTS
4.1 GEOGRAPHY LIFE-CYCLE OF POWER ELECTRONICS MARKET
4.1.1 FORECAST OF MARKET CONDITIONS FOR DIFFERENT REGIONS
4.2 GROWTH STRATEGY MATRIX (ANSOFF MATRIX)
4.2.1 MARKET DEVELOPMENT
4.2.1.1 U.K., and Russia can be the potential markets in the days to come
4.2.2 DIVERSIFICATION
4.2.2.1 Forward integration to be the smartest strategy for the wafer players
4.2.3 MARKET PENETRATION
4.2.3.1 Japan and china are the most flourishing geographies for the existing players as well as the new entrants
4.2.4 PRODUCT DEVELOPMENT
4.2.4.1 Product development in new markets would be the game changing strategy for existing as well as the new market entrants
4.3 SUPPLY & DEMAND-SIDE FACTOR ANALYSIS
4.4 MARKET INVESTMENT ANALYSIS
4.4.1 MAJOR BARRIERS FOR INVESTMENT IN GLOBAL POWER ELECTRONICS MARKET
4.4.2 MAJOR PRO-FACTORS FOR INVESTMENT IN GLOBAL POWER ELECTRONICS MARKET
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.1.1 POWER ELECTRONICS MARKET SEGMENTATION
5.1.2 GLOBAL MARKET OVERVIEW
5.2 HISTORY & EVOLUTION
5.3 TECHNOLOGY TRENDS
5.3.1 POWER ELECTRONICS MODULES
5.4 VALUE & SUPPLY CHAIN ANALYSIS
5.4.1 BUSINESS MODELS AND GLOBAL SCALING ANALYSIS
5.4.2 MATERIAL BASED PLAYERS
5.4.3 RESEARCH ORGANIZATIONS & UNIVERSITIES
5.4.4 TECHNOLOGY DEVELOPERS AND PATENT HOLDERS
5.4.5 DEVICE & PRODUCT DEVELOPERS
5.4.6 POWER ELECTRONICS SUPPLY CHAIN
6 MARKET ANALYSIS
6.1 INTRODUCTION
6.2 MARKET DYANMICS
6.2.1 MARKET DRIVERS
6.2.1.1 Impact analysis of the power electronics market drivers
6.2.1.2 Demand for multiple function portable devices to increase the use of power electronics
6.2.1.3 Flourishing supply chain
6.2.1.4 Innovations and developments by new smes and existing players
6.2.1.5 Renewable energy markets and smart grids to drive the demand of power electronics
6.2.1.6 Use of power electronics in applications such as hybrid electric vehicles to drive the market
6.2.1.7 Relatively less entry barriers
6.2.2 MARKET RESTRAINTS
6.2.2.1 Impact analysis of the power electronics market restraints
6.2.2.2 Economic uncertainty causes demand fluctuations for the power electronic industry
6.2.2.3 TRICT regulatory barriers in some regions of globe
6.2.3 MARKET OPPORTUNITIES
6.2.3.1 Impact analysis of the power electronics market opportunities
6.2.3.2 Growing opportunities in the automotive and power & energy sector
6.2.3.3 Power MOSFET and power IGBT will gain more attention in the near future
6.3 BURNING ISSUES
6.3.1 COMPLEX COST STRUCTURE OF THE GALLIUM NITRIDE WAFERS
6.3.2 BATTERY-LESS DEVICES
6.4 WINNING IMPERATIVES
6.4.1 THE EVOLUTION OF WBG SEMICONDUCTORS
6.5 INDUSTRY TRENDS
6.5.1 MARKET LIFE CYCLE ANALYSIS
6.6 PORTER’S ANALYSIS
6.6.1 THREAT FROM NEW ENTRANTS
6.6.2 THREAT FROM SUBSITUTES
6.6.3 BARGAINIG POWER OF SUPPLIER
6.6.4 BARGAINIG POWER OF BUYERS
6.6.5 DEGREE OF COMPETITION
7 POWER ELECTRONICS MARKET BY SUBSTRATE WAFER TECHNOLOGY
7.1 INTRODUCTION
7.2 HIGH END SOLUTION
7.2.1 GALLIUM NITRIDE
7.2.2 SILICON CARBIDE
7.2.3 OTHERS
7.3 MIDDLE END SOLUTION
7.3.1 SILICON CARBIDE
7.3.2 SILICON
7.3.3 OTHERS
7.4 LOW END SOLUTION
7.4.1 SILICON
7.4.2 SAPPHIRE
7.4.3 OTHERS
8 POWER ELECTRONICS MARKET BY DEVICES
8.1 INTRODUCTION
8.2 POWER IC
8.2.1 POWER MANAGEMENT IC
8.2.1.1 Voltage regulators
8.2.1.2 Drivers
8.2.1.3 Others
8.2.2 APPLICAIONS SPECIFIC IC’S
8.2.3 OTHERS
8.3 POWER MODULES
8.3.1 INTELIIGENT POWER MODULE (INVERTER IC)
8.3.1.1 Hybrid
8.3.1.2 Monolithic
8.3.2 POWER INTEGRATED MODULES (CONVERTER INVERTER BREAK)
8.3.2.1 MOSFET modules
8.3.2.1.1 Metal Oxide Semiconductor (MOSFET)
8.3.2.2 IGBT modules
8.3.2.3 Others
8.3.3 OTHERS
8.4 POWER DISCRETE
8.4.1 DIODES
8.4.2 TRANSISTORS
8.4.2.1 Bipolar Junction Transistor (BJT)
8.4.2.2 Integrated Gate Bipolar Junction Taransistor (IGBT)
8.4.2.3 Field Effect Transistor (FET)
8.4.2.4 Others
8.4.2.5 Thyristor (Silicon Controlled Rectifier)
8.4.2.5.1 Gate Turn Off Thyristor (GTO)
8.4.2.5.2 Integrated Gate Commutated Thyristor (IGCT)
8.4.2.5.3 Others
8.4.2.6 Others
9 POWER ELECTRONICS MARKET BY APPLICATION
9.1 INTRODUCTION
9.2 ICT SECTOR
9.2.1 SWITCHING SYSTEMS
9.2.2 WIRELESS APPLICATION
9.2.3 SATELLITE COMMUNICATION APPLICATION
9.2.4 RADAR APPLICATION
9.2.5 RF APPLICATION
9.2.6 OTHERS
9.3 CONSUMER ELECTRONICS SECTOR
9.3.1 INVERTER
9.3.2 LED
9.3.3 SMPS
9.3.4 OTHERS
9.4 POWER SECTOR
9.4.1 UPS
9.4.2 CONVERTER
9.4.2.1 AC to DC (Rectifier)
9.4.2.2 DC to AC (Inverter)
9.4.2.2.1 Single Phase Half Bridge Inverter
9.4.2.2.2 Single Phase Full Bridge Inverter
9.4.2.2.3 Three-Phase Voltage Source Inverter
9.4.2.3 DC to DC (DC-TO-DC Converter)
9.4.2.4 AC to AC (AC-TO-AC Converter)
9.4.2.4.1 AC Voltage Controller
9.4.2.4.2 Matrix converters and cyclo-converters
9.4.2.4.3 DC link converters
9.4.2.5 Hybrid Matrix Converter
9.4.3 OTHERS
9.4.4 CASE STUDY CONVERTEAM CHINA CO., LTD (CHINA)
9.4.5 CASE STUDY EVINCE TECHNOLOGY LTD (U.K)
9.5 INDUSTRIAL SECTOR
9.5.1 POINT-OF-LOAD CONVERSION
9.5.2 POWER MANAGEMENT FOR COMPUTERS, TELECOMMUNICATIONS, AND OTHERS
9.5.3 RENEWABLE ENERGY SYSTEMS
9.5.4 HVAC
9.5.5 RAIL TRANSPORTATION
9.5.6 MOTOR DRIVES
9.5.7 SMART GRID
9.5.8 OTHERS
9.5.9 CASE STUDY OF ALSTOM GRID (FRANCE)
9.5.10 CASE STUDY OF SIEMENS AG (GERMANY)
9.5.11 CASE STUDY OF EMERSON ELECTRIC CO., LTD (U.S)
9.6 AUTOMOTIVE
9.6.1 VEHICULAR POWER CONVERTER SYSTEMS
9.6.2 ELECTRIC VEHICLE CHARGING
9.6.3 OTHERS
9.7 AEROSPACE & DEFENSE SECTOR
9.7.1 MICROWAVE RADIATION APPLICATIONS
9.7.2 COMBAT VEHICLES
9.7.3 OTHERS
9.7.4 CASE STUDY OF ROLLS ROYCE, PLC (U.K)
9.8 OTHER SECTORS
9.8.1 MEDICAL SECTOR
9.8.2 OTHER SECTORS
10 POWER ELECTRONICS MARKET, BY GEOGRAPHY
10.1 INTRODUCTION
10.2 AMERICAS
10.2.1 NORTH AMERICA
10.2.2 SOUTH AMERICA
10.3 EUROPE
10.3.1 U.K.
10.3.2 GERMANY
10.3.3 OTHERS
10.4 APAC
10.4.1 JAPAN
10.4.2 CHINA
10.4.3 SOUTH KOREA
10.4.4 OTHERS
10.5 ROW
11 COMPETITIVE LANDSCAPE
11.1 INTRODUCTION
11.2 MARKET SHARE ANALYSIS
11.2.1 MARKET RANKING OF ELITE PLAYERS FOR OVERALL SEMICONDUCTOR INDUSTRY
11.2.2 MARKET RANKING OF ELITE PLAYERS FOR POWER ELECTRONICS MARKET
11.2.3 MARKET SHARE ANALYSIS OF POWER ELECTRONICS MARKET ON THE BASIS OF IC WAFER CAPACITY
11.2.4 KEY GROWTH STRATEGIES
11.3 COMPETITIVE DEVELOPMENTS ACROSS THE POWER ELECTRONICS INDUSTRY
11.3.1 NEW PRODUCT DEVELOPMENTS
11.3.2 ACQUISITIONS, COLLABORATIONS AND EXPANSIONS
11.3.3 AGREEMENTS, CONTRACTS, AWARDS AND OTHER MAJOR DEVELOPMENTS
12 COMPANY PROFILES
(Company Snapshot, Products & Services, Developments, SWOT analysis & MnM View)*
12.1 RENESAS ELECTRONICS CORPORATION
12.2 ABB LTD
12.3 ALSTOM
12.4 MICROSEMI CORPORATION
12.5 FREESCALE SEMICONDUCTOR, INC.
12.6 TAIWAN SEMICONDUCTORS MANUFACTURING COMPANY LIMITED (TSMC)
12.7 TEXAS INSTRUMENTS, INC.
12.8 STMICROELECTRONICS NV
12.9 ROCKWELL AUTOMATION, INC.
12.1 VISHAY INTERTECHNOLOGY INC.
12.11 FAIRCHILD SEMICONDUCTOR INTERNATIONAL, INC.
12.12 NXP SEMICONDUCTORS N.V.
12.13 GAN SYSTEMS, INC
12.14 SOLICORE, INC
*Details on Company Snapshot, Products & Services, Developments, SWOT analysis & MnM View might not be captured in case of unlisted companies.
【レポート販売概要】
■ タイトル：パワー エレクトロニクス（電源IC、モジュール、ディスクリート）のグローバル市場（2014 – 2020）■ 英文：Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis & Forecast to 2014 - 2020
■ 発行日：2014年5月
■ 調査会社：MarketsandMarkets
■ 商品コード：Markets-SE-2434
■ 調査対象地域：グローバル
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