ウェーハ裏面研削テープの世界市場:UV硬化性、非UV...市場調査レポートについてご紹介

【英文タイトル】Wafer Backgrinding Tape Market by Type (UV Curable and Non-UV) and Wafer Size (6 Inch, 8 Inch, 12 Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2019-2026

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【レポートの概要(一部)】

CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. Porter’s five forces analysis
3.4. Market share analysis (2018)
3.5. Market dynamics

3.5.1. Drivers

3.5.1.1. Increase in demand for ultra-thin wafers
3.5.1.2. Rise in need for wafer fabrication
3.5.1.3. Increase in focus toward wafer surface protection during grinding process
3.5.1.4. Growth in the semiconductor industry

3.5.2. Restraint

3.5.2.1. Increase in cost of wafer manufacturing

3.5.3. Opportunities

3.5.3.1. Increase in investment in wafer fabrication equipment and materials

3.6. Wafer manufacturing overview
3.7. Wafer fabrication

3.7.1. Types of wafer fabrication process

3.7.1.1. Front-end process
3.7.1.2. Back-end process

3.7.2. Processes involved during wafer fabrication

3.7.2.1. Oxidation
3.7.2.2. Lithography
3.7.2.3. Deposition
3.7.2.4. Etching
3.7.2.5. Chemical Mechanical Planarization
3.7.2.6. Ion implementation
3.7.2.7. Assembly and testing
3.7.2.8. Diffusion

3.7.3. Wafer grinding process (wafer thinning)
3.7.4. Type of wafer thinning

3.7.4.1. Conventional grinding
3.7.4.2. CMP

3.7.5. Machines and components required during wafer backgrinding

3.8. Backgrinding tapes customer applications and usage

3.8.1. Customer applications of backgrinding tape
3.8.2. Usage of backgrinding tape

3.9. Technology trends

3.9.1. Materials used in tapes
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines

CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE

4.1. Overview
4.2. UV Curable

4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country

4.3. Non-UV

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country

CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE

5.1. Overview
5.2. 6-Inch

5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country

5.3. 8-Inch

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country

5.4. 12-Inch

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country

5.5. Others

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country

CHAPTER 6: WAFER BACKGRINDING TAPE MARKET, BY REGION

6.1. Overview
6.2. North America

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by type
6.2.3. Market size and forecast, by wafer size
6.2.4. Market analysis, by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by type
6.2.4.1.2. Market size and forecast, by wafer size

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by type
6.2.4.2.2. Market size and forecast, by wafer size

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by type
6.2.4.3.2. Market size and forecast, by wafer size

6.3. Europe

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by type
6.3.3. Market size and forecast, by wafer size
6.3.4. Market analysis, by country

6.3.4.1. U.K.

6.3.4.1.1. Market size and forecast, by type
6.3.4.1.2. Market size and forecast, by wafer size

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by type
6.3.4.2.2. Market size and forecast, by wafer size

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by type
6.3.4.3.2. Market size and forecast, by wafer size

6.3.4.4. Russia

6.3.4.4.1. Market size and forecast, by type
6.3.4.4.2. Market size and forecast, by wafer size

6.3.4.5. Rest of Europe

6.3.4.5.1. Market size and forecast, by type
6.3.4.5.2. Market size and forecast, by wafer size

6.4. Asia-Pacific

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by type
6.4.3. Market size and forecast, by wafer size
6.4.4. Market analysis, by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by type
6.4.4.1.2. Market size and forecast, by wafer size

6.4.4.2. Japan

6.4.4.2.1. Market size and forecast, by type
6.4.4.2.2. Market size and forecast, by wafer size

6.4.4.3. Taiwan

6.4.4.3.1. Market size and forecast, by type
6.4.4.3.2. Market size and forecast, by wafer size

6.4.4.4. South Korea

6.4.4.4.1. Market size and forecast, by type
6.4.4.4.2. Market size and forecast, by wafer size

6.4.4.5. Rest of Asia-Pacific

6.4.4.5.1. Market size and forecast, by type
6.4.4.5.2. Market size and forecast, by wafer size

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by type
6.5.3. Market size and forecast, by wafer size
6.5.4. Market analysis, by country

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by type
6.5.4.1.2. Market size and forecast, by wafer size

6.5.4.2. Middle East & Africa

6.5.4.2.1. Market size and forecast, by type
6.5.4.2.2. Market size and forecast, by wafer size

CHAPTER 7: COMPANY PROFILES

7.1. AI TECHNOLOGY, INC.

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Product portfolio

7.2. AMC CO., LTD

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio

7.3. DENKA COMPANY LIMITED

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance

7.4. FURUKAWA ELECTRIC CO., LTD.

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments

7.5. FORCE-ONE APPLIED MATERIALS

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio

7.6. LINTEC OF AMERICA, INC (LINTEC CORPORATION)

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments

7.7. MITSUI CHEMICALS, INC.

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance

7.8. NITTO DENKO CORPORATION

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance

7.9. PANTECH TAPE CO., LTD.

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Product portfolio

7.10. MINITRON ELEKTRONIK GMBH

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio


【レポート販売概要】

■ タイトル:ウェーハ裏面研削テープの世界市場:UV硬化性、非UV
■ 英文:Wafer Backgrinding Tape Market by Type (UV Curable and Non-UV) and Wafer Size (6 Inch, 8 Inch, 12 Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2019-2026
■ 発行日:2019年7月
■ 調査会社:Allied Market Research
■ 商品コード:AMR9NV087
■ 調査対象地域:グローバル
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