フリップチップ技術の世界市場:銅ピラー、鉛フリー、スズ・鉛共晶はんだ、金・スタッド+メッキはんだ...市場調査レポートについてご紹介

【英文タイトル】Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼マーケットレポート

【レポートの概要(一部)】

1 Introduction (Page No. – 15)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Market Stakeholders

2 Research Methodology (Page No. – 18)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.2.3 Market Share Estimation
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions
2.4.1 Assumptions

3 Executive Summary (Page No. – 27)

4 Premium Insights (Page No. – 32)
4.1 Attractive Opportunities in the Global Flip Chip Technology Market
4.2 Flip Chip Technology Market Size, By Packaging Type, 2016–2022
4.3 Flip Chip Technology Market Size, By Wafer Bumping Process, 2016–2022
4.4 Flip Chip Technology Market Size, By Packaging Technology, 2016–2022
4.5 Flip Chip Technology Market Size, By Product, 2016–2022
4.6 Flip Chip Technology Market Size, By Application, 2016–2022
4.7 Flip Chip Technology Market Size, By Geography

5 Market Overview (Page No. – 36)
5.1 Introduction
5.2 Market Segmentation
5.2.1 Flip Chip Technology Market, By Wafer Bumping Process
5.2.2 Flip Chip Technology Market, By Packaging Technology
5.2.3 Flip Chip Technology Market, By Packaging Type
5.2.4 Flip Chip Technology Market, By Product
5.2.5 Flip Chip Technology Market, By Application
5.2.6 Geographic Analysis
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Increasing Demand for Miniaturization and High-Performing Electronic Devices
5.3.1.2 Penetration in the Consumer Electronics Sub Segment
5.3.2 Restraints
5.3.2.1 Reliability Challenges
5.3.3 Opportunities
5.3.3.1 Growth in the IC Industry
5.3.4 Challenges
5.3.4.1 High Cost Associated With Flip Chip Packaging Solutions

6 Industry Trends (Page No. – 43)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Porter’s Five Forces Analysis
6.3.1 Threat of New Entrants
6.3.2 Threat of Substitutes
6.3.3 Bargaining Power of Suppliers
6.3.4 Bargaining Power of Buyers
6.3.5 Intensity of Competitive Rivalry

7 Flip Chip Technology Market, By Wafer Bumping Process (Page No. – 54)
7.1 Introduction
7.2 Copper (CU) Pillar
7.2.1 Benefits of Copper Pillar Bumping Process Over Other Wafer Bumping Processes
7.3 Lead (PB)-Free
7.4 Tin-Lead (SN-PB) Eutectic Solder
7.5 Gold-Stud+ Plated Solder

8 Flip Chip Technology Market, By Packaging Technology (Page No. – 59)
8.1 Introduction
8.2 2D IC Packaging Technology
8.3 2.5D IC Packaging Technology
8.3.1 Major Benefits of 2.5D IC Packaging Over the Traditional 2D IC Packaging Technology
8.4 3D IC Packaging Technology
8.5 Comparison Between 2D, 2.5D, 3D IC Packaging Technology

9 Flip Chip Technology Market, By Packaging Type (Page No. – 67)
9.1 Introduction
9.2 FC BGA (Flip Chip Ball Grid Array)
9.3 FC PGA (Flip Chip Pin Grid Array)
9.4 FC LGA (Flip Chip Land Grid Array)
9.5 FC QFN (Flip Chip Quad Flat No-Lead)
9.6 FC SIP (Flip Chip System-In-Package)
9.7 FC CSP (Flip Chip-Chip-Scale Package)

10 Flip Chip Technology Market, By Product (Page No. – 74)
10.1 Introduction
10.2 Memory
10.3 Light-Emitting Diode (LED)
10.4 CMOS Image Sensor
10.5 RF, Analog, Mixed Signal, and Power IC
10.6 CPU
10.7 GPU
10.8 SOC

11 Flip Chip Technology Market, By Application (Page No. – 84)
11.1 Introduction
11.2 Consumer Electronics
11.2.1 Smartphones & Tablets
11.2.2 Laptops
11.2.3 Desktop PC
11.2.4 Set-Top Box/Hybrid Set Top Box
11.2.5 Game Stations
11.3 Telecommunications
11.3.1 Network Equipment
11.3.2 Base Stations
11.3.3 Servers
11.4 Automotive
11.4.1 ECU
11.4.2 Sensors
11.4.3 Power Modules
11.4.4 Others
11.5 Industrial
11.5.1 Industrial Wireless Sensor Network
11.5.2 Identification and Monitoring
11.5.3 Others
11.6 Medical Devices
11.6.1 Patient Monitoring Devices
11.6.2 Smart Sensor System
11.6.3 Others
11.7 Smart Technologies
11.7.1 Military & Aerospace
11.7.2 Radar Equipment
11.7.3 Satellite Communication Devices
11.7.4 Others

12 Geographic Analysis (Page No. – 101)
12.1 Introduction
12.2 Americas
12.2.1 North America
12.2.1.1 U.S.
12.2.1.2 Canada
12.2.1.3 Brazil
12.2.1.4 Argentina
12.2.1.5 Others
12.3 Europe
12.3.1 Germany
12.3.2 France
12.3.3 U.K.
12.3.4 Others
12.4 Asia-Pacific
12.4.1 China
12.4.2 Japan
12.4.3 Taiwan
12.4.4 South Korea
12.4.5 Others
12.5 Rest of the World (RoW)
12.5.1 Middle East & Africa
12.5.2 Russia

13 Competitive Landscape (Page No. – 118)
13.1 Introduction
13.2 Market Ranking Analysis, 2015
13.3 Competitive Situations and Trends
13.3.1 Collaborations
13.3.2 Acquisitions, Joint Ventures, and Agreements
13.3.3 Others

14 Company Profiles (Page No. – 123)
(Overview, Products and Services, Financials, Strategy & Development)*
14.1 Introduction
14.2 Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.)
14.3 Samsung Electronics Co., Ltd.
14.4 Intel Corp.
14.5 United Microelectronics Corp.
14.6 ASE Group
14.7 Amkor Technology
14.8 Siliconware Precision Industries Co., Ltd.
14.9 Powertech Technology, Inc.
14.10 Stats Chippac Ltd.
14.11 Jiangsu Changjiang Electronics Technology Co., Ltd

*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Captured in Case of Unlisted Companies.

15 Appendix (Page No. – 149)
15.1 Insights of Industry Experts
15.2 Discussion Guide
15.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
15.4 Introducing RT: Real-Time Market Intelligence
15.5 Available Customizations
15.6 Related Reports


【レポート販売概要】

■ タイトル:フリップチップ技術の世界市場:銅ピラー、鉛フリー、スズ・鉛共晶はんだ、金・スタッド+メッキはんだ
■ 英文:Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
■ 発行日:2016年4月4日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-SE-4203
■ 調査対象地域:グローバル
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