【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Market overview
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
• PEST analysis
PART 04: Introduction
• Key market highlights
• Market perspective
PART 05: Technology landscape
• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Roadmap of the semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
• Consumer perspective
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by type
• Market overview
• Market size and forecast
PART 08: Geographical segmentation
• Market overview
• Global semiconductor packaging and assembly equipment market in APAC
• Global semiconductor packaging and assembly equipment market in North America
• Global semiconductor packaging and assembly equipment market in Europe
PART 09: Market drivers and their impact
• Rising demand for polymer adhesive wafer bonding equipment
• Growing application of semiconductor ICs in the IoT
• Growing demand for semiconductor ICs
• Increasing complexity of semiconductor IC designs
• Increasing miniaturization of electronic devices
PART 10: Market challenges
• Fluctuating foreign exchange rates
• Heavy investment required
• Cyclical nature of the semiconductor industry
PART 11: Impact of drivers and challenges
PART 12: Market trends
• Higher number of M&A
• Rapid technological changes in the semiconductor industry
• High adoption of semiconductor ICs in automobiles
PART 13: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors
PART 14: Key vendor analysis
• Applied Materials
• ASM Pacific Technology (ASMPT)
• Disco
• EV Group (EVG)
• Kulicke and Soffa Industries
• Tokyo Electron Ltd. (TEL)
• Tokyo Seimitsu
PART 15: Key suggestions for investors/vendors
PART 16: Appendix
• List of abbreviations
PART 17: Explore Technavio
[List of Exhibits]
Exhibit 01: Global semiconductor packaging and assembly equipment market segmentation
Exhibit 02: Product offerings
Exhibit 03: Steps in back-end chip formation
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Old supply chain of semiconductor IC packaging industry
Exhibit 07: New supply chain of semiconductor IC packaging industry
Exhibit 08: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 09: Five forces analysis
Exhibit 10: Global semiconductor packaging and assembly equipment market 2015
Exhibit 11: Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
Exhibit 12: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 13: Global semiconductor packaging and assembly equipment market 2015
Exhibit 14: Global semiconductor packaging and assembly equipment market in APAC ($ billions)
Exhibit 15: Global semiconductor packaging and assembly equipment market in North America ($ billions)
Exhibit 16: Global semiconductor packaging and assembly equipment market in Europe ($ millions)
Exhibit 17: Impact of drivers on key customer segments
Exhibit 18: Global MEMS market 2015-2020 ($ billions)
Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 20: Impact of drivers and challenges
Exhibit 21: Global NAND flash market 2015-2020 (% share)
Exhibit 22: Global car shipments 2015-2020 (shipment growth)
Exhibit 23: Applied Materials: Geographical segmentation by revenue 2014
Exhibit 24: ASMPT: Geographical segmentation by revenue 2014
Exhibit 25: Disco: Geographical segmentation by revenue 2014
Exhibit 26: Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
Exhibit 27: TEL: Geographical segmentation by revenue 2015
Exhibit 28: TEL: Business performance by revenue 2012-2015
Exhibit 29: Tokyo Seimitsu: Geographical segmentation by revenue 2014
Exhibit 30: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
【レポート販売概要】
■ タイトル：半導体パッケージング及び組立装置の世界市場2016-2020■ 英文：Global Semiconductor Packaging and Assembly Equipment Market 2016-2020
■ 発行日：2016年1月20日
■ 調査会社：Technavio
■ 商品コード：IRTNTR7971
■ 調査対象地域：グローバル
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