アメリカの半導体設備投資市場:ウエハ製造装置、ダイレベルパッケージング装置、自動検査装置、ウエハレベルパッケージング装置...市場調査レポートについてご紹介

【英文タイトル】Semiconductor Capital Spending Market in the US 2015-2019

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【レポートの概要(一部)】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Product offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by type
• Wafer fab equipment
• Die-level packaging and assembly equipment
• Automated test equipment
• Wafer-level packaging and assembly equipment

PART 07: Market Drivers

PART 08: Market drivers and their impacts

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 13: Key vendor analysis
• Global Foundries
• Intel
• Micron
• Samsung Electronics
• SK Hynix

PART 14: Key recommendations for vendors/investors

PART 15: Appendix
• List of abbreviation

PART 16: Explore Technavio

[List of Exhibits]

Exhibit 01: Semiconductor capital spending market in the US
Exhibit 02: Semiconductor capital spending market in the US ($ billions)
Exhibit 03: Five forces analysis
Exhibit 04: Semiconductor capital spending market in the US by type 2014-2019 (% share)
Exhibit 05: Capital spending in wafer fab equipment market($ billions)
Exhibit 06: Capital spending in die-level packaging and assembly equipment market 2014-2019 ($ billions)
Exhibit 07: Capital spending in automated test equipment market 2014-2019 ($ billions)
Exhibit 08: Capital spending in wafer-level packaging and assembly equipment market 2014-2019 ($ billions)
Exhibit 09: Impact of drivers
Exhibit 10: Impact of drivers and challenges
Exhibit 11: Global Foundries: Service offerings
Exhibit 12: Intel: Business segmentation 2014 by revenue
Exhibit 13: Intel: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 14: Micron: Business segmentation 2014: By revenue
Exhibit 15: Micron: Business segmentation by revenue 2013 and 2014 ($ billion)
Exhibit 16: Micron: Geographical segmentation by revenue 2014
Exhibit 17: Samsung Electronics: Business segmentation 2013
Exhibit 18: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billion)
Exhibit 19: Samsung Electronics: Geographical segmentation by revenue 2014
Exhibit 20: SK Hynix: Product segmentation 2014
Exhibit 21: SK Hynix: Product segmentation revenue by 2014 ($ billions)
Exhibit 22: SK Hynix: Geographical segmentation by revenue 2014


【レポート販売概要】

■ タイトル:アメリカの半導体設備投資市場:ウエハ製造装置、ダイレベルパッケージング装置、自動検査装置、ウエハレベルパッケージング装置
■ 英文:Semiconductor Capital Spending Market in the US 2015-2019
■ 発行日:2016年1月6日
■ 調査会社:Technavio
■ 商品コード:IRTNTR7795
■ 調査対象地域:米国
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