【レポートの概要（一部）】
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
• 2.1 Preface
• 2.2 Preface
• 2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY PRODUCT
• Market segmentation by product
• Comparison by product
• Smartphones – Market size and forecast 2018-2023
• Smart wearables – Market size and forecast 2018-2023
• POS terminals – Market size and forecast 2018-2023
• Others – Market size and forecast 2018-2023
• Market opportunity by product
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 09: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 10: MARKET TRENDS
• Increasing demand for smart parking
• Mobile phone OEMs coming up with MST technology
• Strategic alliances and partnerships
PART 11: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 12: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Broadcom
• NXP Semiconductors
• Qualcomm Technologies, Inc.
• STMicroelectronics
• Texas Instruments Incorporated
PART 13: APPENDIX
• Research methodology
• List of abbreviations
PART 14: EXPLORE TECHNAVIO
Exhibit 01: Global semiconductor market
Exhibit 02: Segments of global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2018
Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 09: Five forces analysis 2018
Exhibit 10: Five forces analysis 2023
Exhibit 11: Bargaining power of buyers
Exhibit 12: Bargaining power of suppliers
Exhibit 13: Threat of new entrants
Exhibit 14: Threat of substitutes
Exhibit 15: Threat of rivalry
Exhibit 16: Market condition – Five forces 2018
Exhibit 17: Product – Market share 2018-2023 (%)
Exhibit 18: Comparison by product
Exhibit 19: Smartphones – Market size and forecast 2018-2023 ($ millions)
Exhibit 20: Smartphones – Year-over-year growth 2019-2023 (%)
Exhibit 21: Smart wearables – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Smart wearables – Year-over-year growth 2019-2023 (%)
Exhibit 23: POS terminals – Market size and forecast 2018-2023 ($ millions)
Exhibit 24: POS terminals – Year-over-year growth 2019-2023 (%)
Exhibit 25: Others – Market size and forecast 2018-2023 ($ millions)
Exhibit 26: Others – Year-over-year growth 2019-2023 (%)
Exhibit 27: Market opportunity by product
Exhibit 28: Customer landscape
Exhibit 29: Market share by geography 2018-2023 (%)
Exhibit 30: Geographic comparison
Exhibit 31: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 32: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 33: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 34: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 35: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 36: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 37: Key leading countries
Exhibit 38: Market opportunity
Exhibit 39: NFC-enabled smartphones and respective smartphone OEMs
Exhibit 40: Impact of drivers and challenges
Exhibit 41: Vendor landscape
Exhibit 42: Landscape disruption
Exhibit 43: Vendors covered
Exhibit 44: Vendor classification
Exhibit 45: Market positioning of vendors
Exhibit 46: Broadcom – Vendor overview
Exhibit 47: Broadcom – Business segments
Exhibit 48: Broadcom – Organizational developments
Exhibit 49: Broadcom – Geographic focus
Exhibit 50: Broadcom – Segment focus
Exhibit 51: Broadcom – Key offerings
Exhibit 52: NXP Semiconductors – Vendor overview
Exhibit 53: NXP Semiconductors – Business segments
Exhibit 54: NXP Semiconductors – Organizational developments
Exhibit 55: NXP Semiconductors – Geographic focus
Exhibit 56: NXP Semiconductors – Segment focus
Exhibit 57: NXP Semiconductors – Key offerings
Exhibit 58: Qualcomm Technologies, Inc. – Vendor overview
Exhibit 59: Qualcomm Technologies, Inc. – Business segments
Exhibit 60: Qualcomm Technologies, Inc. – Organizational developments
Exhibit 61: Qualcomm Technologies, Inc. – Geographic focus
Exhibit 62: Qualcomm Technologies, Inc. – Segment focus
Exhibit 63: Qualcomm Technologies, Inc. – Key offerings
Exhibit 64: STMicroelectronics – Vendor overview
Exhibit 65: STMicroelectronics – Business segments
Exhibit 66: STMicroelectronics – Organizational developments
Exhibit 67: STMicroelectronics – Geographic focus
Exhibit 68: STMicroelectronics – Segment focus
Exhibit 69: STMicroelectronics – Key offerings
Exhibit 70: Texas Instruments Incorporated – Vendor overview
Exhibit 71: Texas Instruments Incorporated – Business segments
Exhibit 72: Texas Instruments Incorporated – Organizational developments
Exhibit 73: Texas Instruments Incorporated – Geographic focus
Exhibit 74: Texas Instruments Incorporated – Segment focus
Exhibit 75: Texas Instruments Incorporated – Key offerings
Exhibit 76: Validation techniques employed for market sizing
【レポート販売概要】
■ タイトル：近距離無線通信（NFC）チップの世界市場2019-2023■ 発行日：2019年3月27日
■ 調査会社：Technavio
■ 商品コード：IRTNTR31044
■ 調査対象地域：グローバル、アジア、北米、ヨーロッパ（EMEA）
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