密封包装の世界市場予測(~2022):構造別(多層セラミック、金属缶、プレスセラミックパッケージ)、種類別、需要先別、地域別...市場調査レポートについてご紹介

【英文タイトル】Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic–Metal and Glass–Metal Sealing), End-User Industry (Military & Defense and Aeronautics & Space), Geography - Global Forecast to 2022

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼マーケットレポート

【レポートの概要(一部)】

1 Introduction (Page No. – 14)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders

2 Research Methodology (Page No. – 18)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions

3 Executive Summary (Page No. – 26)

4 Premium Insights (Page No. – 30)
4.1 Opportunities in the Hermetic Packaging Market
4.2 Heremetic Packaging Market, By Country, 2016
4.3 Hermetic Packaging Market Analysis, By Configuration vs End-User Industry
4.4 Market, By Type
4.5 Market, By Application
4.6 Market, By Geography

5 Market Overview (Page No. – 34)
5.1 Introduction
5.2 Market Segmentation
5.2.1 Hermetic Packaging Market, By Configuration
5.2.2 Market, By Type
5.2.3 Market, By Application
5.2.4 Market, By End-User Industry
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Adoption of Hermetic Packaging for Protecting Highly Sensitive Electronic Components
5.3.1.2 Growing Demand From the End-User Industries Such as Automobile Electronics and Aeronautics & Space
5.3.2 Restraint
5.3.2.1 Stringent Military Standards for Hermetic Packaging
5.3.3 Opportunities
5.3.3.1 Increasing Adoption of Hermetic Packaging for Protection of the Electronic Implantable Medical Devices From Human Body Fluids
5.3.3.2 Rising Demand From Countries in APAC for Hermetically Packaged Components and ICS for Myriad Applications
5.3.4 Challenge
5.3.4.1 High Infrastructure Cost Incurred By Controlled and Regulated Packaging Environment

6 Industry Trends (Page No. – 41)
6.1 Introduction
6.2 Hermetic Packaging in the Food & Beverages Industry
6.2.1 Vacuum Packages
6.3 Hermetic Packaging in the Pharmaceutical Industry
6.4 Value Chain Analysis
6.5 Porter’s Five Forces Analysis: 2015
6.5.1 Threat of New Entrants
6.5.2 Threat of Substitutes
6.5.3 Bargaining Power of Buyers
6.5.4 Bargaining Power of Suppliers
6.5.5 Intensity of Competitive Rivalry

7 Hermetic Packaging Market, By Configuration (Page No. – 52)
7.1 Introduction
7.2 Multilayer Ceramic Packages
7.3 Pressed Ceramic Packages
7.4 Metal Can Packages

8 Hermetic Packaging Market, By Type (Page No. – 57)
8.1 Introduction
8.2 Passivation Glass
8.3 Reed Glass
8.4 Transponder Glass
8.5 Glass–Metal Sealing (GTMS)
8.6 Ceramic–Metal (CERTM) Sealing

9 Hermetic Packaging Market, By Application (Page No. – 64)
9.1 Introduction
9.2 Transistors
9.3 Sensors
9.4 Lasers
9.5 Photodiodes
9.6 Airbag Igniters
9.7 Oscillating Crystals
9.8 MEMS Switches
9.9 Others

10 Hermetic Packaging Market, By End-User Industry (Page No. – 73)
10.1 Introduction
10.2 Military & Defense
10.3 Aeronautics & Space
10.4 Automotive
10.4.1 Airbag Initiation
10.4.2 Battery Protection
10.4.2.1 Guidelines for Packaging and Shipping Batteries in the U.S.
10.4.3 Rfid Transponder Operation
10.5 Energy & Nuclear Safety
10.5.1 Electrical Penetration Control
10.5.2 Oil & Gas Applications
10.5.3 Fuel Cell Manufacturing
10.6 Medical
10.6.1 Dental Applications
10.6.2 Veterinary Applications
10.7 Telecommunications
10.8 Others

11 Package Closing Techniques for Hermetic Packaging (Page No. – 101)
11.1 Introduction
11.2 Welding
11.2.1 Electrical Resistance Welding
11.2.2 Electrode Welding Or Rolled Seam Welding
11.2.3 Laser Welding
11.2.4 Cold Welding
11.3 Crimp Connection
11.4 Soldering

12 Hermetic Packaging Market, By Geography (Page No. – 104)
12.1 Introduction
12.2 APAC
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 Taiwan
12.2.5 India
12.2.6 Rest of APAC
12.3 North America
12.3.1 U.S.
12.3.2 Canada
12.3.3 Mexico
12.4 Europe
12.4.1 Germany
12.4.2 France
12.4.3 Italy
12.4.4 U.K.
12.4.5 Spain
12.4.6 Rest of Europe
12.5 RoW
12.5.1 South America
12.5.2 Middle East and Africa

13 Competitive Landscape (Page No. – 118)
13.1 Overview
13.2 Market Ranking Analysis
13.3 Competitive Situation and Trends
13.3.1 New Product Launches
13.3.2 Acquisitions
13.3.3 Expansions
13.3.4 Contracts & Agreements
13.3.5 Partnerships

14 Company Profiles (Page No. – 126)
(Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments)*
14.1 Introduction
14.2 Schott AG
14.3 Ametek, Inc.
14.4 Amkor Technology
14.5 Texas Instruments Incorporated
14.6 Teledyne Microelectronics Technologies
14.7 Kyocera Corporation
14.8 Materion Corporation
14.9 Egide SA
14.10 Micross Components, Inc.
14.11 Legacy Technologies Inc.
14.12 Willow Technologies
14.13 SST International

*Details on Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments Might Not Be Captured in Case of Unlisted Companies.

15 Appendix (Page No. – 155)
15.1 Discussion Guide
15.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
15.3 Introducing RT: Real-Time Market Intelligence
15.4 Available Customizations
15.5 Related Reports
15.6 Author Details


【レポート販売概要】

■ タイトル:密封包装の世界市場予測(~2022):構造別(多層セラミック、金属缶、プレスセラミックパッケージ)、種類別、需要先別、地域別
■ 英文:Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic–Metal and Glass–Metal Sealing), End-User Industry (Military & Defense and Aeronautics & Space), Geography - Global Forecast to 2022
■ 発行日:2016年12月5日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-SE-4788
■ 調査対象地域:グローバル
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