【英文タイトル】Global Front End of the Line Semiconductor Equipment Market 2016-2020



PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Definition
• Source year and forecast period
• Product segmentation
• End-user segmentation
• Geographical segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Technology landscape of wafer fab equipment
• Wafer-level manufacturing equipment categories
• Key customers

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by product
• Market overview
• Market size and forecast

PART 08: Market segmentation by end-user
• Market overview
• Market size and forecast
• Foundry
• Memory

PART 09: Geographical segmentation
• Global FEOL semiconductor equipment market by geography
• Market size and forecast
• Americas

PART 10: Key leading countries
• Taiwan
• South Korea
• Japan

PART 11: Market drivers
• Increase in number of fabs worldwide
• Growth of advanced consumer electronics market
• Miniaturization of electronic devices
• Advent of 3D ICs

PART 12: Impact of drivers

PART 13: Market challenges
• High cost of equipment
• Long payback period
• Fluctuations in the semiconductor industry

PART 14: Impact of drivers and challenges

PART 15: Market trends
• Proliferation of automotive electronics
• Growing number of connected devices through IoT and other emerging markets
• Increasing investment in memory capacity
• Shorter replacement cycle of smart devices
• Adoption of FinFET architecture

PART 16: Vendor landscape
• Competitive scenario
• Other prominent vendors

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: List of major countries considered
Exhibit 02: Product offerings
Exhibit 03: Semiconductor production equipment
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Wafer-level manufacturing equipment categories
Exhibit 08: Requirements of a manufacturing equipment
Exhibit 09: Global FEOL semiconductor equipment market 2015-2020 ($ billions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FEOL semiconductor equipment market by product 2015-2020 (% share)
Exhibit 12: Global FEOL semiconductor equipment market by product 2015-2020 ($ billions)
Exhibit 13: Global FEOL semiconductor equipment market by end-user 2015-2020 (% share)
Exhibit 14: Global FEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
Exhibit 15: Global FEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
Exhibit 16: Global FEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
Exhibit 17: Global FEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
Exhibit 18: Global FEOL semiconductor equipment market by geography 2015-2020 (% share)
Exhibit 19: Global FEOL semiconductor equipment market by geography 2015-2020 ($ billions)
Exhibit 20: FEOL semiconductor equipment market in APAC 2015-2020 ($ billions)
Exhibit 21: Global wearables market 2015-2020 ($ billions)
Exhibit 22: FEOL semiconductor equipment market in Americas 2015-2020 ($ billions)
Exhibit 23: FEOL semiconductor equipment market in EMEA 2015-2020 ($ billions)
Exhibit 24: Global NAND flash market 2015-2020 (% share)
Exhibit 25: Consumer electronics market 2015-2020 (unit shipment in millions)
Exhibit 26: Global MEMS market 2015-2020
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 29: Impact of drivers and challenges
Exhibit 30: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 31: IoT spending and device penetration 2014, 2015, and 2020
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Key vendors
Exhibit 34: ASML customers by end-user segment
Exhibit 35: Other prominent vendors


■ タイトル:FEOL(フロントエンド)半導体装置の世界市場2016-2020
■ 英文:Global Front End of the Line Semiconductor Equipment Market 2016-2020
■ 発行日:2016年8月23日
■ 調査会社:Technavio
■ 商品コード:IRTNTR10319
■ 調査対象地域:グローバル
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