3D IC&2.5D ICパッケージングの世界市場予測(~2022):用途別、パッケージング技術別(3Dウエハレベルチップスケールパッケージ(WLCSP)、3D TSV、2.5D)、需要先別、地域別...市場調査レポートについてご紹介

【英文タイトル】3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼マーケットレポート

【レポートの概要(一部)】

1 Introduction (Page No. – 15)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders

2 Research Methodology (Page No. – 18)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 List of Major Secondary Sources
2.1.1.2 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Breakdown of Primaries
2.1.3 Secondary and Primary Research
2.1.3.1 Key Industry Insights
2.2 Market Size Estimation
2.3 Bottom-Up Approach
2.4 Approach for Capturing the Market Share By Bottom-Up Analysis (Demand Side)
2.5 Top-Down Approach
2.5.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
2.6 Market Breakdown and Data Triangulation
2.7 Research Assumptions

3 Executive Summary (Page No. – 29)

4 Premium Insights (Page No. – 34)
4.1 3D IC and 2.5D IC Packaging Market Opportunities
4.2 3D IC and 2.5D IC Packaging Market for Memory Application, By End-User Industry
4.3 Consumer Electronics 3D IC and 2.5D IC Packaging Market, By Packaging Technology
4.4 Geographic Snapshot of the 3D IC and 2.5D IC Packaging Market
4.5 3D IC and 2.5D IC Packaging Market in APAC, By Country

5 Market Overview (Page No. – 37)
5.1 Introduction
5.2 Market Segmentation
5.2.1 By Packaging Technology
5.2.2 By Application
5.2.3 By End-User Industry
5.2.4 By Region
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Increasing Need for Advanced Architecture in Electronic Products
5.3.1.2 Rising Trend of Miniaturization of Electronics Devices
5.3.1.3 Growing Market for Smartphones, Tablets, and Gaming Devices
5.3.2 Restraints
5.3.2.1 Higher Level of Integration Results in Thermal Issues
5.3.2.2 High Unit Cost of 3D IC and 2.5D IC Packages
5.3.3 Opportunities
5.3.3.1 Growing Adoption of High-End Computing, Servers, and Data Centers
5.3.4 Challenges
5.3.4.1 Effective Supply Chain Management

6 Industry Trends (Page No. – 45)
6.1 Introduction
6.2 Supply Chain Analysis
6.3 Technology Trends
6.4 Porter’s Five Forces Analysis
6.4.1 Threat of New Entrants
6.4.2 Threat 0f Substitutes
6.4.3 Bargaining Power of Buyers
6.4.4 Bargaining Power of Suppliers
6.4.5 Intensity of Competitive Rivalry

7 Market, By Packaging Technology (Page No. – 56)
7.1 Introduction
7.2 3D Wafer-Level Chip-Scale Packaging (WLCSP)
7.3 3D TSV
7.4 2.5D

8 Market, By Application (Page No. – 62)
8.1 Introduction
8.2 Logic
8.3 Imaging & Optoelectronics
8.4 Memory
8.5 MEMS/Sensors
8.6 LED
8.7 Power, Analog & Mixed Signal, RF, Photonics

9 Market, By End-User Industry (Page No. – 73)
9.1 Introduction
9.2 Consumer Electronics
9.3 Telecommunication
9.4 Industrial Sector
9.5 Automotive
9.6 Military & Aerospace
9.7 Smart Technologies
9.8 Medical Devices

10 Geographic Analysis (Page No. – 95)
10.1 Introduction
10.2 APAC
10.2.1 China
10.2.2 Japan
10.2.3 Taiwan
10.2.4 South Korea
10.2.5 Rest of APAC
10.3 North America
10.3.1 U.S.
10.3.2 Canada
10.3.3 Mexico
10.4 Europe
10.4.1 U.K.
10.4.2 Germany
10.4.3 France
10.4.4 Rest of Europe
10.5 Rest of the World
10.5.1 Middle East & Africa
10.5.2 South America

11 Competitive Landscape (Page No. – 132)
11.1 Overview
11.2 Key Players in the 3D IC and 2.5D IC Packaging Market
11.3 Competitive Situations and Trends
11.3.1 Partnerships, Agreements, Joint Ventures, and Collaborations
11.3.2 New Product Launches and Developments
11.3.3 Investments and Expansions
11.3.4 Acquisitions

12 Company Profiles (Page No. – 139)
12.1 Introduction
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
12.2 Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
12.3 Samsung Electronics Co., Ltd. (South Korea)
12.4 Toshiba Corp. (Japan)
12.5 ASE Group (Taiwan)
12.6 Amkor Technology (U.S.)
12.7 United Microelectronics Corp. (Taiwan)
12.8 Stmicroelectronics Nv (Switzerland).
12.9 Broadcom Ltd. (Singapore)
12.10 Intel Corporation. (U.S.)
12.11 Jiangsu Changjiang Electronics Technology Co., Ltd (China)

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. – 165)
13.1 Insights of Industry Experts
13.2 Questionnaire
13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
13.4 Introducing RT: Real Time Market Intelligence
13.5 Available Customizations
13.6 Related Report
13.7 Author Details


【レポート販売概要】

■ タイトル:3D IC&2.5D ICパッケージングの世界市場予測(~2022):用途別、パッケージング技術別(3Dウエハレベルチップスケールパッケージ(WLCSP)、3D TSV、2.5D)、需要先別、地域別
■ 英文:3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022
■ 発行日:2017年1月6日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-SE-4844
■ 調査対象地域:グローバル
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