耐放射線型エレクトロニクスの世界市場予測（～2022年）：パワーマネジメント、ASIC、ロジック、メモリ、FPGA...市場調査レポートについてご紹介

1 Introduction (Page No. – 14)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders

2 Research Methodology (Page No. – 17)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.3 Market Breakdown and Data Triangulation
2.4 Assumptions

3 Executive Summary (Page No. – 25)

4 Premium Insights (Page No. – 31)
4.1 Significant Market Opportunities in the Radiation-Hardened Electronics Market
4.2 Radiation-Hardened Electronics Market Analysis, By Component
4.3 Radiation-Hardened Electronics Market Analysis, By Application, 2015
4.4 Radiation-Hardened Electronics Market Analysis, By Manufacturing Technique, 2015
4.5 Radiation-Hardened Electronics Market Share, By Region

5 Market Overview (Page No. – 35)
5.1 Introduction
5.2 Evolution: Radiation-Hardened Electronics Market
5.3 Market Segmentation
5.3.1 By Component
5.3.2 By Manufacturing Technique
5.3.3 By Application
5.3.4 By Region
5.4 Market Dynamics
5.4.1 Drivers
5.4.1.1 Increased Global Intelligence, Surveillance, & Reconnaissance (ISR) Operations
5.4.1.2 Advancements in FPGA & Multicore Processor Technologies for Defense and Space Applications
5.4.1.3 Demand From the Communication Satellite Segment for Rad-Hard Electronics
5.4.2 Restraints
5.4.2.1 Difficulties in Creating Actual Testing Environment
5.4.2.2 High Costs of Development and Design
5.4.3 Opportunities
5.4.3.1 Research & Development Opportunities Around the Globe
5.4.3.2 Growing Requirements for Reconfigurable Rad-Hard Components
5.4.4 Challenges
5.4.4.1 Highly Customized Requirements of High-End Consumers

6 Industry Trends (Page No. – 42)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Porter’s Five Forces Analysis
6.3.1 Threat of New Entrants
6.3.2 Threat of Substitutes
6.3.3 Bargaining Power of Suppliers
6.3.4 Bargaining Power of Buyers
6.3.5 Intensity of Competitive Rivalry

7 Radiation-Hardened (Rad-Hard) Electronics Market, By Component (Page No. – 49)
7.1 Introduction
7.1.1 Power Management
7.1.1.1 LDO Linear Regulators
7.1.1.2 Mosfets & Diodes
7.1.2 Application-Specific Integrated Circuit (ASIC)
7.1.3 Memory
7.1.3.1 Dynamic Random-Access Memory (DRAM)
7.1.3.2 Static Random-Access Memory (SRAM)
7.1.3.3 Non-Volatile Memories (NVMS)
7.1.3.4 Others
7.1.4 Logic
7.1.5 Field-Programmable Gate Array (FPGA)

8 Radiation-Hardened Electronics Market, By Manufacturing Technique (Page No. – 89)
8.1 Introduction
8.2 Radiation Hardening By Design (RHBD)
8.3 Radiation Hardening By Process (RHBP)

9 Radiation-Hardened Electronics Market, By Application (Page No. – 93)
9.1 Introduction
9.2 Space (Satellites)
9.2.1 Commercial
9.2.2 Military
9.3 Aerospace & Defense
9.4 Nuclear Power Plants

10 Material Selection and Packaging Types in Radiation-Hardened Electronics Market (Page No. – 100)
10.1 Introduction
10.1.1 Material Selection
10.1.2 Silicon
10.1.3 Silicon Carbide (SiC)
10.1.4 Gallium Nitride (GaN)
10.2 Packaging Types
10.2.1 Flip-Chip
10.2.2 Ceramic Packages

11 Geographic Analysis (Page No. – 103)
11.1 Introduction
11.2 North America
11.2.1 U.S.
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Russia
11.3.2 Germany
11.3.3 U.K.
11.3.4 France
11.3.5 Rest of Europe (Scandinavia, Spain, Italy)
11.4 Asia-Pacific
11.4.1 China
11.4.2 India
11.4.3 Japan
11.4.4 South Korea
11.4.5 Rest of APAC (Australia, Srilanka & Singapore)
11.5 Rest of the World (RoW)
11.5.1 Middle East & Africa
11.5.2 Latin America

12 Competitive Landscape (Page No. – 120)
12.1 Overview
12.2 Market Ranking Analysis
12.3 Competitive Situation and Trends
12.3.1 New Product Launches
12.3.2 Collaboration ,Agreement, & Expansions, 2014–2016
12.3.3 Mergers & Acquisitions, 2014–2016

13 Company Profile (Page No. – 126)
13.1 Introduction
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
13.2 BAE Systems PLC
13.3 Honeywell Aerospace
13.4 Microsemi Corp.
13.5 Atmel Corp.
13.6 Xilinx, Inc.
13.7 Texas Instruments, Inc.
13.8 St Microelectronics NV
13.9 Maxwell Technologies, Inc.
13.10 Intersil Corporation
13.11 Linear Technology Corporation
*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.
13.12 Key Innovators in the Radiation-Hardened Electronics Market

14 Appendix (Page No. – 152)
14.1 Insights of Industry Experts
14.2 Discussion Guide
14.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
14.4 Introducing RT: Real-Time Market Intelligence
14.5 Available Customizations
14.6 Related Reports