【レポートの概要（一部）】
CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. RESEARCH METHODOLOGY
1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top investment pockets
3.2.2. Top winning strategies of customers of pin-fin heat sink
3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. KEY PLAYER POSITIONING
3.5. MARKET DYNAMICS
3.5.1. Drivers
3.5.1.1. Rise in need for effective cooling of the consumer electronics by proper heat dissipation method
3.5.1.2. Greater demand for pin fin heat sinks owing to its multiple advantages over other types of heat sinks
3.5.1.3. Rise in demand for power supply devices and usage of IGBTs
3.5.2. Restraints
3.5.2.1. Low capacity utilization of pin fin heat sink manufacturers
3.5.3. Opportunities
3.5.3.1. Emerging trend of increasing usage of IGBT modules in the automotive sector for HEVs
3.5.3.2. Use of hybrid pin fin heat sink
3.6. TECHNOLOGY LANDSCAPE
3.6.1. Pin Fin Technology
3.6.2. Various Pin Fin Manufacturing Techniques
3.6.2.1. Hot and Cold Forging
3.6.2.2. Metal Injection Molding
3.6.2.3. Additive Manufacturing
3.7. COMPETITIVE LANDSCAPE
CHAPTER 4: PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE
4.1. OVERVIEW
4.2. COPPER
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. ALUMINIUM
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: PIN FIN HEAT SINK FOR IGBT MARKET, BY REGION
5.1. OVERVIEW
5.2. NORTH AMERICA
5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast, by material type
5.2.3. Market size and forecast, by country
5.2.4. U.S.
5.2.4.1. Market size and forecast, by material type
5.2.5. Canada
5.2.5.1. Market size and forecast, by material type
5.2.6. Mexico
5.2.6.1. Market size and forecast, by material type
5.3. EUROPE
5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast, by material type
5.3.3. Market size and forecast, by country
5.3.4. UK
5.3.4.1. Market size and forecast, by material type
5.3.5. Germany
5.3.5.1. Market size and forecast, by material type
5.3.6. France
5.3.6.1. Market size and forecast, by material type
5.3.7. Italy
5.3.7.1. Market size and forecast, by material type
5.3.8. Rest of Europe
5.3.8.1. Market size and forecast, by material type
5.4. ASIA-PACIFIC
5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast, by material type
5.4.3. Market size and forecast, by country
5.4.4. China
5.4.4.1. Market size and forecast, by material type
5.4.5. India
5.4.5.1. Market size and forecast, by material type
5.4.6. Japan
5.4.6.1. Market size and forecast, by material type
5.4.7. Rest of Asia-Pacific
5.4.7.1. Market size and forecast, by material type
5.5. LAMEA
5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast, by material type
5.5.3. Market size and forecast, by country
5.5.4. Latin America
5.5.4.1. Market size and forecast, by material type
5.5.5. Middle East
5.5.5.1. Market size and forecast, by material type
5.5.6. Africa
5.5.6.1. Market size and forecast, by material type
CHAPTER 6: SUPPLIER/MANUFACTURER: COMPANY PROFILES
6.1. APEX MICROTECHNOLOGY (HEICO CORPORATION)
6.1.1. Company overview
6.1.2. Company snapshot
6.1.3. Operating business segments
6.1.4. Product portfolio
6.1.5. Business performance
6.2. AAVID THERMALLOY, LLC (BOYD CORPORATION)
6.2.1. Company overview
6.2.2. Company snapshot
6.2.3. Product portfolio
6.2.4. Key strategic moves and developments
6.3. ADVANCED THERMAL SOLUTIONS, INC.
6.3.1. Company overview
6.3.2. Company snapshot
6.3.3. Product portfolio
6.4. ALLBRASS INDUSTRIAL
6.4.1. Company overview
6.4.2. Company snapshot
6.4.3. Product portfolio
6.5. CUI INC.
6.5.1. Company overview
6.5.2. Company snapshot
6.5.3. Operating business segments
6.5.4. Product portfolio
6.5.5. Key strategic moves and developments
6.6. COMAIR ROTRON
6.6.1. Company overview
6.6.2. Company snapshot
6.6.3. Product portfolio
6.7. HONEYWELL INTERNATIONAL INC.
6.7.1. Company overview
6.7.2. Company snapshot
6.7.3. Operating business segments
6.7.4. Product portfolio
6.7.5. Business performance
6.8. KUNSHAN GOOGE METAL PRODUCTS CO., LTD.
6.8.1. Company overview
6.8.2. Company snapshot
6.8.3. Product portfolio
CHAPTER 7: CUSTOMERS – COMPANY PROFILES
7.1. ABB LTD.
7.1.1. Company overview
7.1.2. Key Executives
7.1.3. Company snapshot
7.1.4. Operating business segments
7.1.5. R&D Expenditure
7.1.6. Business performance
7.1.7. Key strategic moves and developments
7.2. FUJI ELECTRIC CO., LTD.
7.2.1. Company overview
7.2.2. Key Executives
7.2.3. Company snapshot
7.2.4. Operating business segments
7.2.5. R&D Expenditure
7.2.6. Business performance
7.2.7. Key strategic moves and developments
7.3. HITACHI, LTD.
7.3.1. Company overview
7.3.2. Key Executives
7.3.3. Company snapshot
7.3.4. Operating business segments
7.3.5. Business performance
7.3.6. Key strategic moves and developments
7.4. INFINEON TECHNOLOGIES AG
7.4.1. Company overview
7.4.2. Key Executives
7.4.3. Company snapshot
7.4.4. Operating business segments
7.4.5. R&D Expenditure
7.4.6. Business performance
7.4.7. Key strategic moves and developments
7.5. MITSUBISHI ELECTRIC CORPORATION
7.5.1. Company overview
7.5.2. Key Executives
7.5.3. Company snapshot
7.5.4. Operating business segments
7.5.5. R&D Expenditure
7.5.6. Business performance
7.5.7. Key strategic moves and developments
7.6. ROBERT BOSCH GMBH
7.6.1. Company overview
7.6.2. Key Executives
7.6.3. Company snapshot
7.6.4. Operating business segments
7.6.5. R&D Expenditure
7.6.6. Business performance
7.6.7. Key strategic moves and developments
7.7. SEMIKRON INTERNATIONAL GMBH
7.7.1. Company overview
7.7.2. Key Executives
7.7.3. Company snapshot
7.7.4. Key strategic moves and developments
7.8. SIEMENS AG
7.8.1. Company overview
7.8.2. Key Executives
7.8.3. Company snapshot
7.8.4. Operating business segments
7.8.5. R&D Expenditure
7.8.6. Business performance
7.8.7. Key strategic moves and developments
7.9. STARPOWER EUROPE AG
7.9.1. Company overview
7.9.2. Company snapshot
7.10. UNITED AUTOMOTIVE ELECTRONICS CO., LTD. (UAES)
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Key strategic moves and developments
【レポート販売概要】
■ タイトル：IGBT用ピンフィンヒートシンクの世界市場：材料種類別（銅、アルミニウム）■ 英文：Pin Fin Heat Sink for IGBT Market by Material Type (Copper and Aluminum): Global Opportunity Analysis and Industry Forecast, 2019–2025
■ 発行日：2019年5月31日
■ 調査会社：Allied Market Research
■ 商品コード：AMR9AG031
■ 調査対象地域：グローバル
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