HMC(ハイブリッドメモリーキューブ)及びHBM(広帯域メモリー)の世界市場予測(~2022)...市場調査レポートについてご紹介

【英文タイトル】Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Telecommunication), & Geography - Global Forecast to 2022

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼マーケットレポート

【レポートの概要(一部)】

1 Introduction (Page No. – 13)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Market Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitation
1.6 Stakeholders

2 Research Methodology (Page No. – 16)
2.1 Introduction
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown & Data Triangulation
2.4 Research Assumptions and Limitations
2.4.1 Assumptions

3 Executive Summary (Page No. – 25)

4 Premium Insights (Page No. – 29)
4.1 Increasing Research & Development Activities Expected to Offer New Growth Avenues for the Hybrid Memory Cube and High-Bandwidth Memory Market
4.2 Hybrid Memory Cube, and High-Bandwidth Memory Market Growth, By Application
4.3 Hybrid Memory Cube and High-Bandwidth Memory Market in APAC
4.4 Hybrid Memory Cube and High-Bandwidth Memory Market, By Region
4.5 Hybrid Memory Cube and High-Bandwidth Memory Market, By Consumer Electronics Application
4.6 Hybrid Memory Cube and High-Bandwidth Memory Markets, By Application (2022)

5 Market Overview (Page No. – 34)
5.1 Introduction
5.2 Market Segmentation
5.2.1 Hybrid Memory Cube and High-Bandwidth Memory Market, By Density
5.2.2 Hybrid Memory Cube and High-Bandwidth Memory Market, By Application
5.2.3 Hybrid Memory Cube and High-Bandwidth Memory Market, By Geography
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Need for High-Bandwidth, Low-Power Consuming, and Highly Scalable Memory Device
5.3.1.2 Growing Demand for Enterprise Storage Application
5.3.2 Restraints
5.3.2.1 Declining ASP of Traditional Dram Memory
5.3.3 Opportunities
5.3.3.1 Increasing Adoption of Cloud-Based Services
5.3.3.2 Growing Big Data Applications
5.3.4 Challenge
5.3.4.1 Manufacturing and Fabrication Challenge

6 Industry Trends (Page No. – 43)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Porter’s Five Forces Analysis
6.3.1 Threat of New Entrants
6.3.2 Threat of Substitutes
6.3.3 Bargaining Power of Suppliers
6.3.4 Bargaining Power of Buyers
6.3.5 Intensity of Rivalry

7 Hybrid Memory Cube and High-Bandwidth Memory Market, By Density (Page No. – 49)
7.1 Introduction
7.2 Hybrid Memory Cube (HMC)
7.2.1 Hybrid Memory Cube Consortium (HMCC) Specification 1.1 and 2.0
7.2.2 Hybrid Memory Cube (2GB)
7.2.3 Hybrid Memory Cube (4GB)
7.3 High-Bandwidth Memory(HBM)
7.3.1 Jedec High-Bandwidth Memory Generation 1 and 2 Specification
7.3.2 High-Bandwidth Memory (2GB)
7.3.3 High-Bandwidth Memory (4GB)
7.3.4 High-Bandwidth Memory (8GB)

8 Hybrid Memory Cube and High-Bandwidth Memory Market, By Application (Page No. – 58)
8.1 Introduction
8.2 Enterprise Storage
8.3 Consumer Electronics
8.3.1 PCS
8.3.2 Laptops
8.3.3 Gaming Consoles
8.4 Networking & Telecommunication
8.5 Industrial Applications

9 Geographic Analysis (Page No. – 69)
9.1 Introduction
9.2 North America
9.2.1 U.S.
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 U.K.
9.3.2 Germany
9.3.3 France
9.3.4 Others
9.4 APAC
9.4.1 China
9.4.2 Japan
9.4.3 South Korea
9.4.4 Taiwan
9.4.5 Others
9.5 Rest of the World (RoW)
9.5.1 South America
9.5.2 Middle East
9.5.3 Africa

10 Competitive Landscape (Page No. – 83)
10.1 Overview
10.2 Hybrid Memory Cube and High-Bandwidth Memory Market: Comparative Analysis
10.3 Market Ranking Analysis: Hybrid Memory Cube and High-Bandwidth Memory Market, 2015
10.4 Competitive Situations and Trends
10.4.1 New Product Launches
10.4.2 Contracts, Patnerships, and Collaborations
10.4.3 Acquisitions
10.4.4 Expansions

11 Company Profile (Page No. – 90)
(Overview, Financial*, Products & Services, Strategy, and Developments)
11.1 Introduction
11.2 Micron Technology, Inc.
11.3 Samsung Electronics Co., Ltd.
11.4 SK Hynix, Inc.
11.5 Advanced Micro Devices, Inc.
11.6 Intel Corporation
11.7 Fujitsu Ltd.
11.8 IBM Corporation
11.9 Xilinx Inc.
11.10 Nvidia Corporation
11.11 Open-Silicon, Inc.
11.12 Arira

*Details Might Not Be Captured in Case of Unlisted Companies

12 Appendix (Page No. – 116)
12.1 Insights of Industry Experts
12.2 Discussion Guide
12.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
12.4 Introducing RT: Real-Time Market Intelligence
12.5 Available Customizations
12.6 Related Reports


【レポート販売概要】

■ タイトル:HMC(ハイブリッドメモリーキューブ)及びHBM(広帯域メモリー)の世界市場予測(~2022)
■ 英文:Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Telecommunication), & Geography - Global Forecast to 2022
■ 発行日:2016年4月11日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-SE-4220
■ 調査対象地域:グローバル
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