3Dセンサの世界市場:画像センサ、ポジションセンサ、音響センサ、加速度センサ...市場調査レポートについてご紹介

【英文タイトル】3D Sensor Market by Technology (Ultrasound, TOF, Structured Light, Stereo Vision), Type(Image, Position, Acoustic, Accelerometer), Application (consumer Electronics, Entertainment, Automotive), and Geography - Trends & Forecast to 2014 - 2020

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【レポートの概要(一部)】

1 Introduction (Page No. – 15)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Market Scope
1.3.1 Markets Covered
1.3.2 Year Consideration
1.4 Currency
1.5 Limitation
1.6 Stakeholders

2 Research Methodology (Page No. – 18)
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.2 Demand-Side Analysis
2.2.1 Introduction
2.2.2 Demand-Side Analysis
2.2.2.1 Growth in Animation and Gaming Market
2.2.2.2 Growing Demand for 3D Image Sensor in Consumer Electronics
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Market Breakdown & Data Triangulation
2.5 Research Assumptions and Limitations
2.5.1 Assumptions

3 Executive Summary (Page No. – 30)

4 Premium Insights (Page No. – 37)
4.1 Attractive Opportunities in the 3D Sensor Market
4.2 3D Sensor Application Segments
4.3 3D Sensor Market : Application (2014)
4.4 APAC is Expected to Grow at the Highest Rate Between 2015 and 2020
4.5 3D Sensor Market: Type (2014)
4.6 3D Sensor Market: Developed vs. Developing Regions
4.7 3D Sensor Market: Products (2020)

5 Market Overview (Page No. – 43)
5.1 Introduction
5.2 Market Segmentation
5.2.1 By Technology
5.2.2 By Type
5.2.3 By Application
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Advancement in Camera Technology
5.3.1.2 Rising Demand for 3D Gaming
5.3.1.3 Growth in the 3D Sensor-Enabled Consumer Electronics Applications
5.3.2 Restraints
5.3.2.1 High Maintenance and Restoration Costs for Devices
5.3.3 Opportunities
5.3.3.1 3D Motion Detection for Indoor Navigation Using Cameras
5.3.3.2 Integration of Nanotechnology With 3D Sensor in Various Applications
5.3.4 Challenge
5.3.4.1 Implementation of 3D Depth Sensing Technology
5.3.5 Burning Issue
5.3.5.1 Data Transfer Rate

6 Industry Trends (Page No. – 53)
6.1 Introduction
6.2 Value Chain Analysis
6.2.1.1 Semiconductor Vendors and Raw Material Suppliers
6.2.1.2 Component Manufacturers
6.2.1.3 Technology Solution Providers
6.2.1.4 Original Equipment Manufacturers
6.2.1.5 End Users
6.3 Porter’s Five Forces Analysis
6.3.1 Threat From New Entrants
6.3.2 Threat of Substitutes
6.3.3 Bargaining Power of Suppliers
6.3.4 Bargaining Power of Buyers
6.3.5 Intensity of Competitive Rivalry
6.4 Strategic Benchmarking

7 Market, By Technology (Page No. – 64)
7.1 Introduction
7.2 Stereo Vision
7.3 Structured Light
7.4 Time of Flight
7.5 Ultrasound
7.6 Comparison of Technologies

8 Market, By Type (Page No. – 70)
8.1 Introduction
8.2 Image Sensor
8.2.1 Cmos 3D Image Sensor
8.2.2 3D Electro-Optical Image Sensors
8.2.3 3D Time of Flight Image Sensor
8.3 Position Sensor
8.4 Acoustic Sensor
8.5 Accelerometer Sensor
8.6 Others

9 Market, By Application (Page No. – 86)
9.1 Introduction
9.2 Consumer Electronics
9.3 Healthcare
9.4 Defense
9.5 Industrial Robotics
9.6 Entertainment
9.7 Automotive
9.8 Surveillance and Security
9.9 Others

10 Market, By Geography (Page No. – 110)
10.1 Introduction
10.2 North America
10.2.1 U.S.
10.2.2 Canada
10.2.3 Mexico
10.3 Europe
10.3.1 U.K.
10.3.2 Germany
10.3.3 France
10.3.4 RoE
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 Roapac
10.5 RoW
10.5.1 South America
10.5.2 Middle East
10.5.2 Africa

11 Competitive Landscape (Page No. – 142)
11.1 Overview
11.2 Market Ranking Analysis
11.3 Competitive Scenario
11.3.1 New Product Launches
11.3.2 Partnerships, Agreements, and Collaborations
11.3.3 Mergers and Acquisitions
11.3.4 Expansions
11.3.5 Other Developments

12 Company Profiles (Page No. – 150)
12.1 Asustek Computer Inc.
12.1.1 Business Overview
12.1.2 Product Offerings
12.1.3 Recent Developments
12.1.4 MnM View
12.2 Cognex Corporation
12.2.1 Business Overview
12.2.2 Product Offerings
12.2.3 Recent Developments
12.2.4 MnM View
12.3 Infineon Technologies AG
12.3.1 Business Overview
12.3.2 Product Portfolio
12.3.3 Recent Developments
12.3.4 MnM View
12.4 Intel Corporation
12.4.1 Business Overview
12.4.2 Product Portfolio
12.4.3 Recent Developments
12.4.4 MnM View SWOT Analysis
12.5 Microsoft Corporation
12.5.1 Business Overview
12.5.2 Product Portfolio
12.5.3 Recent Developments
12.5.4 MnM View SWOT Analysis
12.6 Omnivision Technologies, Inc.
12.6.1 Business Overview
12.6.2 Product Portfolio
12.6.3 Recent Developments
12.6.4 MnM View
12.7 Primesense Ltd.
12.7.1 Business Overview
12.7.2 Product Offerings
12.7.3 Recent Developments
12.7.4 MnM View
12.8 IFM Electronic
12.9.1 Business Overview
12.9.2 Product Offerings
12.9.3 Recent Developments
12.9 LMI Technologies, Inc.
12.10.1 Business Overview
12.10.2 Product Offerings
12.10.3 Recent Developments
12.10 Occipital, Inc.
12.11.1 Business Overview
12.11.2 Product Offerings
12.11.3 Recent Developments
12.11 Microchip Technology Inc.
12.12.1 Business Overview
12.12.2 Product Offerings
12.12.3 Recent Developments
12.12 Softkinetic – Optrima S.A.
12.13.1 Business Overview
12.13.2 Product Offerings
12.13.3 Recent Developments

13 Appendix (Page No. – 182)
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Introducing RT: Real Time Market Intelligence
13.4 Available Customizations
13.5 Related Reports


【レポート販売概要】

■ タイトル:3Dセンサの世界市場:画像センサ、ポジションセンサ、音響センサ、加速度センサ
■ 英文:3D Sensor Market by Technology (Ultrasound, TOF, Structured Light, Stereo Vision), Type(Image, Position, Acoustic, Accelerometer), Application (consumer Electronics, Entertainment, Automotive), and Geography - Trends & Forecast to 2014 - 2020
■ 発行日:2015年6月10日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-SE-3486
■ 調査対象地域:グローバル
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