【レポートの概要（一部）】
TABLE OF CONTENTS
1 INTRODUCTION
1.1 OBJECTIVES
1.2 REPORT DESCRIPTION
1.3 MARKETS COVERED
1.4 STAKEHOLDERS
1.5 RESEARCH METHODOLOGY
1.5.1 MARKET SIZE ESTIMATION
1.5.2 MARKET CRACK DOWN AND DATA TRIANGULATION
1.5.3 KEY DATA FROM SECONDARY SOURCES
1.5.4 KEY DATA TAKEN FROM PRIMARY SOURCES
1.5.5 MARKET DEFINITION AND SCOPE
1.5.1 REPORT ASSUMPTIONS
1.5.2 KEY COMPANIES OF PRIMARY RESEARCH
2 EXECUTIVE SUMMARY
3 MARKET OVERVIEW
3.1 INTRODUCTION
3.2 MARKET DEFINITION
3.3 HISTORY AND EVOLUTION
3.4 TRENDS IN THE MARKET
3.5 MARKET DYNAMICS
3.5.1 DRIVERS
3.5.1.1 Extensive implementation of GaN electronics
3.5.1.2 Growth of automotive electronics in APAC
3.5.1.3 Widening scope of wireless communication and PV in APAC
3.5.1.4 Evolution of GaAs based technology and products in Japan
3.5.1.5 Higher amount of data transactions are leading to higher requirement of compound semiconductors in the communication sector
3.5.1.6 Vast addressable market for opto-electronic semiconductor devices
3.5.2 RESTRAINT
3.5.2.1 Compatibility issues with the high-end materials like silicon
3.5.3 OPPORTUNITIES
3.5.3.1 Challenges faced by silicon turned out to be an opportunity for the compound semiconductor market
3.5.3.2 Deployment of GaN in Smart Grid
3.6 BURNING ISSUES
3.6.1 PROCESS OPTIMIZATION ACROSS THE PRODUCTION PROCESS TO MAXIMIZE THE YIELD
3.6.2 BULK GROWTH PROCESSES NEED TO BE BETTER UNDERSTOOD AND CONTROLLED
3.6.3 GAN-ON-SI TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
3.7 WINNING IMPERATIVE
3.7.1 IMPROVED QUALITY AND CONSISTENCY OF PRODUCTS
3.8 VALUE CHAIN ANALYSIS
3.9 PORTER’S FIVE FORCES ANALYSIS
3.9.1 DEGREE OF COMPETITION
3.9.2 THREAT FROM NEW ENTRANTS
3.9.3 THREAT FROM SUBSTITUTES
3.9.4 BARGAINING POWER OF BUYERS
3.9.5 BARGAINING POWER OF THE SUPPLIERS
4 MARKET ANALYSIS, BY MATERIAL TYPE
4.1 INTRODUCTION
4.2 III-V COMPOUND SEMICONDUCTORS MARKET
4.2.1 GALLIUM NITRIDE (GAN)
4.2.2 GALLIUM PHOSPHIDE (GAP)
4.2.3 GALLIUM ARSENIDE (GAAS)
4.2.4 INDIUM PHOSPHIDE (INP)
4.2.5 INDIUM ANTIMONIDE (INSB)
4.3 II-VI COMPOUND SEMICONDUCTORS MARKET
4.3.1 CADMIUM SELENIDE (CDSE)
4.3.2 CADMIUM TELLURIDE (CDTE)
4.3.3 ZINC SELENIDE (ZNSE)
4.4 SAPPHIRE
4.5 IV-IV COMPOUND SEMICONDUCTORS MARKET
4.5.1 SILICON CARBIDE (SIC)
4.5.2 SILICON GERMANIUM (SIGE)
4.6 OTHER COMPOUND SEMICONDUCTORS MARKET
4.6.1 ALUMINIUM GALLIUM ARSENIDE (ALGAAS)
4.6.2 ALUMINIUM INDIUM ARSENIDE (ALINAS)
4.6.3 ALUMINIUM GALLIUM NITRIDE (ALGAN)
4.6.4 ALUMINIUM GALLIUM PHOSPHIDE (ALGAP)
4.6.5 INDIUM GALLIUM NITRIDE (INGAN)
4.6.6 CADMIUM ZINC TELLURIDE (CDZNTE)
4.6.7 MERCURY CADMIUM TELLURIDE (HGCDTE)
5 MARKET ANALYSIS, BY DEPOSITION TECHNOLOGY
5.1 INTRODUCTION
5.2 CHEMICAL VAPOUR DEPOSITION (CVD)
5.2.1 METAL ORGANIC CHEMICAL VAPOUR DEPOSITION (MOCVD)
5.3 MOLECULAR BEAM EPITAXY (MBE)
5.3.1 METAL ORGANIC MOLECULAR BEAM EPITAXY (MOMBE)
5.4 HYDRIDE VAPOUR PHASE EPITAXY (HVPE)
5.5 AMMONOTHERMAL
5.6 LIQUID PHASE EPITAXY (LPE)
5.7 ATOMIC LAYER DEPOSITION (ALD)
5.8 OTHERS
5.8.1 NA-FLUX LPE
6 MARKET ANALYSIS, BY PRODUCTS
6.1 INTRODUCTION
6.1.1 PRODUCT- APPLICATION MAPPING – IMPACT ANALYSIS
6.1.2 KEY PLAYERS- PRODUCT ANALYSIS
6.1.3 POWER SEMICONDUCTOR
6.1.4 TRANSISTORS
6.1.4.1 High Electron Mobility Transistors (HEMTs)
6.1.4.2 Metal Oxide Semiconductor Field Effect Transistors (MOSFETs)
6.1.4.3 Metal Semiconductor Field Effect Transistors (MESFETs)
6.1.5 INTEGRATED CIRCUITS (ICS)
6.1.5.1 Monolithic Microwave Integrated Circuits(MMICS)
6.1.5.2 Radio Frequency Integrated Circuits (RFICS)
6.1.6 DIODES AND RECTIFIERS
6.1.6.1 PIN diode
6.1.6.2 Zener Diode
6.1.6.3 Schottky Diode
6.1.7 POWER SEMICONDUCTOR DEVICE MARKET, BY APPLICATION
6.1.7.1 ICT Applications
6.1.7.2 Aerospace and Defense Applications
6.1.7.3 Industrial, power, solar and wind applications
6.1.7.4 Consumer Electronics Applications
6.1.7.5 Automotive Applications
6.1.7.6 Medical Applications
6.2 OPTO-ELECTRONIC SEMICONDUCTOR DEVICES
6.2.1 LIGHT EMITTING DIODES
6.2.1.1 Miniature Light Emitting Diodes
6.2.1.2 Mid-range light emitting diodes
6.2.1.3 High power light emitting diodes
6.2.2 LASER DIODES
6.2.3 PHOTO DETECTORS
6.2.3.1 Photo diode
6.2.3.1.1
6.2.3.1.2
6.2.3.2 Photo transistor
6.2.3.3 ICT Applications
6.2.3.4 Aerospace and Defense Applications
6.2.3.5 Industrial, power, solar and wind applications
6.2.3.6 Consumer electronics applications
6.2.3.7 Automotive Applications
6.2.3.8 Medical Applications
7 MARKET ANALYSIS, BY APPLICATION
7.1 INTRODUCTION
7.2 ICT SECTOR
7.2.1 SIGNAL AMPLIFIERS AND SWITCHING SYSTEMS
7.2.2 SATELLITE COMMUNICATION APPLICATIONS
7.2.3 RADAR APPLICATIONS
7.2.4 RF APPLICATIONS
7.3 AEROSPACE AND DEFENSE APPLICATIONS
7.3.1 COMBAT VEHICLES
7.3.2 SHIPS AND VESSELS
7.3.3 MICROWAVE RADIATION APPLICATIONS
7.4 INDUSTRIAL, POWER, SOLAR, AND WIND APPLICATIONS
7.4.1 SMART GRID
7.4.2 WIND TURBINES AND WIND POWER SYSTEMS
7.4.3 PHOTO-VOLTAIC INVERTERS
7.4.4 SOLAR PANELS
7.4.5 MOTOR DRIVES
7.5 CONSUMER ELECTRONICS APPLICATIONS
7.5.1 INVERTERS IN CONSUMER APPLICATIONS
7.5.2 LED LIGHTING IN CONSUMER APPLICATIONS
7.5.3 SWITCH MODE CONSUMER POWER SUPPLY SYSTEMS
7.6 AUTOMOTIVE APPLICATIONS
7.6.1 ELECTRIC VEHICLES AND HYBRID ELECTRIC VEHICLES (HEVS)
7.6.2 AUTOMOTIVE BRAKING SYSTEMS
7.6.3 RAIL TRACTION
7.6.4 AUTOMOBILE MOTOR DRIVES
7.7 MEDICAL APPLICATIONS
7.7.1 IMPLANTABLE MEDICAL DEVICES
7.7.2 BIO-MEDICAL ELECTRONICS
8 MARKET ANALYSIS, BY GEOGRAPHY
8.1 INTRODUCTION
8.2 AMERICAS
8.2.1 NORTH AMERICA
8.2.2 SOUTH AMERICA
8.3 EUROPE
8.4 ASIA-PACIFIC
8.5 REST OF THE WORLD
9 COMPETITIVE LANDSCAPE
9.1 OVERVIEW
9.2 MARKET SHARE ANALYSIS
9.2.1 GLOBAL COMPOUND SEMICONDUCTOR WAFER MANUFACTURERS MARKET SHARE ANALYSIS
9.2.2 GLOBAL DEVICE MANUFACTURERS’ MARKET SHARE ANALYSIS
9.2.2.1 Global power devices market share analysis
9.2.2.2 Global opto-electronics devices market share analysis
9.2.3 GLOBAL END USERS’ MARKET SHARE ANALYSIS
9.3 KEY DEVELOPMENTS AFFECTING THE MARKET
10 COMPANY PROFILES
(Overview, Products and Services, Financials, Strategy & Development)*
10.1 WAFER MANUFACTURERS
10.1.1 CREE INCORPORATED
10.1.2 FREESCALE SEMICONDUCTOR, INC.
10.1.3 INTERNATIONAL QUANTUM EPITAXY PLC
10.1.4 TAIWAN SEMICONDUCTORS MANUFACTURING COMPANY LIMITED (TSMC)
10.1.5 SUMITOMO CHEMICAL CO., LTD.
10.2 DEVICE MANUFACTURERS
10.2.1 RENESAS ELECTRONICS CORPORATION
10.2.2 TEXAS INSTRUMENTS, INC.
10.2.3 STMICROELECTRONICS NV
10.2.4 INFINEON TECHNOLOGIES AG
10.2.5 KONINKLIJKE PHILIPS N.V.
10.3 END-USERS
10.3.1 LM ERICSSON TELEFON AB
10.3.2 IBM
10.3.3 SAMSUNG ELECTRONICS CO. LTD.
10.3.4 SIEMENS AG
10.3.5 SONY CORPORATION
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.
【レポート販売概要】
■ タイトル：世界の化合物半導体市場動向及び予測（2013 – 2020）■ 英文：Compound Semiconductor Market by Type (III-V, II-VI, IV-IV, Sapphire), Deposition Technology (CVD, MBE, HVPE, Ammonothermal, MOVPE, LPE, ALD), Product (Power, Opto - Electronic), Application, and Geography - Global Trends & Forecasts to 2013 - 2020
■ 発行日：2014年7月
■ 調査会社：MarketsandMarkets
■ 商品コード：MAM-SE-2588
■ 調査対象地域：グローバル
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