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TABLE OF CONTENTS

1 INTRODUCTION
1.1 OBJECTIVES
1.2 REPORT DESCRIPTION
1.3 MARKETS COVERED
1.4 STAKEHOLDERS
1.5 RESEARCH METHODOLOGY
1.5.1 MARKET SIZE ESTIMATION
1.5.2 MARKET CRACKDOWN ANDDATA TRIANGULATION
1.5.3 KEY DATAFROM SECONDARY SOURCES
1.5.4 KEYDATA FROM PRIMARY SOURCES
1.5.5 LIST OF COMPANIES COVERED DURING STUDY
1.6 REPORT ASSUMPTIONS

2 EXECUTIVE SUMMARY

3 COVER STORY
3.1 COVER STORY- INTERVIEW WITH DIRECTOR OF TECHNOLOGY MARKETING OF IMAGINATION TECHNOLOGIES GROUP PLC
3.2 COVER STORY- INTERVIEW WITH CEO AND COFOUNDER OF AUVIZ SYSTEMS

4 MARKET OVERVIEW
4.1 MARKET DEFINITION
4.2 MARKET SEGMENTATION
4.3 HISTORY AND EVOLUTION
4.3.1 SYSTEM ON CHIP (SOC)
4.3.2 MULTI-PROCESSOR SYSTEM ON CHIP (SOC)
4.3.3 HETEROGENEOUS SYSTEM ON CHIP (SOC)
4.4 EMERGING TRENDS
4.4.1 SYSTEM ON PACKAGE (SOP)
4.4.2 PHOTONICS CONVERGENCE FOR INTER-CHIP INTERCONNECTS
4.5 SYSTEM ARCHITECTURE
4.5.1 HARDWARE ARCHITECTURE
4.5.2 HETEROGENEOUS SYSTEM ARCHITECTURE
4.5.3 SOFTWARE ARCHITECTURE

5 MARKET ANALYSIS
5.1 INTRODUCTION
5.2 HETEROGENEOUS MOBILE PROCESSING AND COMPUTINGINDUSTRY VALUE CHAIN ANALYSIS
5.3 MARKET DYNAMICS
5.3.1 INTRODUCTION
5.3.2 MARKET DRIVERS
5.3.2.1 Increasing Demand for Miniaturized and High Performance Electronic Devices
5.3.2.2 Strong Penetration in Consumer Electronics Sector to Drive the Heterogeneous Mobile Processing and Computing Market
5.3.2.3 Faster Time-to-Market and Lower Development Costs Act as an Attractive Prospect for the Electronic Manufacturers
5.3.3 MARKET RESTRAINTS
5.3.3.1 Designing User Friendly Computing Environment to Program Diverse Machines in the Same Ecosystem
5.3.3.2 Reliability Challenges
5.3.4 OPPORTUNITIES
5.3.4.1 Rapid Adoption of Smartphone and Tablets
5.4 BURNING ISSUE
5.4.1 NON-EXISTENCE OF INDUSTRY INFRASTRUCTURE
5.5 WINNING IMPERATIVE
5.5.1 PREREQUISITE OF THERMAL MANAGEMENT FOR CHIPS
5.6 PORTER’S FIVE FORCES MODEL [HETEROGENEOUS MOBILE PROCESSING & COMPUTING MARKET]
5.6.1 DEGREE OF COMPETITION
5.6.2 BARGAINING POWER OF BUYERS
5.6.3 BARGAINING POWER OF SUPPLIERS
5.6.4 THREAT OF SUBSTITUTES
5.6.5 THREAT OF NEW ENTRANTS

6 HETEROGENEOUS MOBILE PROCESSING (HMP) AND COMPUTING MARKET, BY SOC COMPONENT
6.1 INTRODUCTION AND CLASSIFICATION BY HARDWARE COMPONENT
6.2 PROCESSORS
6.3 GRAPHICS PROCESSING UNITS
6.4 DIGITAL SIGNAL PROCESSORS
6.5 CONNECTIVITY SOLUTIONS
6.6 OTHERS
6.6.1 DISPLAY ENGINE
6.6.2 IMAGE SIGNAL PROCESSOR (ISP)
6.6.3 FIELD-PROGRAMMABLE GATE ARRAY (FPGA) IC
6.6.4 SENSORS
6.6.5 VIDEO SIGNAL PROCESSOR (VSP)
6.6.6 MULTIMEDIA ENGINE
6.7 SOFTWARE

7 HETEROGENEOUS MOBILE PROCESSING (HMP) AND COMPUTING MARKET, BY TECHNOLOGY NODE
7.1 INTRODUCTION
7.1.1 45 NM
7.1.2 28 NM
7.1.3 20 NM
7.1.4 14 NM
7.1.5 10 NM
7.1.6 7NM
7.1.7 5NM

8 HETEROGENEOUS MOBILE PROCESSING AND COMPUTING MARKET, BY APPLICATION
8.1 INTRODUCTION
8.2 CONSUMER ELECTRONICS SECTOR
8.2.1 SMARTPHONE
8.2.2 TABLETS
8.2.3 SMART TVS
8.2.4 GAMING CONSOLE
8.2.5 NETBOOK/PCS
8.2.6 OTHERS
8.3 TELECOMMUNICATIONS SECTOR
8.3.1 SERVER
8.3.2 WIRELESS SENSOR NETWORK (WSN)
8.3.3 OTHERS
8.4 INDUSTRIAL SECTOR
8.4.1 INDUSTRIAL CONTROL & AUTOMATION
8.4.2 COMMUNICATIONS INFRASTRUCTURE
8.4.3 DIGITAL SIGNAGE AND RETAIL
8.4.4 OTHERS
8.5 AUTOMOTIVE SECTOR
8.6 MILITARY, DEFENSE & AEROSPACE (MDA)SECTOR
8.7 MEDICAL SECTOR
8.7.1 CT SCANNER
8.7.2 HANDHELD MEDICAL DEVICE
8.7.3 OTHERS
8.8 EMERGING AND OTHER APPLICATIONS SECTOR
8.8.1 HUMAN MACHINE INTERFACE (HMI)
8.8.2 MULTIMEDIA INTERNET DEVICES
8.8.3 OTHERS

9 HETEROGENEOUS MOBILE PROCESSING AND COMPUTING MARKET BY GEOGRAPHY
9.1 INTRODUCTION
9.2 NORTH AMERICA
9.2.1 U.S.
9.2.2 CANADA
9.2.3 MEXICO
9.3 APAC
9.3.1 JAPAN
9.3.2 TAIWAN
9.3.3 CHINA
9.3.4 OTHERS
9.4 EUROPE
9.4.1 U.K.
9.4.2 FRANCE
9.4.3 GERMANY
9.4.4 OTHERS
9.5 ROW
9.5.1 MIDDLE EAST
9.5.2 OTHERS

10 COMPETITIVE LANDSCAPE
10.1 OVERVIEW
10.2 COMPETITIVE SITUATION AND TRENDS
10.2.1 NEW PRODUCT LAUNCH ANDNEW PRODUCT DEVELOPMENTANDEXPANSION
10.2.2 AGREEMENTS, PARTNERSHIPS, EXPANSION, AND COLLABORATIONS
10.2.3 MERGERS AND ACQUISITION
10.2.4 OTHERS

11 COMPANY PROFILE
(Overview, Products and Services, Financials, Strategy & Development)*
11.1 ADVANCED MICRO DEVICES INC.
11.2 APPLE INC.
11.3 ARM HOLDINGS PLC.
11.4 AUVIZ SYSTEMS
11.5 IMAGINATION TECHNOLOGIES GROUP PLC.
11.6 MEDIATEK INC.
11.7 NVIDIA CORPORATION
11.8 QUALCOMM INC.
11.9 SAMSUNG ELECTRONICS CO. LTD.
11.10 TEXAS INSTRUMENTS INC.
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.