【レポートの概要(一部)】
Table of Contents
1 Introduction (Page No. – 17)
1.1 Objectives
1.2 Market Definition
1.3 Market Scope
1.3.1 Markets Covered
1.3.1.1 Geographic Scope
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Package Size
1.6 Limitations
1.7 Stake Holders
2 Research Methodology (Page No. – 21)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.2 Market Size Estimation
2.2.1 Top-Down Approach
2.2.2 Bottom-Up Approach
2.3 Market Breakdown & Data Triangulation
2.4 Research Assumptions
2.4.1 Assumptions
3 Executive Summary (Page No. – 28)
4 Premium Insights (Page No. – 32)
4.1 Upcoming Opportunities in Thermal Interface Material Market
4.2 TIMS – Major Types of TIMS
4.3 Thermal Interface Material Market in APAC
4.4 China Dominates the TIMS Market
4.5 Thermal Interface Material Market: Developed vs. Developing Nations
4.6 Thermal Interface Material Market, By Type (2015–2020)
4.7 Thermal Interface Material Market, By Application, 2020
4.8 Product Growth Matrix
4.9 Life Cycle Analysis, By Region
5 Market Overview (Page No. – 40)
5.1 Introduction
5.2 Market Segmentation
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Faster and More Sophisticated Electronics
5.3.1.2 Energy Efficient Lightings Such as Led
5.3.1.3 Electrification of Transportation Industry
5.3.1.4 Enhanced Need for Seamless Connectivity
5.3.2 Restraints
5.3.2.1 Physical Properties Limiting TIM Performance
5.3.3 Opportunities
5.3.3.1 Use of Carbon Nanotubes as Heat Sinks
5.3.3.2 High Performance TIMS in Form of Nanodiamonds
5.3.4 Challenge
5.3.4.1 Finding Optimum Cost of Ownership for End User
5.4 Winning Imperatives
5.4.1 A Systematic Approach to Thermal Management
6 Industry Trends (Page No. – 51)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Price & Cost Analysis
6.4 Porter’s Five Forces Analysis
6.4.1 Bargaining Power of Suppliers
6.4.2 Threat of Substitutes
6.4.3 Bargaining Power of Buyers
6.4.4 Threat of New Entrants
6.4.5 Intensity of Rivalry
6.5 Market Share Analysis
7 Thermal Interface Materials Market, By Type (Page No. – 59)
7.1 Introduction
7.2 Greases & Adhesives
7.3 Tapes & Films Market
7.4 GAP Fillers
7.5 Metal Based TIMS
7.6 Phase Change Materials
7.7 Others
8 Thermal Interface Materials Market, By Application (Page No. – 73)
8.1 Introduction
8.2 Computers
8.3 Telecom
8.4 Medical Devices
8.5 Industrial Machinery
8.6 Consumer Durables
8.7 Automotive Electronics
8.8 Others
9 Thermal Interface Material Market, By Region (Page No. – 89)
9.1 Introduction
9.2 North America
9.2.1 U.S.
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 France
9.3.3 U.K.
9.3.4 Others
9.4 APAC
9.4.1 China
9.4.2 Japan
9.4.3 South Korea
9.4.4 India
9.4.5 Others
9.5 Rest of the World (RoW)
9.5.1 Brazil
9.5.2 Others
10 Competitive Landscape (Page No. – 141)
10.1 Overview
10.2 New Product Launch & Development: the Most Popular Growth Strategy
10.3 Henkel Corporation, Bergquist Company, and Indium Corporation: Most Active Participants
10.4 Competitive Situation & Trends
10.4.1 New Product Launches, Awards, Recognitions, & Developments
10.4.2 Agreements, Partnerships, Collaborations & Joint Ventures
10.4.3 Expansions
10.4.4 Mergers & Acquistions
11 Competitive Landscape (Page No. – 158)
11.1 Introduction
11.2 Honeywell International Inc.
11.2.1 Business Overview
11.2.2 Products & Services
11.2.3 Strategy & Insights
11.2.4 Recent Developments
11.2.5 SWOT Analysis
11.2.6 MNM View
11.3 3M Co.
11.3.1 Business Overview
11.3.2 Products & Services
11.3.3 Strategy & Insights
11.3.4 Recent Developments
11.3.5 SWOT Analysis
11.3.6 MNM View
11.4 Henkel AG & Co. Kgaa
11.4.1 Business Overview
11.4.2 Products & Services
11.4.3 Strategy & Insights
11.4.4 Recent Developments
11.4.5 SWOT Analysis
11.4.6 MNM View
11.5 Parker Hannifin Corporation
11.5.1 Business Overview
11.5.2 Products & Services
11.5.3 Strategy & Insights
11.5.4 Recent Developments
11.5.5 SWOT Analysis
11.5.6 MNM View
11.6 DOW Corning Corporation
11.6.1 Business Overview
11.6.2 Products & Services
11.6.3 Strategy & Insights
11.6.4 Recent Developments
11.6.5 SWOT Analysis
11.6.6 MNM View
11.7 the Bergquist Company, Inc.
11.7.1 Business Overview
11.7.2 Products & Services
11.7.3 Strategy & Insights
11.7.4 Recent Developments
11.8 Indium Corporation
11.8.1 Business Overview
11.8.2 Products & Services
11.8.3 Strategy & Insights
11.8.4 Recent Developments
11.9 Laird Technologies, Inc.
11.9.1 Business Overview
11.9.2 Products & Services
11.9.3 Strategy & Insights
11.9.4 Recent Developments
11.10 Momentive Performance Materials Inc.
11.10.1 Business Overview
11.10.2 Products & Services
11.10.3 Strategy & Insights
11.10.4 Recent Developments
11.11 Wakefield-Vette, Inc.
11.11.1 Business Overview
11.11.2 Products & Services
11.11.3 Strategy & Insights
11.11.4 Recent Developments
11.12 Zalman Tech Co., Ltd.
11.12.1 Business Overview
11.12.2 Products & Services
11.12.3 Strategy & Insights
11.12.4 Recent Developments
【レポート販売概要】
■ タイトル:熱伝導材料の世界市場:グリース、接着剤、テープ、フィルム、填隙剤、金属TIM、相変化材料■ 英文:Thermal Interface Material Market by Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Metallic TIMs, and PCM), by Application (Computers, Telecom, Medical Devices, Industrial Machinery, Consumer Durables, and Automotive Electronics), by Region - Trends & Forecasts to 2020
■ 発行日:2015年5月13日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-CH-3372
■ 調査対象地域:グローバル
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