【レポートの概要（一部）】
01. Executive Summary
02.List of Abbreviations
03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05.Introduction
06.Market Landscape
06.1 Market Overview
06.2 Market Size and Forecast
06.3 Five Forces Analysis
07.Geographical Segmentation
07.1 Global Interconnect Market by Geographical Segmentation 2014-2019
07.2 Interconnect Market in the APAC Region
07.2.1 Market Size and Forecast
07.3 Interconnect Market in the Europe
07.3.1 Market Size and Forecast
07.4 Interconnect Market in North America
07.4.1 Market Size and Forecast
07.5 Interconnect Market in RoW
07.5.1 Market Size and Forecast
08.Market Segmentation by Product
08.1 Global Interconnect Market by Product 2014-2019
08.2 Global Interconnect Market by Product: Cable Assembly
08.2.1 Market Size and Forecast
08.3 Global Interconnect Market by Product: Connector
08.3.1 Market Size and Forecast
09.Market Segmentation by End-users
09.1 Global Interconnect Market by End-users 2014-2019
09.2 Global Interconnect Market by End-user: Automotive
09.2.1 Market Size and Forecast
09.3 Global Interconnect Market by End-user: IT
09.3.1 Market Size and Forecast
09.4 Global Interconnect Market by End-user: Telecommunication
09.4.1 Market Size and Forecast
09.5 Global Interconnect Market by End-user: Industrial
09.5.1 Market Size and Forecast
09.6 Global Interconnect Market by End-user: Others
09.6.1 Market Size and Forecast
10.Buying Criteria
11.Market Growth Drivers
12.Drivers and their Impact
13.Market Challenges
14.Impact of Drivers and Challenges
15.Market Trends
16.Trends and their Impact
17.Vendor Landscape
17.1 Competitive Scenario
17.2 Other Prominent Vendors
18.Key Vendor Analysis
18.1 Amphenol
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Products Segmentation by Revenue 2012 and 2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 Hon Hai (Foxconn)
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Geographical Segmentation by Revenue 2013
18.2.4 Recent Developments
18.2.5 SWOT Analysis
18.3 Molex
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Market Segmentation by Revenue 2013
18.3.4 Product Segmentation by Revenue 2013
18.3.5 Product Segmentation by Revenue 2012 and 2013
18.3.6 Geographical Segmentation by Revenue 2013
18.3.7 Business Strategy
18.3.8 Recent Developments
18.3.9 SWOT Analysis
18.4 TE Connectivity
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2013
18.4.4 Business Segmentation by Revenue 2012 and 2013
18.4.5 Geographical Segmentation by Revenue 2013
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Yazaki
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Key Offerings
18.5.4 Net Sales by 2012 and 2013
18.5.5 Geographical Segmentation by Revenue 2014
18.5.6 SWOT Analysis
19.Other Reports in this Series
[List of Exhibits]
Exhibit 1: Market Research Methodology
Exhibit 2: Interconnect Components
Exhibit 3: Global Interconnect Market
Exhibit 4: Global Interconnect Market 2014-2019 ($ billions)
Exhibit 5: Interconnect Market by Geographical Segmentation 2014-2019
Exhibit 6: Interconnect Market in APAC Region 2014-2019 ($ billions)
Exhibit 7: Interconnect Market in Europe 2014-2019 ($ billions)
Exhibit 8: Interconnect Market in North America 2014-2019 ($ billions)
Exhibit 9: Interconnect Market in RoW 2014-2019 ($ billions)
Exhibit 10: Market Segmentation by Product 2014
Exhibit 11: Market Segmentation by Product 2014-2019
Exhibit 12: Market Segmentation by Product 2019
Exhibit 13: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 14: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 15: Market Segmentation by End-users 2014-2019
Exhibit 16: Market Segmentation by End-user: Automotive 2014-2019 ($ billions)
Exhibit 17: Market Segmentation by End-user: IT 2014-2019 ($ billions)
Exhibit 18: Market Segmentation by End-user: Telecommunication 2014-2019 ($ billions)
Exhibit 19: Market Segmentation by End-user: Industrial 2014-2019 ($ billions)
Exhibit 20: Market Segmentation by End-user: Others 2014-2019 ($ billions)
Exhibit 21: Smartphone Unit Sales (millions)
Exhibit 22: Mobile Data Traffic (exabytes)
Exhibit 23: Worldwide Electric and Hybrid Vehicle Production Units (millions)
Exhibit 24: Amphenol: Business Segmentation by Revenue 2013
Exhibit 25: Amphenol: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 26: Amphenol: Geographical Segmentation by Revenue 2013
Exhibit 27: Hon Hai : Geographical Segmentation by Revenue 2013
Exhibit 28: Molex: Market Segmentation by Revenue 2013
Exhibit 29: Molex: Product Segmentation by Revenue 2013
Exhibit 30: Molex: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 31: Molex: Geographical Segmentation by Revenue 2013
Exhibit 32: TE Connectivity: Business Segmentation by Revenue 2013
Exhibit 33: TE Connectivity: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 34: TE Connectivity: Geographical Segmentation by Revenue 2013
Exhibit 35: Yazaki: Key Offerings
Exhibit 36: Yazaki: Net Sales 2012 and 2013 (US$ billion)
Exhibit 37: Yazaki: Geographical Segmentation by Revenue 2014
【レポート販売概要】
■ タイトル：インタコネクト部品の世界市場：ケーブルアセンブリ、コネクター■ 英文：Global Interconnect Market 2015-2019
■ 発行日：2015年8月5日
■ 調査会社：Technavio
■ 商品コード：IRTNTR6610
■ 調査対象地域：グローバル
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