【レポートの概要（一部）】
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Market Landscape
06.1 Market Overview
07. Global TIM Market
07.1 Market Size and Forecast
07.2 Five Forces Analysis
08. Market Segmentation by Product
08.1 Global TIM Market Segmentation by Product 2013-2018
08.2 Global Polymer-based TIM Market
08.2.1 Market Size and Forecast
08.3 Global PCTIM Market
08.3.1 Market Size and Forecast
08.4 Global Metal-based TIM Market
08.4.1 Market Size and Forecast
09. Market Segmentation by End-users
09.1 Global TIM Market Segmentation by End-users 2013-2018
09.2 Global TIM Market in Computers
09.2.1 Market Size and Forecast
09.3 Global TIM Market in Electrical and Electronics
09.3.1 Market Size and Forecast
09.4 Global TIM Market in Telecom
09.4.1 Market Size and Forecast
09.5 Global TIM Market in Automotive and Others
09.5.1 Market Size and Forecast
10. Geographical Segmentation
10.1 Global TIM Market by Geographical Segmentation 2013-2018
10.2 TIM Market in the APAC Region
10.2.1 Market Size and Forecast
10.3 TIM Market in the Americas
10.3.1 Market Size and Forecast
10.4 TIM Market in the EMEA
10.4.1 Market Size and Forecast
11. Key Leading Countries
11.1 China
11.2 US
11.3 Japan
12. Buying Criteria
13. Market Growth Drivers
14. Drivers and their Impact
15. Market Challenges
16. Impact of Drivers and Challenges
17. Market Trends
18. Trends and their Impact
19. Vendor Landscape
19.1 Competitive Scenario
19.2 Other Prominent Vendors
20. Key Vendor Analysis
20.1 Cookson Electronics Assembly Materials
20.1.1 Key Facts
20.1.2 Business Overview
20.1.3 Product Segmentation
20.1.4 Sales Offices
20.1.5 SWOT Analysis
20.2 Dow Corning
20.2.1 Key Facts
20.2.2 Business Overview
20.2.3 Key Locations
20.2.4 Business Strategy
20.2.5 Recent Developments
20.2.6 SWOT Analysis
20.3 Henkel
20.3.1 Key Facts
20.3.2 Business Overview
20.3.3 Key Brands and Technologies
20.3.4 Business Strategy
20.3.5 Recent Developments
20.3.6 SWOT Analysis
20.4 Honeywell International
20.4.1 Key Facts
20.4.2 Business Overview
20.4.3 Business Segmentation by Revenue 2013
20.4.4 Business Segmentation by Revenue 2012 and 2013
20.4.5 Geographical Segmentation by Revenue 2013
20.4.6 Business Strategy
20.4.7 Recent Developments
20.4.8 SWOT Analysis
20.5 Laird
20.5.1 Key Facts
20.5.2 Business Overview
20.5.3 Business Segmentation by Revenue 2013
20.5.4 Business Segmentation by Revenue 2012 and 2013
20.5.5 Geographical Segmentation by Revenue 2013
20.5.6 Business Strategy
20.5.7 Recent Developments
20.5.8 SWOT Analysis
20.6 Zalman Tech
20.6.1 Key Facts
20.6.2 Business Overview
20.6.3 Business Segmentation
20.6.4 Geographical Segmentation
20.6.5 Business Strategy
20.6.6 Recent Developments
20.6.7 SWOT Analysis
21. Other Reports in this Series
[List of Exhibits]
Exhibit 1: Market Research Methodology
Exhibit 2: Global TIM Market Segmentation
Exhibit 3: Global TIM Market Segmentation by Product
Exhibit 4: Global TIM Market Segmentation by End-user
Exhibit 5: Global TIM Market Segmentation by Geography
Exhibit 7: Global TIM Market 2013-2018 (US$ million)
Exhibit 6: Global TIM Market Segmentation by Product 2013-2018
Exhibit 7: Global TIM Market Segmentation by Product 2013-2018 (US$ million)
Exhibit 8: Global Polymer-based TIM Market 2013-2018 (US$ million)
Exhibit 9: Global PCTIM Market 2013-2018 (US$ million)
Exhibit 10: Global Metal-based TIM Market 2013-2018 (US$ million)
Exhibit 11: Global TIM Market Segmentation by End-users 2013-2018
Exhibit 12: Global TIM Market Segmentation by End-users 2013-2018 (US$ million)
Exhibit 13: Global TIM Market in Computers 2013-2018 (US$ million)
Exhibit 14: Global TIM Market in Electrical and Electronics 2013-2018 (US$ million)
Exhibit 15: Global TIM Market in Electrical and Electronics Segmentation by Type 2013-2018
Exhibit 16: Global TIM Market in Telecom 2013-2018 (US$ million)
Exhibit 17: Global TIM Market in Automotive and Others 2013-2018 (US$ million)
Exhibit 18: Global TIM Market by Geographical Segmentation 2013-2018
Exhibit 19: Global TIM Market by Geographical Segmentation 2013-2018 (US$ million)
Exhibit 20: TIM Market in APAC Region 2013-2018 (US$ million)
Exhibit 21: TIM Market in Americas 2013-2018 (US$ million)
Exhibit 22: TIM Market in EMEA 2013-2018 (US$ million)
Exhibit 23: Global Shipments of Tablets, Laptops and Personal Computers 2012-2017 (Million Units)
Exhibit 24: Annual Global Automobile Sales 2012-2018 (Million Vehicles)
Exhibit 25: Cookson Electronics Assembly Materials: Product Segmentation
Exhibit 26: Cookson Electronics Assembly Materials: Sales Offices
Exhibit 27: Dow Corning: Key Locations
Exhibit 28: Henkel: Key Brands and Technologies
Exhibit 29: Honeywell International: Business Segmentation by Revenue 2013
Exhibit 30: Honeywell International: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 31: Honeywell International: Geographical Segmentation by Revenue 2013
Exhibit 32: Laird: Business Segmentation by Revenue 2013
Exhibit 33: Laird: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 34: Laird: Geographical Segmentation by Revenue 2013
Exhibit 35: Zalman Tech: Business Segmentation 2013
Exhibit 36: Zalman Tech: Geographical Segmentation
【レポート販売概要】
■ タイトル：熱伝導性材料の世界市場：ポリマー材料、フェイズチェンジ材、金属材料■ 英文：Global Thermal Interface Materials (TIM) Market 2014-2018
■ 発行日：2014年11月5日
■ 調査会社：TechNavio
■ 商品コード：IRTNTR4564
■ 調査対象地域：グローバル
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