【レポートの概要（一部）】
1 Introduction (Page No. – 16)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Scope of the Study
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Package Size
1.6 Limitations
1.7 Stakeholders
2 Research Methodology (Page No. – 19)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.3 Market Breakdown & Data Triangulation
2.4 Research Assumptions
3 Executive Summary (Page No. – 27)
4 Premium Insights (Page No. – 31)
4.1 Attractive Opportunities for the Passive and Interconnect Market
4.2 Passive and Interconnect Market, By Product Type
4.3 Passive and Interconnect Market, By Passive Component
4.4 Passive and Interconnect Market, By Interconnects
4.5 Passive and Interconnect Market, By Application
5 Market Overview (Page No. – 35)
5.1 Market Segmentation
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 High Demand for Passive Components and Interconnects in 3c Applications
5.2.1.2 Proliferation of Automotive Infotainment and Consumer Electronics
5.2.1.3 Government Support for HCIT Solutions
5.2.1.4 Increasing Demand for Miniaturized and High-Performance Electronic Devices
5.2.1.5 Advancements in Industrial M2m Communication Technology and Rising Industrial Automation
5.2.2 Restraints
5.2.2.1 Overall Drop in Global Commodity Prices
5.2.2.2 Declining Profit Margins of Manufacturers
5.2.3 Opportunities
5.2.3.1 Rising Adoption of Robots Across Industries
5.2.3.2 Opportunities for High-Temperature Capacitors and Chip-Level Optical Interconnects
5.2.4 Challenges
5.2.4.1 Standardization of Products
5.2.4.2 Maintaining the Temperature and Resistance of Components
6 Industry Trends (Page No. – 45)
6.1 Introduction
6.2 Value Chain Analysis
6.2.1 Research and Development
6.2.2 Manufacturing
6.2.3 Assembly
6.2.4 Marketing and Sales
6.2.5 End Users
6.3 Porter’s Five Forces
6.3.1 Bargaining Power of Suppliers
6.3.2 Bargaining Power of Buyers
6.3.3 Threat of Substitutes
6.3.4 Threat of New Entrants
6.3.5 Intensity of Competitive Rivalry
6.4 Key Trends
7 Passive and Interconnect Market, By Type (Page No. – 52)
7.1 Introduction
7.2 Passive Components
7.3 Interconnects
7.4 Types of Passive Components
7.4.1 Resistors
7.4.2 Inductors
7.4.3 Capacitors
7.4.4 Transformers
7.4.5 Diodes
7.5 Types of Interconnects
7.5.1 Printed Circuit Boards
7.5.2 Connectors
7.5.3 Switches
7.5.4 Relays
7.5.5 Others
8 Passive and Interconnect Market, By Application (Page No. – 71)
8.1 Introduction
8.2 Consumer Electronics
8.3 Data Processing
8.4 Telecommunication
8.5 Military and Aerospace
8.6 Automotive
8.7 Industrial
8.8 Healthcare
9 Passive and Interconnect Market, By Region (Page No. – 80)
9.1 Introduction
9.2 Americas
9.2.1 North America
9.2.1.1 U.S.
9.2.1.2 Canada
9.2.2 Latin America
9.2.2.1 Brazil
9.2.2.2 Rest of Latin America
9.3 Europe
9.3.1 Germany
9.3.2 France
9.3.3 Italy
9.3.4 U.K.
9.3.5 Rest of Europe
9.4 APAC
9.4.1 China
9.4.2 Japan
9.4.3 India
9.4.4 Taiwan
9.4.5 South Korea
9.4.6 Rest of APAC
9.5 RoW
9.5.1 Middle East
9.5.2 Africa
10 Competitive Landscape (Page No. – 108)
10.1 Introduction
10.2 Ranking of Market Players, 2016
10.3 Competitive Scenario and Trends
10.3.1 New Product Launches
10.3.2 Agreements, Partnerships, and Business Expansions
10.3.3 Mergers & Acquisitions
11 Company Profiles (Page No. – 115)
11.1 Introduction
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
11.2 TE Connectivity Ltd.
11.3 Amphenol Corporation
11.4 Molex Incorporated
11.5 Hirose Electric Co., Ltd
11.6 Delphi Automotive LLP
11.7 TT Electronics PLC
11.8 Japan Aviation Electronics Industry, Ltd.
11.9 AVX Corporation
11.10 Cisco Systems, Inc.
11.11 Yazaki Corporation
11.12 Panasonic Corporation
11.13 Ametek, Inc.
11.14 Hubbell Incorporated (Burndy LLC)
11.15 Hon Hai Precision Industry Co., Ltd.
11.16 JST MFG. Co., Ltd.
11.17 Key Innovators
11.17.1 Chogori Technology Co., Ltd
11.17.2 Suzhou Zeeteq Electronics Co., Ltd
11.17.3 Toyo Connectors
11.17.4 Ipdia
11.17.5 HVP Global, LLC
*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.
12 Appendix (Page No. – 152)
12.1 Insights of Industry Experts
12.2 Discussion Guide
12.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
12.4 Introducing RT: Real-Time Market Intelligence
12.5 Available Customizations
12.6 Related Reports
12.7 Author Details
【レポート販売概要】
■ タイトル：相互接続素子・受動素子の世界市場予測（～2022）：抵抗器、コンデンサ、誘導子、トランス、ダイオード、PCB、コネクタ、スイッチ、リレー、アダプター、ターミナル、スプライス、ソケット■ 英文：Interconnects and Passive Components Market by Passive Components (Resistor, Capacitor, Inductor, Transformer, and Diode), Interconnect Type (PCB, Connector, Switch, Relay, Adapter, Terminal, Splice, and Socket), Application, and Region - Global Forecast to 2022
■ 発行日：2017年3月28日
■ 調査会社：MarketsandMarkets
■ 商品コード：MAM-SE-5125
■ 調査対象地域：グローバル
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