【レポートの概要（一部）】
CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. INDUSTRY ROADMAP
2.2. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. AI CHIP MARKET – VALUE CHAIN ANALYSIS
3.5. MARKET SHARE ANALYSIS, 2018
3.5.1. AI Chip Suppliers, by Vertical
3.5.1.1. Media & Advertising
3.5.1.2. BFSI
3.5.1.3. IT & Telecom
3.5.1.4. Retail
3.5.1.5. Healthcare
3.5.1.6. Automotive
3.5.2. AI Chip Supplier Market Share Analysis, by Verticals
3.5.2.1. IT & Telecom
3.5.2.2. BFSI
3.5.2.3. Media & Advertising
3.5.2.4. Healthcare
3.5.2.5. Automotive
3.5.2.6. Retail
3.5.3. AI Chip Customers, by Vertical
3.5.3.1. Media & Advertising
3.5.3.2. BFSI
3.5.3.3. IT & Telecom
3.5.3.4. Retail
3.5.3.5. Healthcare
3.5.3.6. Automotive
3.5.4. Market share and AI chip spend for top customers
3.6. MARKET DYNAMICS
3.6.1. Drivers
3.6.1.1. Increase in demand for smart homes & smart cities
3.6.1.2. Rise in investments in AI startups
3.6.1.3. Emergence of quantum computing
3.6.2. Restraint
3.6.2.1. Dearth of skilled workforce
3.6.3. Opportunities
3.6.3.1. Increased adoption of AI chips in the developing regions
3.6.3.2. Development of smarter robots
3.7. RACE ANALYSIS
3.8. PATENT ANALYSIS
CHAPTER 4: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY CHIP TYPE
4.1. OVERVIEW
4.2. GPU
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country
4.3. ASIC
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country
4.4. FPGA
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country
4.5. CPU
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country
4.6. OTHERS (NPU & HYBRID CHIP)
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country
CHAPTER 5: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY APPLICATION
5.1. OVERVIEW
5.2. NATURAL LANGUAGE PROCESSING (NLP)
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country
5.3. ROBOTIC PROCESS AUTOMATION
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country
5.4. COMPUTER VISION
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country
5.5. NETWORK SECURITY
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country
5.6. OTHERS
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country
CHAPTER 6: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY TECHNOLOGY
6.1. OVERVIEW
6.2. SYSTEM-ON-CHIP (SOC)
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country
6.3. SYSTEM-IN-PACKAGE (SIP)
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country
6.4. MULTI-CHIP MODULE
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country
6.5. OTHERS (PACKAGE IN PACKAGE, TSV)
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country
CHAPTER 7: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY PROCESSING TYPE
7.1. OVERVIEW
7.2. EDGE
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis by country
7.3. CLOUD
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis by country
CHAPTER 8: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY INDUSTRY VERTICAL
8.1. OVERVIEW
8.2. MEDIA & ADVERTISING
8.2.1. Content Management
8.2.2. User Data Management
8.2.3. Real time analytics
8.2.4. Planning and scheduling
8.2.5. Key market trends, growth factors and opportunities
8.2.6. Market size and forecast, by region
8.2.7. Market analysis by country
8.2.8. Market size and forecast, by processing type
8.3. BFSI
8.3.1. Virtual Personal Assistant
8.3.2. Risk Management
8.3.3. Fraud Detection
8.3.4. Key market trends, growth factors and opportunities
8.3.5. Market size and forecast, by region
8.3.6. Market analysis by country
8.3.7. Market size and forecast, by processing type
8.4. IT & TELECOM
8.4.1. Churn Prediction
8.4.2. Network optimization
8.4.3. Virtual Assistance
8.4.4. Preventive Maintenance
8.4.5. Key market trends, growth factors and opportunities
8.4.6. Market size and forecast, by region
8.4.7. Market analysis by country
8.4.8. Market size and forecast, by processing type
8.5. RETAIL
8.5.1. Virtual Assistance
8.5.2. Demand planning and scheduling
8.5.3. Payment service management
8.5.4. Loyalty Management
8.5.5. Key market trends, growth factors and opportunities
8.5.6. Market size and forecast, by region
8.5.7. Market analysis by country
8.5.8. Market size and forecast, by processing type
8.6. HEALTHCARE
8.6.1. Risk Analysis
8.6.2. Imaging and diagnostics
8.6.3. Drug Discovery
8.6.4. Wearables
8.6.5. Key market trends, growth factors and opportunities
8.6.6. Market size and forecast, by region
8.6.7. Market analysis by country
8.6.8. Market size and forecast, by processing type
8.7. AUTOMOTIVE
8.7.1. Image Recognition
8.7.2. Control Devices
8.7.3. Key market trends, growth factors and opportunities
8.7.4. Market size and forecast, by region
8.7.5. Market analysis by country
8.7.6. Market size and forecast, by processing type
8.8. OTHERS
8.8.1. Key market trends, growth factors and opportunities
8.8.2. Market size and forecast, by region
8.8.3. Market analysis by country
8.8.4. Market size and forecast, by processing type
CHAPTER 9: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY REGION
9.1. OVERVIEW
9.2. NORTH AMERICA
9.2.1. Key market trends, growth factors, and opportunities
9.2.2. Market size and forecast, by chip type
9.2.3. Market size and forecast, by application
9.2.4. Market size and forecast, by technology
9.2.5. Market size and forecast, by processing type
9.2.6. Market size and forecast, by industry vertical
9.2.7. Market analysis by country
9.2.7.1. U.S.
9.2.7.1.1. Market size and forecast, by chip type
9.2.7.1.2. Market size and forecast, by application
9.2.7.1.3. Market size and forecast, by technology
9.2.7.1.4. Market size and forecast, by processing type
9.2.7.1.5. Market size and forecast, by industry vertical
9.2.7.2. Canada
9.2.7.2.1. Market size and forecast, by chip type
9.2.7.2.2. Market size and forecast, by application
9.2.7.2.3. Market size and forecast, by technology
9.2.7.2.4. Market size and forecast, by processing type
9.2.7.2.5. Market size and forecast, by industry vertical
9.2.7.3. Mexico
9.2.7.3.1. Market size and forecast, by chip type
9.2.7.3.2. Market size and forecast, by application
9.2.7.3.3. Market size and forecast, by technology
9.2.7.3.4. Market size and forecast, by processing type
9.2.7.3.5. Market size and forecast, by industry vertical
9.3. EUROPE
9.3.1. Key market trends, growth factors, and opportunities
9.3.2. Market size and forecast, by chip type
9.3.3. Market size and forecast, by application
9.3.4. Market size and forecast, by technology
9.3.5. Market size and forecast, by processing type
9.3.6. Market size and forecast, by industry vertical
9.3.7. Market analysis by country
9.3.7.1. U.K.
9.3.7.1.1. Market size and forecast, by chip type
9.3.7.1.2. Market size and forecast, by application
9.3.7.1.3. Market size and forecast, by technology
9.3.7.1.4. Market size and forecast, by processing type
9.3.7.1.5. Market size and forecast, by industry vertical
9.3.7.2. Germany
9.3.7.2.1. Market size and forecast, by chip type
9.3.7.2.2. Market size and forecast, by application
9.3.7.2.3. Market size and forecast, by technology
9.3.7.2.4. Market size and forecast, by processing type
9.3.7.2.5. Market size and forecast, by industry vertical
9.3.7.3. France
9.3.7.3.1. Market size and forecast, by chip type
9.3.7.3.2. Market size and forecast, by application
9.3.7.3.3. Market size and forecast, by technology
9.3.7.3.4. Market size and forecast, by processing type
9.3.7.3.5. Market size and forecast, by industry vertical
9.3.7.4. Russia
9.3.7.4.1. Market size and forecast, by chip type
9.3.7.4.2. Market size and forecast, by application
9.3.7.4.3. Market size and forecast, by technology
9.3.7.4.4. Market size and forecast, by processing type
9.3.7.4.5. Market size and forecast, by industry vertical
9.3.7.5. Rest of Europe
9.3.7.5.1. Market size and forecast, by chip type
9.3.7.5.2. Market size and forecast, by application
9.3.7.5.3. Market size and forecast, by technology
9.3.7.5.4. Market size and forecast, by processing type
9.3.7.5.5. Market size and forecast, by industry vertical
9.4. ASIA-PACIFIC
9.4.1. Key market trends, growth factors, and opportunities
9.4.2. Market size and forecast, by chip type
9.4.3. Market size and forecast, by application
9.4.4. Market size and forecast, by technology
9.4.5. Market size and forecast, by processing type
9.4.6. Market size and forecast, by industry vertical
9.4.7. Market analysis by country
9.4.7.1. China
9.4.7.1.1. Market size and forecast, by chip type
9.4.7.1.2. Market size and forecast, by application
9.4.7.1.3. Market size and forecast, by technology
9.4.7.1.4. Market size and forecast, by processing type
9.4.7.1.5. Market size and forecast, by industry vertical
9.4.7.2. Japan
9.4.7.2.1. Market size and forecast, by chip type
9.4.7.2.2. Market size and forecast, by application
9.4.7.2.3. Market size and forecast, by technology
9.4.7.2.4. Market size and forecast, by processing type
9.4.7.2.5. Market size and forecast, by industry vertical
9.4.7.3. India
9.4.7.3.1. Market size and forecast, by chip type
9.4.7.3.2. Market size and forecast, by application
9.4.7.3.3. Market size and forecast, by technology
9.4.7.3.4. Market size and forecast, by processing type
9.4.7.3.5. Market size and forecast, by industry vertical
9.4.7.4. Australia
9.4.7.4.1. Market size and forecast, by chip type
9.4.7.4.2. Market size and forecast, by application
9.4.7.4.3. Market size and forecast, by technology
9.4.7.4.4. Market size and forecast, by processing type
9.4.7.4.5. Market size and forecast, by industry vertical
9.4.7.5. Rest of Asia-Pacific
9.4.7.5.1. Market size and forecast, by chip type
9.4.7.5.2. Market size and forecast, by application
9.4.7.5.3. Market size and forecast, by technology
9.4.7.5.4. Market size and forecast, by processing type
9.4.7.5.5. Market size and forecast, by industry vertical
9.5. LAMEA
9.5.1. Key market trends, growth factors, and opportunities
9.5.2. Market size and forecast, by chip type
9.5.3. Market size and forecast, by application
9.5.4. Market size and forecast, by technology
9.5.5. Market size and forecast, by processing type
9.5.6. Market size and forecast, by industry vertical
9.5.7. Market analysis by country
9.5.7.1. Latin America
9.5.7.1.1. Market size and forecast, by chip type
9.5.7.1.2. Market size and forecast, by application
9.5.7.1.3. Market size and forecast, by technology
9.5.7.1.4. Market size and forecast, by processing type
9.5.7.1.5. Market size and forecast, by industry vertical
9.5.7.2. Middle East
9.5.7.2.1. Market size and forecast, by chip type
9.5.7.2.2. Market size and forecast, by application
9.5.7.2.3. Market size and forecast, by technology
9.5.7.2.4. Market size and forecast, by processing type
9.5.7.2.5. Market size and forecast, by industry vertical
9.5.7.3. Africa
9.5.7.3.1. Market size and forecast, by chip type
9.5.7.3.2. Market size and forecast, by application
9.5.7.3.3. Market size and forecast, by technology
9.5.7.3.4. Market size and forecast, by processing type
9.5.7.3.5. Market size and forecast, by industry vertical
CHAPTER 10: COMPANY PROFILES
10.1. ADAPTEVA, INC.
10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Product portfolio
10.1.4. Key strategic moves and developments
10.1.5. Technological insights and key architecture
10.2. ADVANCED MICRO DEVICES, INC.
10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.2.7. Technological insights and key architecture
10.3. ALPHABET INC. (GOOGLE INC.)
10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Operating business segments
10.3.4. Product portfolio
10.3.5. Business performance
10.3.6. Key strategic moves and developments
10.3.7. Technological insights and key architecture
10.4. AMAZON.COM, INC.
10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.4.7. Technological insights and key architecture
10.5. ANALOG DEVICES, INC.
10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. Business performance
10.5.6. Technological insights and key architecture
10.6. APPLIED MATERIALS, INC.
10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. Business performance
10.6.6. Key strategic moves and developments
10.6.7. Technological insights and key architecture
10.7. BAIDU, INC.
10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. Business performance
10.7.6. Key strategic moves and developments
10.7.7. Technological insights and key architecture
10.8. BITMAIN TECHNOLOGIES LTD.
10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Product portfolio
10.8.4. Key strategic moves and developments
10.8.5. Technological insights and key architecture
10.9. BROADCOM LIMITED
10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. Business performance
10.9.6. Key strategic moves and developments
10.9.7. Technological insights and key architecture
10.10. CAMBRICON TECHNOLOGIES CORPORATION LIMITED
10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.6. Technological insights and key architecture
10.11. GRAPHCORE LTD.
10.11.1. Company overview
10.11.2. Company snapshot
10.11.3. Operating business segments
10.11.4. Product portfolio
10.11.5. Key strategic moves and developments
10.11.6. Technological insights and key architecture
10.12. GROQ
10.12.1. Company overview
10.12.2. Company snapshot
10.12.3. Product portfolio
10.12.4. Technological insights and key architecture
10.13. GYRFALCON TECHNOLOGY INC.
10.13.1. Company overview
10.13.2. Company snapshot
10.13.3. Operating business segments
10.13.4. Product portfolio
10.13.5. Technological insights and key architecture
10.14. HORIZON ROBOTICS, INC.
10.14.1. Company overview
10.14.2. Company snapshot
10.14.3. Product portfolio
10.14.4. Technological insights and key architecture
10.15. HUAWEI TECHNOLOGIES CO. LTD.
10.15.1. Company overview
10.15.2. Company snapshot
10.15.3. Operating business segments
10.15.4. Product portfolio
10.15.5. Business performance
10.15.6. Key strategic moves and developments
10.15.7. Technological insights and key architecture
10.16. INTEL CORPORATION
10.16.1. Company overview
10.16.2. Company snapshot
10.16.3. Operating business segments
10.16.4. Product portfolio
10.16.5. Business performance
10.16.6. Key strategic moves and developments
10.16.7. Technological insights and key architecture
10.17. INTERNATIONAL BUSINESS MANAGEMENT CORPORATION
10.17.1. Company overview
10.17.2. Company snapshot
10.17.3. Operating business segments
10.17.4. Product portfolio
10.17.5. Business performance
10.17.6. Key strategic moves and developments
10.17.7. Technological insights and key architecture
10.18. KNUEDGE, INC.
10.18.1. Company overview
10.18.2. Company snapshot
10.18.3. Product portfolio
10.18.4. Technological insights and key architecture
10.19. KRTKL INC.
10.19.1. Company overview
10.19.2. Company snapshot
10.19.3. Product portfolio
10.19.4. Technological insights and key architecture
10.20. MEDIATEK, INC.
10.20.1. Company overview
10.20.2. Company snapshot
10.20.3. Operating business segments
10.20.4. Product portfolio
10.20.5. Business performance
10.20.6. Key strategic moves and developments
10.20.7. Technological insights and key architecture
10.21. MICRON TECHNOLOGY, INC.
10.21.1. Company overview
10.21.2. Company snapshot
10.21.3. Operating business segments
10.21.4. Product portfolio
10.21.5. Business performance
10.21.6. Technological insights and key architecture
10.22. MICROSEMI CORPORATION
10.22.1. Company overview
10.22.2. Company snapshot
10.22.3. Operating business segments
10.22.4. Product portfolio
10.22.5. Business performance
10.22.6. Key strategic moves and developments
10.22.7. Technological insights and key architecture
10.23. MYTHIC, INC.
10.23.1. Company overview
10.23.2. Company snapshot
10.23.3. Product portfolio
10.23.4. Key strategic moves and developments
10.23.5. Technological insights and key architecture
10.24. NEC CORPORATION
10.24.1. Company overview
10.24.2. Company snapshot
10.24.3. Operating business segments
10.24.4. Product portfolio
10.24.5. Business performance
10.24.6. Key strategic moves and developments
10.24.7. Technological insights and key architecture
10.25. KOREA ELECTRONIC CERTIFICATION AUTHORITY, INC. (AI BRAIN, INC.)
10.25.1. Company overview
10.25.2. Company snapshot
10.25.3. Operating business segments
10.25.4. Product portfolio
10.25.5. Technological insights and key architecture
10.26. NVIDIA CORPORATION
10.26.1. Company overview
10.26.2. Company snapshot
10.26.3. Operating business segments
10.26.4. Product portfolio
10.26.5. Business performance
10.26.6. Key strategic moves and developments
10.26.7. Technological insights and key architecture
10.27. NXP SEMICONDUCTORS N.V.
10.27.1. Company overview
10.27.2. Company snapshot
10.27.3. Operating business segments
10.27.4. Product portfolio
10.27.5. Business performance
10.27.6. Key strategic moves and developments
10.27.7. Technological insights and key architecture
10.28. QUALCOMM INCORPORATED
10.28.1. Company overview
10.28.2. Company snapshot
10.28.3. Operating business segments
10.28.4. Product portfolio
10.28.5. Business performance
10.28.6. Key strategic moves and developments
10.28.7. Technological insights and key architecture
10.29. SAMSUNG ELECTRONICS CO. LTD.
10.29.1. Company overview
10.29.2. Company snapshot
10.29.3. Operating business segments
10.29.4. Product portfolio
10.29.5. Business performance
10.29.6. Key strategic moves and developments
10.29.7. Technological insights and key architecture
10.30. SHANGHAI THINK-FORCE ELECTRONIC TECHNOLOGY CO. LTD.
10.30.1. Company overview
10.30.2. Company snapshot
10.30.3. Product portfolio
10.30.4. Technological insights and key architecture
10.31. SK HYNIX, INC.
10.31.1. Company overview
10.31.2. Company snapshot
10.31.3. Operating business segments
10.31.4. Product portfolio
10.31.5. Business performance
10.31.6. Technological insights and key architecture
10.32. SOFTBANK GROUP CORP. (ARM HOLDINGS PLC)
10.32.1. Company overview
10.32.2. Company snapshot
10.32.3. Operating business segments
10.32.4. Product portfolio
10.32.5. Business performance
10.32.6. Key strategic moves and developments
10.32.7. Technological insights and key architecture
10.33. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
10.33.1. Company overview
10.33.2. Company snapshot
10.33.3. Operating business segments
10.33.4. Product portfolio
10.33.5. Business performance
10.33.6. Technological insights and key architecture
10.34. TENSTORRENT INC.
10.34.1. Company overview
10.34.2. Company snapshot
10.34.3. Product portfolio
10.34.4. Technological insights and key architecture
10.35. TEXAS INSTRUMENTS INCORPORATED
10.35.1. Company overview
10.35.2. Company snapshot
10.35.3. Operating business segments
10.35.4. Product portfolio
10.35.5. Business performance
10.35.6. Technological insights and key architecture
10.36. TOSHIBA CORPORATION
10.36.1. Company overview
10.36.2. Company snapshot
10.36.3. Operating business segments
10.36.4. Product portfolio
10.36.5. Business performance
10.36.6. Key strategic moves and developments
10.36.7. Technological insights and key architecture
10.37. UNIVERSITY OF CALIFORNIA SYSTEM (UNIVERSITY OF CALIFORNIA, DAVIS)
10.37.1. Company overview
10.37.2. Company snapshot
10.37.3. Operating business segments
10.37.4. Product portfolio
10.37.5. Business performance
10.37.6. Technological insights and key architecture
10.38. WAVE COMPUTING, INC.
10.38.1. Company overview
10.38.2. Company snapshot
10.38.3. Product portfolio
10.38.4. Key strategic moves and developments
10.38.5. Technological insights and key architecture
10.39. XILINX, INC.
10.39.1. Company overview
10.39.2. Company snapshot
10.39.3. Operating business segments
10.39.4. Product portfolio
10.39.5. Business performance
10.39.6. Technological insights and key architecture
【レポート販売概要】
■ タイトル：人工知能（AI）チップの世界市場：チップタイプ別（GPU、ASIC、FPGA、CPUなど）、用途別（自然言語処理（NLP）、ロボット、コンピュータービジョン、ネットワークセキュリティなど）■ 英文：Artificial Intelligence Chip Market by Chip Type (GPU, ASIC, FPGA, CPU, and others), Application (Natural Language Processing (NLP), Robotic, Computer Vision, Network Security, and Others), Technology (System-on-Chip, System-in-Package, Multi-chip Module, and Others), Processing Type (Edge and Cloud), and Industry Vertical (Media & Advertising, BFSI, IT & Telecom, Retail, Healthcare, Automotive & Transportation, and Others): Global Opportunity Analysis and Industry Forecast, 2019–2025
■ 発行日：2019年5月3日
■ 調査会社：Allied Market Research
■ 商品コード：AMR9AG002
■ 調査対象地域：グローバル
- BFSI（金融）におけるブロックチェーンの世界市場：コンポーネント別、用途別、組織規模別、業種別Blockchain in BFSI is also called as FinTech blockchain. Wide dissemination of blockchain by financial organizations from the past years has witnessed rise in popularity of cryptocurrencies, and the initial coin offering (ICO). As well as blockchain is panacea for all fintech companies’ digital concerns such as security. Blockchain as a technology was developed to serve as the public transaction l …
- 世界のスマートセンサー市場動向（2012-2016）TechNavio's analysts forecast the Global Smart Sensor market to grow at a CAGR of 11.1 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing demand for smart sensors in the Automotive sector. The Global Smart Sensor market has also been witnessing rapid technological advancement. However, high cost of deployment could pose a challenge to the …
- 乳幼児用ハイチェア・補助椅子の世界市場2016-2020About High Chairs and Booster Seats Baby high chairs are free-standing chairs that elevate the child for the purpose of feeding them. The models of baby high chairs available in the market vary in terms of shape, size, and type. As a result of product enhancements, baby high chairs are now available with a wide range of features such as adjustable height, multiple trays, casters for mobility, and …
- 農業機械向け融資の世界市場2019-2023About this market Agricultural equipment finance provides quick and easy access to credit unlike traditional financial institutions, which may take more than a day to complete the paperwork for the loan application. Many banks also have policies that encourage them to provide loans to farmers due to government support. In addition, alternative finance caters to such businesses by providing quick a …
- 特殊タイヤの世界市場2018-2022About this market The development of airless tires to push growth in the market. Automotive radial airless tires for specialty vehicles such as off-highway commercial vehicles like golf carts, construction vehicles, agricultural vehicles and mainstream commercial vehicles are forecasted to gain traction by 2020.Technavio’s analysts have predicted that the specialty tires market will register a CAG …
- 組み込みプロセッサのグローバル市場（2014-2018）About Embedded Processor An embedded processor is a single chip that encompasses the functions of several discrete chips. Embedded processors are integrated in the embedded systems which are used to carry out complex operations. Embedded processors are different from other processors because of their architecture which entails dedicated computing cores (a processor), memory, and programmable input …
- Legacy Oil + Gas Inc.：石油・ガスの開発・生産動向及びコスト分析– Q4, 2012Legacy Oil + Gas Inc. Oil & Gas Exploration and Production Operations and Cost Analysis – Q4, 2012 Summary Legacy Oil + Gas Inc. Oil & Gas Exploration and Production Operations and Cost Analysis is the latest report from GlobalData, the industry analysis specialists, that offers comprehensive information on the operational and financial performance of the company. The report is an essential source …
- オートバイ用高級ヘルメットの世界市場2018-2022About Premium Motorcycle Helmets Premium motorcycle helmets are those that are made of either strong and lightweight material like carbon fiber or equipped with connectivity features. Technavio’s analysts forecast the global premium motorcycle helmets market to grow at a CAGR of 7.66% during the period 2018-2022. Covered in this report The report covers the present scenario and the growth prospect …
- 世界における小型自動車用OE(メーカー純正部品)タイヤ市場（2008-2028）This latest just-auto report edition offers a global review of the OE tyres sector, its suppliers, top markets, technologies and market forecasts. This global market study offers: Automotive OE tyres market size estimates Latest technologies and trends Market share data tables Exclusive interviews with major companies Profiles of the major players including their strategies and prospects Market si …
- インテリジェント仮想アシスタント（IVA）の世界市場分析：タイプ別（音声認識、テキスト – 音声認識）、サービス別（カスタマーサービス、マーケットアシスタント）、用途別（BFSI、自動車、IT･テレコム、小売、ヘルスケア、教育）、エンドユーザー別（中小企業、大企業、個人ユーザー）、セグメント予測The global Intelligent Virtual Assistant (IVA) market size is expected to reach USD 12.28 billion by 2024 according to a new report by Grand View Research, Inc. Demand for online self-service and growing need for self-reliance and rapid resolution of queries are expected to be the primary contributors to market growth. Online websites have become the preferred service channel for consumers gatheri …
- 3Dプリンティング材料の世界市場2016-2020About 3D Printing 3D printing is a technique in which a scanned or digitally designed object is formed into a three-dimensional solid using an additive process. In this process, metal is applied in successive layers with less wastage. 3D printing products can be built from materials in which plastic and metals are the most commonly used materials. A 3D object is designed using computer-aided desig …
- 自動車補修用塗料の世界市場2016-2020：溶剤型塗料、水性塗料About Automotive Refinish CoatingsAutomotive coatings are products that enhance the exterior appearance and durability of a vehicle by protecting it from harsh external factors such as UV radiation, heat and cold, and grit from the road. Automotive refinish coatings are used for automotive aftermarket purposes such as vehicle repair and refinishing. Technavio’s analysts forecast the global automot …
- 熱成形プラスチックの世界市場2016-2020About Thermoformed Plastic Products Thermoformed plastic products are produced in bulk by heating a plastic sheet to bendable form, shaping it into the required design, and then cooling it. The cooled product is trimmed to get the required usable end-product. Technavio’s analysts forecast the global thermoformed plastics market to grow at a CAGR of 4.87% during the period 2016-2020. [Covered in th …
- 世界の熱可塑性加硫エラストマー市場2015The Global Thermoplastic Vulcanizates Industry Report 2015 is a professional and in-depth study on the current state of the Thermoplastic Vulcanizates industry. The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The Thermoplastic Vulcanizates market analysis is provided for the international markets including deve …
- スマートグリッド市場レビュー：April 2013Smart Grid Review - April 2013 Summary GlobalData announces the release of its monthly smart grid newsletter for April 2012 from the Smart Grid eTrack. The newsletter provides update on the global developments related to smart grid deployment across the globe during the month of March 2012. Scope - Market prospect for companies providing smart grid systems - Key product launch in power grids - Maj …
