【レポートの概要（一部）】
CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. INDUSTRY ROADMAP
2.2. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. AI CHIP MARKET – VALUE CHAIN ANALYSIS
3.5. MARKET SHARE ANALYSIS, 2018
3.5.1. AI Chip Suppliers, by Vertical
3.5.1.1. Media & Advertising
3.5.1.2. BFSI
3.5.1.3. IT & Telecom
3.5.1.4. Retail
3.5.1.5. Healthcare
3.5.1.6. Automotive
3.5.2. AI Chip Supplier Market Share Analysis, by Verticals
3.5.2.1. IT & Telecom
3.5.2.2. BFSI
3.5.2.3. Media & Advertising
3.5.2.4. Healthcare
3.5.2.5. Automotive
3.5.2.6. Retail
3.5.3. AI Chip Customers, by Vertical
3.5.3.1. Media & Advertising
3.5.3.2. BFSI
3.5.3.3. IT & Telecom
3.5.3.4. Retail
3.5.3.5. Healthcare
3.5.3.6. Automotive
3.5.4. Market share and AI chip spend for top customers
3.6. MARKET DYNAMICS
3.6.1. Drivers
3.6.1.1. Increase in demand for smart homes & smart cities
3.6.1.2. Rise in investments in AI startups
3.6.1.3. Emergence of quantum computing
3.6.2. Restraint
3.6.2.1. Dearth of skilled workforce
3.6.3. Opportunities
3.6.3.1. Increased adoption of AI chips in the developing regions
3.6.3.2. Development of smarter robots
3.7. RACE ANALYSIS
3.8. PATENT ANALYSIS
CHAPTER 4: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY CHIP TYPE
4.1. OVERVIEW
4.2. GPU
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country
4.3. ASIC
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country
4.4. FPGA
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country
4.5. CPU
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country
4.6. OTHERS (NPU & HYBRID CHIP)
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country
CHAPTER 5: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY APPLICATION
5.1. OVERVIEW
5.2. NATURAL LANGUAGE PROCESSING (NLP)
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country
5.3. ROBOTIC PROCESS AUTOMATION
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country
5.4. COMPUTER VISION
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country
5.5. NETWORK SECURITY
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country
5.6. OTHERS
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country
CHAPTER 6: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY TECHNOLOGY
6.1. OVERVIEW
6.2. SYSTEM-ON-CHIP (SOC)
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis by country
6.3. SYSTEM-IN-PACKAGE (SIP)
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis by country
6.4. MULTI-CHIP MODULE
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis by country
6.5. OTHERS (PACKAGE IN PACKAGE, TSV)
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis by country
CHAPTER 7: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY PROCESSING TYPE
7.1. OVERVIEW
7.2. EDGE
7.2.1. Key market trends, growth factors and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis by country
7.3. CLOUD
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis by country
CHAPTER 8: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY INDUSTRY VERTICAL
8.1. OVERVIEW
8.2. MEDIA & ADVERTISING
8.2.1. Content Management
8.2.2. User Data Management
8.2.3. Real time analytics
8.2.4. Planning and scheduling
8.2.5. Key market trends, growth factors and opportunities
8.2.6. Market size and forecast, by region
8.2.7. Market analysis by country
8.2.8. Market size and forecast, by processing type
8.3. BFSI
8.3.1. Virtual Personal Assistant
8.3.2. Risk Management
8.3.3. Fraud Detection
8.3.4. Key market trends, growth factors and opportunities
8.3.5. Market size and forecast, by region
8.3.6. Market analysis by country
8.3.7. Market size and forecast, by processing type
8.4. IT & TELECOM
8.4.1. Churn Prediction
8.4.2. Network optimization
8.4.3. Virtual Assistance
8.4.4. Preventive Maintenance
8.4.5. Key market trends, growth factors and opportunities
8.4.6. Market size and forecast, by region
8.4.7. Market analysis by country
8.4.8. Market size and forecast, by processing type
8.5. RETAIL
8.5.1. Virtual Assistance
8.5.2. Demand planning and scheduling
8.5.3. Payment service management
8.5.4. Loyalty Management
8.5.5. Key market trends, growth factors and opportunities
8.5.6. Market size and forecast, by region
8.5.7. Market analysis by country
8.5.8. Market size and forecast, by processing type
8.6. HEALTHCARE
8.6.1. Risk Analysis
8.6.2. Imaging and diagnostics
8.6.3. Drug Discovery
8.6.4. Wearables
8.6.5. Key market trends, growth factors and opportunities
8.6.6. Market size and forecast, by region
8.6.7. Market analysis by country
8.6.8. Market size and forecast, by processing type
8.7. AUTOMOTIVE
8.7.1. Image Recognition
8.7.2. Control Devices
8.7.3. Key market trends, growth factors and opportunities
8.7.4. Market size and forecast, by region
8.7.5. Market analysis by country
8.7.6. Market size and forecast, by processing type
8.8. OTHERS
8.8.1. Key market trends, growth factors and opportunities
8.8.2. Market size and forecast, by region
8.8.3. Market analysis by country
8.8.4. Market size and forecast, by processing type
CHAPTER 9: ARTIFICIAL INTELLIGENCE CHIP MARKET, BY REGION
9.1. OVERVIEW
9.2. NORTH AMERICA
9.2.1. Key market trends, growth factors, and opportunities
9.2.2. Market size and forecast, by chip type
9.2.3. Market size and forecast, by application
9.2.4. Market size and forecast, by technology
9.2.5. Market size and forecast, by processing type
9.2.6. Market size and forecast, by industry vertical
9.2.7. Market analysis by country
9.2.7.1. U.S.
9.2.7.1.1. Market size and forecast, by chip type
9.2.7.1.2. Market size and forecast, by application
9.2.7.1.3. Market size and forecast, by technology
9.2.7.1.4. Market size and forecast, by processing type
9.2.7.1.5. Market size and forecast, by industry vertical
9.2.7.2. Canada
9.2.7.2.1. Market size and forecast, by chip type
9.2.7.2.2. Market size and forecast, by application
9.2.7.2.3. Market size and forecast, by technology
9.2.7.2.4. Market size and forecast, by processing type
9.2.7.2.5. Market size and forecast, by industry vertical
9.2.7.3. Mexico
9.2.7.3.1. Market size and forecast, by chip type
9.2.7.3.2. Market size and forecast, by application
9.2.7.3.3. Market size and forecast, by technology
9.2.7.3.4. Market size and forecast, by processing type
9.2.7.3.5. Market size and forecast, by industry vertical
9.3. EUROPE
9.3.1. Key market trends, growth factors, and opportunities
9.3.2. Market size and forecast, by chip type
9.3.3. Market size and forecast, by application
9.3.4. Market size and forecast, by technology
9.3.5. Market size and forecast, by processing type
9.3.6. Market size and forecast, by industry vertical
9.3.7. Market analysis by country
9.3.7.1. U.K.
9.3.7.1.1. Market size and forecast, by chip type
9.3.7.1.2. Market size and forecast, by application
9.3.7.1.3. Market size and forecast, by technology
9.3.7.1.4. Market size and forecast, by processing type
9.3.7.1.5. Market size and forecast, by industry vertical
9.3.7.2. Germany
9.3.7.2.1. Market size and forecast, by chip type
9.3.7.2.2. Market size and forecast, by application
9.3.7.2.3. Market size and forecast, by technology
9.3.7.2.4. Market size and forecast, by processing type
9.3.7.2.5. Market size and forecast, by industry vertical
9.3.7.3. France
9.3.7.3.1. Market size and forecast, by chip type
9.3.7.3.2. Market size and forecast, by application
9.3.7.3.3. Market size and forecast, by technology
9.3.7.3.4. Market size and forecast, by processing type
9.3.7.3.5. Market size and forecast, by industry vertical
9.3.7.4. Russia
9.3.7.4.1. Market size and forecast, by chip type
9.3.7.4.2. Market size and forecast, by application
9.3.7.4.3. Market size and forecast, by technology
9.3.7.4.4. Market size and forecast, by processing type
9.3.7.4.5. Market size and forecast, by industry vertical
9.3.7.5. Rest of Europe
9.3.7.5.1. Market size and forecast, by chip type
9.3.7.5.2. Market size and forecast, by application
9.3.7.5.3. Market size and forecast, by technology
9.3.7.5.4. Market size and forecast, by processing type
9.3.7.5.5. Market size and forecast, by industry vertical
9.4. ASIA-PACIFIC
9.4.1. Key market trends, growth factors, and opportunities
9.4.2. Market size and forecast, by chip type
9.4.3. Market size and forecast, by application
9.4.4. Market size and forecast, by technology
9.4.5. Market size and forecast, by processing type
9.4.6. Market size and forecast, by industry vertical
9.4.7. Market analysis by country
9.4.7.1. China
9.4.7.1.1. Market size and forecast, by chip type
9.4.7.1.2. Market size and forecast, by application
9.4.7.1.3. Market size and forecast, by technology
9.4.7.1.4. Market size and forecast, by processing type
9.4.7.1.5. Market size and forecast, by industry vertical
9.4.7.2. Japan
9.4.7.2.1. Market size and forecast, by chip type
9.4.7.2.2. Market size and forecast, by application
9.4.7.2.3. Market size and forecast, by technology
9.4.7.2.4. Market size and forecast, by processing type
9.4.7.2.5. Market size and forecast, by industry vertical
9.4.7.3. India
9.4.7.3.1. Market size and forecast, by chip type
9.4.7.3.2. Market size and forecast, by application
9.4.7.3.3. Market size and forecast, by technology
9.4.7.3.4. Market size and forecast, by processing type
9.4.7.3.5. Market size and forecast, by industry vertical
9.4.7.4. Australia
9.4.7.4.1. Market size and forecast, by chip type
9.4.7.4.2. Market size and forecast, by application
9.4.7.4.3. Market size and forecast, by technology
9.4.7.4.4. Market size and forecast, by processing type
9.4.7.4.5. Market size and forecast, by industry vertical
9.4.7.5. Rest of Asia-Pacific
9.4.7.5.1. Market size and forecast, by chip type
9.4.7.5.2. Market size and forecast, by application
9.4.7.5.3. Market size and forecast, by technology
9.4.7.5.4. Market size and forecast, by processing type
9.4.7.5.5. Market size and forecast, by industry vertical
9.5. LAMEA
9.5.1. Key market trends, growth factors, and opportunities
9.5.2. Market size and forecast, by chip type
9.5.3. Market size and forecast, by application
9.5.4. Market size and forecast, by technology
9.5.5. Market size and forecast, by processing type
9.5.6. Market size and forecast, by industry vertical
9.5.7. Market analysis by country
9.5.7.1. Latin America
9.5.7.1.1. Market size and forecast, by chip type
9.5.7.1.2. Market size and forecast, by application
9.5.7.1.3. Market size and forecast, by technology
9.5.7.1.4. Market size and forecast, by processing type
9.5.7.1.5. Market size and forecast, by industry vertical
9.5.7.2. Middle East
9.5.7.2.1. Market size and forecast, by chip type
9.5.7.2.2. Market size and forecast, by application
9.5.7.2.3. Market size and forecast, by technology
9.5.7.2.4. Market size and forecast, by processing type
9.5.7.2.5. Market size and forecast, by industry vertical
9.5.7.3. Africa
9.5.7.3.1. Market size and forecast, by chip type
9.5.7.3.2. Market size and forecast, by application
9.5.7.3.3. Market size and forecast, by technology
9.5.7.3.4. Market size and forecast, by processing type
9.5.7.3.5. Market size and forecast, by industry vertical
CHAPTER 10: COMPANY PROFILES
10.1. ADAPTEVA, INC.
10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Product portfolio
10.1.4. Key strategic moves and developments
10.1.5. Technological insights and key architecture
10.2. ADVANCED MICRO DEVICES, INC.
10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.2.7. Technological insights and key architecture
10.3. ALPHABET INC. (GOOGLE INC.)
10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Operating business segments
10.3.4. Product portfolio
10.3.5. Business performance
10.3.6. Key strategic moves and developments
10.3.7. Technological insights and key architecture
10.4. AMAZON.COM, INC.
10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.4.7. Technological insights and key architecture
10.5. ANALOG DEVICES, INC.
10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. Business performance
10.5.6. Technological insights and key architecture
10.6. APPLIED MATERIALS, INC.
10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. Business performance
10.6.6. Key strategic moves and developments
10.6.7. Technological insights and key architecture
10.7. BAIDU, INC.
10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. Business performance
10.7.6. Key strategic moves and developments
10.7.7. Technological insights and key architecture
10.8. BITMAIN TECHNOLOGIES LTD.
10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Product portfolio
10.8.4. Key strategic moves and developments
10.8.5. Technological insights and key architecture
10.9. BROADCOM LIMITED
10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. Business performance
10.9.6. Key strategic moves and developments
10.9.7. Technological insights and key architecture
10.10. CAMBRICON TECHNOLOGIES CORPORATION LIMITED
10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.6. Technological insights and key architecture
10.11. GRAPHCORE LTD.
10.11.1. Company overview
10.11.2. Company snapshot
10.11.3. Operating business segments
10.11.4. Product portfolio
10.11.5. Key strategic moves and developments
10.11.6. Technological insights and key architecture
10.12. GROQ
10.12.1. Company overview
10.12.2. Company snapshot
10.12.3. Product portfolio
10.12.4. Technological insights and key architecture
10.13. GYRFALCON TECHNOLOGY INC.
10.13.1. Company overview
10.13.2. Company snapshot
10.13.3. Operating business segments
10.13.4. Product portfolio
10.13.5. Technological insights and key architecture
10.14. HORIZON ROBOTICS, INC.
10.14.1. Company overview
10.14.2. Company snapshot
10.14.3. Product portfolio
10.14.4. Technological insights and key architecture
10.15. HUAWEI TECHNOLOGIES CO. LTD.
10.15.1. Company overview
10.15.2. Company snapshot
10.15.3. Operating business segments
10.15.4. Product portfolio
10.15.5. Business performance
10.15.6. Key strategic moves and developments
10.15.7. Technological insights and key architecture
10.16. INTEL CORPORATION
10.16.1. Company overview
10.16.2. Company snapshot
10.16.3. Operating business segments
10.16.4. Product portfolio
10.16.5. Business performance
10.16.6. Key strategic moves and developments
10.16.7. Technological insights and key architecture
10.17. INTERNATIONAL BUSINESS MANAGEMENT CORPORATION
10.17.1. Company overview
10.17.2. Company snapshot
10.17.3. Operating business segments
10.17.4. Product portfolio
10.17.5. Business performance
10.17.6. Key strategic moves and developments
10.17.7. Technological insights and key architecture
10.18. KNUEDGE, INC.
10.18.1. Company overview
10.18.2. Company snapshot
10.18.3. Product portfolio
10.18.4. Technological insights and key architecture
10.19. KRTKL INC.
10.19.1. Company overview
10.19.2. Company snapshot
10.19.3. Product portfolio
10.19.4. Technological insights and key architecture
10.20. MEDIATEK, INC.
10.20.1. Company overview
10.20.2. Company snapshot
10.20.3. Operating business segments
10.20.4. Product portfolio
10.20.5. Business performance
10.20.6. Key strategic moves and developments
10.20.7. Technological insights and key architecture
10.21. MICRON TECHNOLOGY, INC.
10.21.1. Company overview
10.21.2. Company snapshot
10.21.3. Operating business segments
10.21.4. Product portfolio
10.21.5. Business performance
10.21.6. Technological insights and key architecture
10.22. MICROSEMI CORPORATION
10.22.1. Company overview
10.22.2. Company snapshot
10.22.3. Operating business segments
10.22.4. Product portfolio
10.22.5. Business performance
10.22.6. Key strategic moves and developments
10.22.7. Technological insights and key architecture
10.23. MYTHIC, INC.
10.23.1. Company overview
10.23.2. Company snapshot
10.23.3. Product portfolio
10.23.4. Key strategic moves and developments
10.23.5. Technological insights and key architecture
10.24. NEC CORPORATION
10.24.1. Company overview
10.24.2. Company snapshot
10.24.3. Operating business segments
10.24.4. Product portfolio
10.24.5. Business performance
10.24.6. Key strategic moves and developments
10.24.7. Technological insights and key architecture
10.25. KOREA ELECTRONIC CERTIFICATION AUTHORITY, INC. (AI BRAIN, INC.)
10.25.1. Company overview
10.25.2. Company snapshot
10.25.3. Operating business segments
10.25.4. Product portfolio
10.25.5. Technological insights and key architecture
10.26. NVIDIA CORPORATION
10.26.1. Company overview
10.26.2. Company snapshot
10.26.3. Operating business segments
10.26.4. Product portfolio
10.26.5. Business performance
10.26.6. Key strategic moves and developments
10.26.7. Technological insights and key architecture
10.27. NXP SEMICONDUCTORS N.V.
10.27.1. Company overview
10.27.2. Company snapshot
10.27.3. Operating business segments
10.27.4. Product portfolio
10.27.5. Business performance
10.27.6. Key strategic moves and developments
10.27.7. Technological insights and key architecture
10.28. QUALCOMM INCORPORATED
10.28.1. Company overview
10.28.2. Company snapshot
10.28.3. Operating business segments
10.28.4. Product portfolio
10.28.5. Business performance
10.28.6. Key strategic moves and developments
10.28.7. Technological insights and key architecture
10.29. SAMSUNG ELECTRONICS CO. LTD.
10.29.1. Company overview
10.29.2. Company snapshot
10.29.3. Operating business segments
10.29.4. Product portfolio
10.29.5. Business performance
10.29.6. Key strategic moves and developments
10.29.7. Technological insights and key architecture
10.30. SHANGHAI THINK-FORCE ELECTRONIC TECHNOLOGY CO. LTD.
10.30.1. Company overview
10.30.2. Company snapshot
10.30.3. Product portfolio
10.30.4. Technological insights and key architecture
10.31. SK HYNIX, INC.
10.31.1. Company overview
10.31.2. Company snapshot
10.31.3. Operating business segments
10.31.4. Product portfolio
10.31.5. Business performance
10.31.6. Technological insights and key architecture
10.32. SOFTBANK GROUP CORP. (ARM HOLDINGS PLC)
10.32.1. Company overview
10.32.2. Company snapshot
10.32.3. Operating business segments
10.32.4. Product portfolio
10.32.5. Business performance
10.32.6. Key strategic moves and developments
10.32.7. Technological insights and key architecture
10.33. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
10.33.1. Company overview
10.33.2. Company snapshot
10.33.3. Operating business segments
10.33.4. Product portfolio
10.33.5. Business performance
10.33.6. Technological insights and key architecture
10.34. TENSTORRENT INC.
10.34.1. Company overview
10.34.2. Company snapshot
10.34.3. Product portfolio
10.34.4. Technological insights and key architecture
10.35. TEXAS INSTRUMENTS INCORPORATED
10.35.1. Company overview
10.35.2. Company snapshot
10.35.3. Operating business segments
10.35.4. Product portfolio
10.35.5. Business performance
10.35.6. Technological insights and key architecture
10.36. TOSHIBA CORPORATION
10.36.1. Company overview
10.36.2. Company snapshot
10.36.3. Operating business segments
10.36.4. Product portfolio
10.36.5. Business performance
10.36.6. Key strategic moves and developments
10.36.7. Technological insights and key architecture
10.37. UNIVERSITY OF CALIFORNIA SYSTEM (UNIVERSITY OF CALIFORNIA, DAVIS)
10.37.1. Company overview
10.37.2. Company snapshot
10.37.3. Operating business segments
10.37.4. Product portfolio
10.37.5. Business performance
10.37.6. Technological insights and key architecture
10.38. WAVE COMPUTING, INC.
10.38.1. Company overview
10.38.2. Company snapshot
10.38.3. Product portfolio
10.38.4. Key strategic moves and developments
10.38.5. Technological insights and key architecture
10.39. XILINX, INC.
10.39.1. Company overview
10.39.2. Company snapshot
10.39.3. Operating business segments
10.39.4. Product portfolio
10.39.5. Business performance
10.39.6. Technological insights and key architecture
【レポート販売概要】
■ タイトル：人工知能（AI）チップの世界市場：チップタイプ別（GPU、ASIC、FPGA、CPUなど）、用途別（自然言語処理（NLP）、ロボット、コンピュータービジョン、ネットワークセキュリティなど）■ 英文：Artificial Intelligence Chip Market by Chip Type (GPU, ASIC, FPGA, CPU, and others), Application (Natural Language Processing (NLP), Robotic, Computer Vision, Network Security, and Others), Technology (System-on-Chip, System-in-Package, Multi-chip Module, and Others), Processing Type (Edge and Cloud), and Industry Vertical (Media & Advertising, BFSI, IT & Telecom, Retail, Healthcare, Automotive & Transportation, and Others): Global Opportunity Analysis and Industry Forecast, 2019–2025
■ 発行日：2019年5月3日
■ 調査会社：Allied Market Research
■ 商品コード：AMR9AG002
■ 調査対象地域：グローバル
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- ビジネス・アナリティクスの世界市場2015-2019About Business Analytics Market Business analytics software collects, manages, and analyzes both structured and unstructured data to provide insights to improve business processes, achieve corporate goals, and help make appropriate and quick decisions. It includes EPM and analytics applications, business intelligence (BI) tools, and data warehouse platform. A data warehouse comprises databases in …
- サービスとしてのトラックの世界市場2019-2023About this market Digital transformation in trucking industry will be a key factor driving the growth of the market. The digital transformation in trucking industry is on rise as OEMs and technology suppliers are recalibrating their business strategies. The truck manufacturers are focusing on leveraging technologies. Implementation of various technologies such as implementation of telematics in tr …
- 世界のベーカリー及びシリアル市場のM&A動向（2014年6月）Synopsis The report provides a review of the mergers and acquisitions (M&As), partnering deals, and agreements entered into by companies active in the global bakery & cereals market during June 2014. Summary Using this report, dealmakers will effectively gain an insight into deal activity of the global bakery & cereals market throughout the month. Additionally, the report provides an overview of a …
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