【レポートの概要（一部）】
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 05: MARKET SIZING
• Market definition
• Market sizing 2017
• Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
• Segmentation by application
• Comparison by application
• Rugged mobile computers – Market size and forecast 2017-2022
• Rugged tablets – Market size and forecast 2017-2022
• Rugged scanners – Market size and forecast 2017-2022
• Others – Market size and forecast 2017-2022
• Market opportunity by application
PART 08: CUSTOMER LANDSCAPE
PART 09: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• Americas – Market size and forecast 2017-2022
• EMEA – Market size and forecast 2017-2022
• APAC – Market size and forecast 2017-2022
• Key leading countries
• Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 12: MARKET TRENDS
• Growth of rugged IoT
• Increased deployment of UAVs by defense and military
• Adoption of modular data center
PART 13: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 14: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Analog Devices
• Honeywell International
• Infineon Technologies
• Ozark Integrated Circuits
• STMicroelectronics
• List of abbreviations
Exhibit 01: Parent market
Exhibit 02: Segmentation of global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global rugged IC market – Market size and forecast 2017-2022 ($ bn)
Exhibit 09: Unit shipments of rugged devices 2017-2022 (millions of units)
Exhibit 10: Global rugged IC market – Year-over-year growth 2018-2022 (%)
Exhibit 11: Five forces analysis 2017
Exhibit 12: Five forces analysis 2022
Exhibit 13: Bargaining power of buyers
Exhibit 14: Bargaining power of suppliers
Exhibit 15: Threat of new entrants
Exhibit 16: Threat of substitutes
Exhibit 17: Threat of rivalry
Exhibit 18: Market condition – Five forces 2017
Exhibit 19: Global rugged IC market by application – Market share 2017-2022 (%)
Exhibit 20: Comparison by application
Exhibit 21: Rugged mobile computers – Market size and forecast 2017-2022 ($ bn)
Exhibit 22: Rugged mobile computers – Year-over-year growth 2018-2022 (%)
Exhibit 23: Rugged tablets – Market size and forecast 2017-2022 ($ bn)
Exhibit 24: Rugged tablets – Year-over-year growth 2018-2022 (%)
Exhibit 25: Rugged scanners – Market size and forecast 2017-2022 ($ bn)
Exhibit 26: Rugged scanners – Year-over-year growth 2018-2022 (%)
Exhibit 27: Others – Market size and forecast 2017-2022 ($ bn)
Exhibit 28: Others – Year-over-year growth 2018-2022 (%)
Exhibit 29: Market opportunity by application
Exhibit 30: Customer landscape
Exhibit 31: Global rugged IC market by geography – Market share 2017-2022 (%)
Exhibit 32: Regional comparison
Exhibit 33: Americas – Market size and forecast 2017-2022 ($ bn)
Exhibit 34: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 35: EMEA – Market size and forecast 2017-2022 ($ bn)
Exhibit 36: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 37: APAC – Market size and forecast 2017-2022 ($ bn)
Exhibit 38: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 39: Key leading countries
Exhibit 40: Market opportunity
Exhibit 41: Global semiconductor market trend 1992-2017 ($ billions)
Exhibit 42: Vendor landscape
Exhibit 43: Landscape disruption
Exhibit 44: Vendors covered
Exhibit 45: Vendor classification
Exhibit 46: Market positioning of vendors
Exhibit 47: Vendor overview
Exhibit 48: Analog Devices – Business segments
Exhibit 49: Analog Devices – Organizational developments
Exhibit 50: Analog Devices – Geographic focus
Exhibit 51: Analog Devices – Segment focus
Exhibit 52: Analog Devices – Key offerings
Exhibit 53: Vendor overview
Exhibit 54: Honeywell International – Business segments
Exhibit 55: Honeywell International – Organizational developments
Exhibit 56: Honeywell International – Geographic focus
Exhibit 57: Honeywell International – Segment focus
Exhibit 58: Honeywell International – Key offerings
Exhibit 59: Vendor overview
Exhibit 60: Infineon Technologies – Business segments
Exhibit 61: Infineon Technologies – Organizational developments
Exhibit 62: Infineon Technologies – Geographic focus
Exhibit 63: Infineon Technologies – Segment focus
Exhibit 64: Infineon Technologies – Key offerings
Exhibit 65: Vendor overview
Exhibit 66: Ozark Integrated Circuits – Organizational developments
Exhibit 67: Ozark Integrated Circuits – Key offerings
Exhibit 68: Vendor overview
Exhibit 69: STMicroelectronics – Business segments
Exhibit 70: STMicroelectronics – Organizational developments
Exhibit 71: STMicroelectronics – Geographic focus
Exhibit 72: STMicroelectronics – Segment focus
Exhibit 73: STMicroelectronics – Key offerings
【レポート販売概要】
■ タイトル：堅牢型ICの世界市場2018-2022■ 英文：Global Rugged IC Market 2018-2022
■ 発行日：2018年12月10日
■ 調査会社：Technavio
■ 商品コード：IRTNTR23029
■ 調査対象地域：グローバル、アジア、北米、ヨーロッパ（EMEA）
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