MEMS（メムス）の世界市場予測（～2022年）：センサ、アクチュエータ...市場調査レポートについてご紹介

TABLE OF CONTENTS

1 INTRODUCTION 14
1.1 OBJECTIVES OF THE STUDY 14
1.2 MARKET DEFINITION 14
1.3 STUDY SCOPE 15
1.3.1 MARKETS COVERED 15
1.3.2 GEOGRAPHIC SCOPE 16
1.3.3 YEARS CONSIDERED FOR THE STUDY 16
1.4 CURRENCY 17
1.5 MARKET STAKEHOLDERS 17

2 RESEARCH METHODOLOGY 18
2.1 RESEARCH DATA 19
2.1.1 SECONDARY DATA 19
2.1.1.1 List of major secondary sources 19
2.1.1.2 Key data from secondary sources 20
2.1.2 PRIMARY DATA 20
2.1.2.1 Primary interviews with experts 21
2.1.2.2 Key data from primary sources 21
2.1.2.3 Key industry insights 22
2.1.2.4 Breakdown of primaries 22
2.1.3 SECONDARY AND PRIMARY RESEARCH 23
2.2 MARKET SIZE ESTIMATION 24
2.2.1 BOTTOM-UP APPROACH 25
2.2.1.1 Approach for capturing the market share by bottom-up analysis (Demand side) 25
2.2.2 TOP-DOWN APPROACH 26
2.2.2.1 Approach for capturing the market share by top-down analysis (Supply side) 26
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 27
2.4 RESEARCH ASSUMPTIONS 28

3 EXECUTIVE SUMMARY 29

4 PREMIUM INSIGHTS 34
4.1 ATTRACTIVE MARKET OPPORTUNITIES IN THE OVERALL MEMS MARKET 34
4.2 MEMS MARKET, BY VERTICAL 35
4.3 MEMS MARKET, BY SENSOR AND ACTUATOR TYPES 35
4.4 COUNTRY-WISE ANALYSIS OF THE MEMS MARKET 36
4.5 MEMS MARKET, BY REGION 36

5 MARKET OVERVIEW 37
5.1 INTRODUCTION 38
5.2 MARKET EVOLUTION FOR MEMS 38
5.3 MARKET DYNAMICS 39
5.3.1 DRIVERS 39
5.3.1.1 Growing demand for smart consumer electronics and wearable devices 39
5.3.1.2 Stringent government regulations for the automotive vertical 40
5.3.1.3 Introduction of efficient, economic, and compact MEMS technology 42
5.3.1.4 Huge adoption of automation in industries and homes 42
5.3.2 RESTRAINTS 43
5.3.2.1 Highly complex manufacturing process and demanding cycle time 43
5.3.2.2 Lack of standardized fabrication process for MEMS 43
5.3.3 OPPORTUNITIES 44
5.3.3.1 Emerging demand for autonomous vehicles 44
5.3.3.2 Rising demand for connected devices to implement IoT 44
5.3.3.3 Advancement in sensor fusion technology 45
5.3.3.4 Increasing adoption in healthcare vertical 46
5.3.4 CHALLENGES 46
5.3.4.1 Low return on investment 46
5.3.4.2 Miniaturization leading to a high level of complexity 47
5.4 VALUE CHAIN ANALYSIS 47
5.5 MEMS PLAYERS BUSINESS MODEL 49

6 MEMS MARKET, BY SENSOR TYPE 50
6.1 INTRODUCTION 51
6.2 INERTIAL SENSOR 54
6.2.1 ACCELEROMETER 56
6.2.2 GYROSCOPE 57
6.2.3 MAGNETOMETER 58
6.2.4 COMBO SENSOR 59
6.3 PRESSURE SENSOR 60
6.4 MICROPHONE 61
6.5 ENVIRONMENTAL SENSOR 62
6.6 OPTICAL SENSOR 63
6.6.1 MICROBOLOMETER 65
6.6.2 PIR & THERMOPHILE 65
 

7 MEMS MARKET, BY ACTUATOR TYPE 67
7.1 INTRODUCTION 68
7.2 OPTICAL 70
7.3 MICROFLUIDICS 71
7.4 INKJET HEAD 72
7.5 RF 73
7.5.1 SWITCH 75
7.5.2 FILTER 75
7.5.3 OSCILLATOR 76

8 MEMS MARKET, BY VERTICAL 78
8.1 INTRODUCTION 79
8.2 AUTOMOTIVE 80
8.3 CONSUMER ELECTRONICS 83
8.4 DEFENSE 85
8.5 AEROSPACE 87
8.6 INDUSTRIAL 89
8.7 HEALTHCARE 91
8.8 TELECOM 93

9 GEOGRAPHIC ANALYSIS 95
9.1 INTRODUCTION 96
9.2 AMERICAS 97
9.2.1 US 98
9.2.2 CANADA 99
9.2.3 MEXICO 99
9.2.4 BRAZIL 100
9.2.5 REST OF THE AMERICAS 100
9.3 EUROPE 101
9.3.1 GERMANY 102
9.3.2 FRANCE 103
9.3.3 UK 103
9.3.4 ITALY 103
9.3.5 REST OF EUROPE 103
9.4 ASIA PACIFIC 105
9.4.1 CHINA 106
9.4.2 JAPAN 107
9.4.3 SOUTH KOREA 107
9.4.4 INDIA 107
9.4.5 REST OF APAC 108
 
9.5 ROW 109
9.5.1 MIDDLE EAST 110
9.5.2 AFRICA 110

10 COMPETITIVE LANDSCAPE 112
10.1 OVERVIEW 112
10.2 MARKET RANKING ANALYSIS 113
10.3 VENDOR DIVE OVERVIEW 114
10.3.1 VANGUARDS (LEADERS) 115
10.3.2 DYNAMIC 115
10.3.3 INNOVATOR 115
10.3.4 EMERGING 115
10.4 BUSINESS STRATEGY (FOR ALL 25 PLAYERS) 116
10.5 PRODUCT OFFERING (FOR ALL 25 PLAYERS) 117
*Top 25 Companies Analyzed for This Study are – STMicroelectronics N.V. (Switzerland), Robert Bosch GmbH (Germany), Analog Devices, Inc. (US), NXP Semiconductors N.V. (Netherlands), Texas Instruments Inc. (US), Panasonic Corp. (Japan), Murata Manufacturing, Co., Ltd. (Japan), Invensense, Inc. (US), Infineon Technologies AG (Germany), Asahi Kasei Microdevices Corp. (Japan), TE Connectivity Corp. (Switzerland), Sensata Technologies Holding N.V. (Netherlands), ROHM Co., Ltd. (Japan), Denso Corp. (Japan), Broadcom Ltd. (US), Honeywell International Inc. (US), Knowles Corp. (US), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), Omron Corp. (Japan), Seiko Epson Corp. (Japan), AAC Technologies Holdings Inc. (China), Alps Electric Co., Ltd. (Japan), Amphenol Corp. (US), UTC Aerospace Systems (US), and Goertek Inc. (China).
10.6 COMPETITIVE SCENARIO 118
10.6.1 NEW PRODUCT LAUNCHES 119
10.6.2 MERGERS AND ACQUISITIONS 121
10.6.3 PARTNERSHIPS, COLLABORATIONS, AND EXPANSIONS 122

11 COMPANY PROFILES 124
(Business Overview, Products offered & Services strategies, Key Insights, Recent Developments, MnM View)*
11.1 INTRODUCTION 124
11.2 STMICROELECTRONICS N.V. 125
11.3 ROBERT BOSCH GMBH 129
11.4 ANALOG DEVICES, INC. 133
11.5 NXP SEMICONDUCTORS N.V. 137
11.6 TEXAS INSTRUMENTS, INC. 141
11.7 PANASONIC CORP. 145
11.8 MURATA MANUFACTURING CO., LTD. 148
11.9 INVENSENSE, INC. 151
11.10 INFINEON TECHNOLOGIES AG 154
11.11 ASAHI KASEI MICRODEVICES CORP. 157
 
11.12 KEY INNOVATORS 160
11.12.1 ROHM CO., LTD. 160
11.12.2 SEIKO EPSON CORP. 160
11.12.3 ALPS ELECTRIC CO., LTD. 161
11.12.4 AMPHENOL CORP. 161
11.12.5 AAC TECHNOLOGIES HOLDINGS, INC. 162
*Details on Business Overview, Products offered & Services strategies, Key Insights, Recent Developments, MnM View might not be captured in case of unlisted companies.

12 APPENDIX 163
12.1 INSIGHTS OF INDUSTRY EXPERTS 163
12.2 DISCUSSION GUIDE 164
12.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 167
12.4 INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE 169
12.5 AVAILABLE CUSTOMIZATIONS 171
12.6 RELATED REPORTS 171
12.7 AUTHOR DETAILS 172