【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Report coverage
• Base year and forecast period
• Geographical segmentation
• Common currency conversion rates
• Vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
• Technology landscape
PART 05: Industry overview
• Overview of semiconductor packaging industry
• Global semiconductor industry value chain
PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by technology
• Global chip mounter market by technology
• SMT segment
• THT segment
PART 08: Market segmentation by application
• Global chip mounter market by application
• Application segmentation
PART 09: Geographical segmentation
• Global chip mounter market by region
• APAC
• EMEA
• Americas
PART 10: Market drivers
• Growing adoption of communication-related electronic gadgets
• Increase in chip density
• Miniaturization of electronics
PART 11: Impact of drivers
PART 12: Market challenges
• Cyclical nature of semiconductor industry
• Uncertain global economic conditions
PART 13: Impact of drivers and challenges
PART 14: Market trends
• Growing focus on IoT
• Increasing automation in automobiles
• Emergence of wearable technology
PART 15: Vendor landscape
• Competitive scenario
• Other prominent vendors
PART 16: Market summary
• Market figure snapshot
PART 17: Appendix
• List of abbreviations
PART 18: Explore Technavio
Exhibit 01: Global chip mounter market segmentation
Exhibit 02: Major countries covered
Exhibit 03: Currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Changes in semiconductor packaging size and component density
Exhibit 06: Evolution of semiconductor IC packaging
Exhibit 07:.5D IC packaging technology using TSVs and silicon interposers
Exhibit 08:D semiconductor packaging technology using TSVs
Exhibit 09: Semiconductor value chain
Exhibit 10: Front-end processes
Exhibit 11: Back-end processes
Exhibit 12: Global chip mounter market forecast 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Global chip mounter market by technology 2015
Exhibit 15: Global chip mounter market by technology 2020
Exhibit 16: SMT segment forecast of global chip mounter market 2015-2020 ($ billions)
Exhibit 17: THT segment forecast of global chip mounter market 2015-2020 ($ millions)
Exhibit 18: Global chip mounter market by application 2015-2020 (% share)
Exhibit 19: Global chip mounter market by application 2015-2020 ($ billions)
Exhibit 20: Global chip mounter market by communication segment 2015-2020 ($ billions)
Exhibit 21: Global chip mounter market by computer segment 2015-2020 ($ billions)
Exhibit 22: Global chip mounter market by consumer electronics segment 2015-2020 ($ millions)
Exhibit 23: Global chip mounter market by automotive segment 2015-2020 ($ millions)
Exhibit 24: Global chip mounter market by region 2015
Exhibit 25: Global chip mounter market by region 2020
Exhibit 26: Chip mounter market in APAC 2015-2020 ($ billions)
Exhibit 27: Chip mounter market in EMEA 2015-2020 ($ billions)
Exhibit 28: Chip mounter market in Americas 2015-2020 ($ billions)
Exhibit 29: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 30: Global tablet shipments forecast 2015-2020 (millions of units)
Exhibit 31: Impact of drivers
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Other prominent vendors
Exhibit 34: Key inferences
Exhibit 35: Market summary of global chip mounter market 2015-2020
Exhibit 36: Technology segments: Year-over-year revenue comparison ($ billions)
Exhibit 37: Geographical segments: Year-over-year revenue comparison ($ billions)
Exhibit 38: Geographical segments: Year-over-year revenue comparison ($ billions)
【レポート販売概要】
■ タイトル：チップマウンターの世界市場：スルーホール実装技術（THT）、面実装技術（SMT）■ 英文：Global Chip Mounter Market 2016-2020
■ 発行日：2016年6月28日
■ 調査会社：Technavio
■ 商品コード：IRTNTR9621
■ 調査対象地域：グローバル
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