【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market coverage
• Market size computation
• Market segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Global semiconductor market overview
• Wafer-level manufacturing equipment categories
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by material type
• Global bonding wire packaging material market by material type 2015
• Global bonding wire packaging material market by material type 2020
• Global bonding wire packaging material market by gold
• Global bonding wire packaging material market by PCC
• Global bonding wire packaging material market by copper
• Global bonding wire packaging material market by silver
PART 07: Geographical segmentation
• Global bonding wire packaging material market by geography 2015
• Global bonding wire packaging material market by geography 2020
• APAC
• North America
• Europe
• ROW
PART 08: Key leading countries
• Key leading countries in global bonding wire packaging material market
PART 09: Summary of key figures
PART 10: Market drivers
• Growing transition to copper wire
• Rising need for miniaturized semiconductor devices
PART 11: Impact of drivers
PART 12: Market challenges
• Limitations of copper wire
• Migration to flip chip packaging technology
PART 13: Impact of drivers and challenges
PART 14: Market trends
• Silver bonding wire as upcoming alternative
• Migration to smaller diameter wires
PART 15: Vendor landscape
• Competitive scenario
• Other prominent vendors
PART 16: Appendix
• List of abbreviations
PART 17: Explore Technavio
List of Exhbitis
Exhibit 01: Segmentation of global bonding wire packaging material market
Exhibit 02: Key regions
Exhibit 03: Common currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Chemical composition of semiconductor materials
Exhibit 06: Top ten semiconductor vendors 2015
Exhibit 07: Global semiconductor market structure 2015
Exhibit 08: Global semiconductor market structure 2015
Exhibit 09: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 10: Semiconductor IC manufacturing process
Exhibit 11: Front-end chip formation steps
Exhibit 12: Back-end chip formation steps
Exhibit 13: Wafer-level manufacturing equipment categories
Exhibit 14: Requirements of manufacturing equipment
Exhibit 15: Semiconductor industry value chain
Exhibit 16: Global bonding wire packaging material market 2015-2020 ($ billions)
Exhibit 17: Five forces analysis
Exhibit 18: Global bonding wire packaging material market by material type 2015
Exhibit 19: Global bonding wire packaging material market by material type in 2020
Exhibit 20: Global bonding wire packaging material market by gold ($ millions)
Exhibit 21: Global bonding wire packaging material market by PCC ($ billions)
Exhibit 22: Global bonding wire packaging material market by copper ($ millions)
Exhibit 23: Global bonding wire packaging material market by silver ($ millions)
Exhibit 24: Segmentation of silver wire application
Exhibit 25: Global bonding wire packaging material market by geography 2015
Exhibit 26: Global bonding wire packaging material market by geography 2020
Exhibit 27: Bonding wire packaging material market in APAC 2015-2020 ($ billions)
Exhibit 28: Bonding wire packaging material market in North America 2015-2020 ($ millions)
Exhibit 29: Bonding wire packaging material market in Europe 2015-2020 ($ millions)
Exhibit 30: Bonding wire packaging material market in ROW 2015-2020 ($ millions)
Exhibit 31: Key leading countries in global bonding wire packaging material market 2015
Exhibit 32: Key leading countries in global bonding wire packaging material market 2020
Exhibit 33: Material-type segments: Year-over-year revenue comparison ($ millions)
Exhibit 34: Geographical segments: Year-over-year revenue comparison ($ millions)
Exhibit 35: Impact of drivers
Exhibit 36: Impact of drivers and challenges
Exhibit 37: Other prominent vendors
【レポート販売概要】
■ タイトル：ボンディングワイヤ・パッケージング材料の世界市場2016-2020■ 英文：Global Bonding Wire packaging material market 2016-2020
■ 発行日：2016年6月16日
■ 調査会社：Technavio
■ 商品コード：IRTNTR9278
■ 調査対象地域：グローバル
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