【レポートの概要（一部）】
1 Introduction (Page No. – 16)
1.1 Objectives of The Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for The Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders
2 Research Methodology (Page No. – 21)
2.1 Research Data
2.2 Market Size Estimation
2.3 Market Breakdown and Data Triangulation
2.4 Market Size Estimation
2.4.1 Secondary Data
2.4.1.1 Key Data From Secondary Sources
2.4.2 Primary Data
2.4.2.1 Key Data From Primary Sources
2.4.3 Key Industry Insights
2.4.4 Assumptions
3 Executive Summary (Page No. – 30)
4 Premium Insights (Page No. – 35)
4.1 Global Liquid Encapsulation Materials Market is Expected to Grow at A Stable Rate Till 2020
4.2 Global Market – Product Segment
4.3 Global Market, By Application
4.4 Global Market, Million USD (2015)
4.5 Taiwan Held The Largest Share of The Market, 2015 (USD Million)
4.6 Global Market (2015–2020)
4.7 Global Liquid Encapsulation Materials Market, By Product (2015–2020)
4.8 Life Cycle Analysis, By Geography
5 Market Overview (Page No. – 43)
5.1 Introduction
5.2 Market Segmentation
5.2.1 By Material
5.2.2 By Product
5.2.3 By Application
5.3 Market Dynamics
5.3.1 Drivers
5.3.1.1 Growing Demand for Advanced Packaging Techniques
5.3.1.2 Rising Demand for Consumer Electronics Products
5.3.1.3 Trend of Miniaturization of Electronic Products is Expected to Drive The Growth of The Liquid Encapsulation Materials Market
5.3.2 Restraints
5.3.2.1 Sluggish Demand for Liquid Encapsulants in Developed Regions Such as North America & Europe
5.3.3 Opportunities
5.3.3.1 Automotive Electronics Application Offering New Growth Avenues for The Global Market
5.3.4 Challenges
5.3.4.1 Recovering The Leading Position for Developed Regions in The Semiconductor Materials Industry
6 Industry Trends (Page No. – 53)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Overview of Recent Patents in Liquid Encapsulation
6.4 Strategic Benchmarking
6.4.1 Major Strategies Adopted By The Key Players
7 Market, By Material (Page No. – 58)
7.1 Introduction
8 Market, By Product (Page No. – 67)
8.1 Introduction
8.2 Integrated Circuits
8.3 Optoelectronics
8.4 Discrete Semiconductors
8.5 Sensors
9 Market, By Application (Page No. – 75)
9.1 Introduction
9.2 Automotive
9.3 Industrial
9.4 Telecommunication
9.5 Electronics
10 Geographic Analysis (Page No. – 98)
10.1 Introduction
10.2 Americas
10.2.1 North America
10.2.1.1 The U.S.
10.2.1.2 Canada
10.2.1.3 Rest of North America
10.2.2 South America
10.3 Europe
10.3.1 Germany
10.3.2 U.K.
10.3.3 France
10.3.4 Italy
10.3.5 Rest of Europe
10.4 Asia-Pacific (APAC)
10.4.1 Japan
10.4.2 China
10.4.3 Taiwan
10.4.4 South Korea
10.4.5 Rest of APAC
10.5 Rest of The World
10.5.1 Middle East
10.5.2 Africa
11 Competitive Landscape (Page No. – 142)
11.1 Overview
11.2 Key Players in Global Liquid Encapsulation Materials Market
11.3 Competitive Situation and Trends
11.3.1 New Product Launches
11.3.2 Mergers & Acquisitions
11.3.3 Other Developments
11.3.4 Expansions
11.3.5 Joint Ventures
12 Company Profiles (Page No. – 152)
12.1 Introduction
12.2 Sumitomo Bakelite Co., Ltd.
12.2.1 Business Overview
12.2.2 Product Portfolio
12.2.3 Recent Developments
12.2.4 MnM View
12.2.4.1 Key Strategy
12.2.4.2 SWOT Analysis
12.3 Shin-Etsu Chemical Co., Ltd
12.3.1 Business Overview
12.3.2 Product Portfolio
12.3.3 Recent Developments
12.3.4 MnM View
12.3.4.1 Key Strategy
12.3.4.2 SWOT Analysis
12.4 Panasonic Coporation
12.4.1 Business Overview
12.4.2 Product Portfolio
12.4.3 Recent Developments
12.4.4 MnM View
12.4.4.1 Key Strategy
12.4.4.2 SWOT Analysis
12.5 Kyocera Corporation (Japan)
12.5.1 Business Overview
12.5.2 Product Portfolio
12.5.3 Recent Developments
12.5.4 MnM View
12.5.4.1 Key Strategy
12.5.4.2 SWOT Analysis
12.6 Hitachi Chemical Co., Ltd.
12.6.1 Business Overview
12.6.2 Product Portfolio
12.6.3 Recent Developments
12.6.4 MnM View
12.6.4.1 Key Strategy
12.6.4.2 SWOT Analysis
12.7 Henkel AG and Co. KGAA
12.7.1 Business Overview
12.7.2 Product Portfolio
12.7.3 Recent Developments
12.8 Nagase & Co., Ltd.
12.8.1 Business Overview
12.8.2 Product Portfolio
12.8.3 Recent Developments
12.9 Nitto Denko Corporation
12.9.1 Business Overview
12.9.2 Product Portfolio
12.9.3 Recent Developments
12.10 BASF SE
12.10.1 Business Overview
12.10.2 Product Portfolio
12.10.3 Recent Developments
12.11 Epic Resins
12.11.1 Business Overview
12.11.2 Product Portfolio
12.11.3 Recent Developments
12.12 Resin Technical Systems
12.12.1 Business Overview
12.12.2 Product Portfolio
12.13 Sanyu Rec Co., Ltd.
12.13.1 Business Overview
12.13.2 Product Portfolio
13 Appendix (Page No. – 181)
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Introducing RT: Real-Time Market Intelligence
13.4 Available Customizations
13.5 Related Reports
【レポート販売概要】
■ タイトル：半導体液状封止材の世界市場：エポキシ樹脂、変性エポキシ樹脂■ 英文：Liquid Encapsulation Materials Market by Material (Epoxy Resin & Epoxy-Modified Resin), Product (Integrated Circuits, Optoelectronics & Sensors), Application (Automotive, Telecommunication & Electronics), and Geography - Global Forecast to 2020
■ 発行日：2015年10月8日
■ 調査会社：MarketsandMarkets
■ 商品コード：MAM-SE-3807
■ 調査対象地域：グローバル
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