【レポートの概要（一部）】
1 Introduction (Page No. – 15)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Years Considered for the Study
1.4 Currency
1.5 Limitations
1.6 Stakeholders
2 Research Methodology (Page No. – 19)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Market Size Estimation
2.3 Market Breakdown & Data Triangulation
2.4 Research Assumptions and Limitations
2.4.1 Assumptions
2.4.2 Limitations
3 Executive Summary (Page No. – 27)
4 Premium Insights (Page No. – 32)
4.1 Attractive Market Opportunities in the CMP Market
4.2 High Growth Opportunities in the Asia-Pacific Region
4.3 The Global CMP Market 2014
4.4 CMP Equipment Market Would Witness A High Growth Rate During the Forecast Period
4.5 Global CMP Consumable Market, 2014
4.6 Global CMP Market, By Application (2014–2020)
4.7 Global CMP Market, By Technology (2014–2020)
5 Market Overview (Page No. – 36)
5.1 Introduction
5.2 Evolution
5.2.1 Before 1980:Early Stage
5.2.2 1980 to 1990: Birth of A Sub-Industry
5.2.3 1990–2000:Evolution and Growth
5.2.4 Post 2000 to Present: CMP Continues to Evolve
5.3 Market Segmentation
5.3.1 Market, By Type
5.3.2 Market, By Technology
5.3.3 Market, By Application
5.3.4 Market, By Geography
5.4 Market Dynamics
5.4.1 Drivers
5.4.1.1 Growing Need of Planarization in the Semiconductor Industry
5.4.1.2 High Demand for Consumer Products Such as Smartphones, Tablets, and Other Electronic Devices
5.4.1.3 Increasing Use of MEMS is Fueling the Growth of the CMP Market
5.4.2 Restraints
5.4.2.1 Cyclical and Fluctuating Nature of Semiconductor Industry
5.4.3 Opportunities
5.4.3.1 Evolving Leading-Edge and Advanced Technologies are Creating Potential Growth Opportunities
5.4.3.2 Positive Outlook of the Semiconductor Industry Propelled By the High Growth Opportunities in the Asia-Pacific Region
5.4.4 Challenges
5.4.4.1 Technology Node Progression and Emphasis on Improving Production Efficiency
6 Industry Trends (Page No. – 46)
6.1 Introduction
6.2 Value Chain Analysis
6.3 Industry Trends
6.4 Porter’s Five Forces Analysis
6.4.1 Threat of New Entrants
6.4.2 Threat of Substitutes
6.4.3 Bargaining Power of Suppliers
6.4.4 Bargaining Power of Buyers
6.4.5 Degree of Competition
7 Chemical Mechanical Planarization: Synopsis (Page No. – 54)
7.1 Semiconductor Wafer Fabrication Process
7.2 Current Trend in Semiconductor Industry: Moore’s Law
7.3 Need for Planarization
7.4 Planarization Techniques
7.5 Working Principle of Chemical Mechanical Planarization
7.6 Advantages and Disadvantages of Chemical Mechanical Planarization
7.7 Types of Chemical Mechanical Planarization Process
7.7.1 Metal CMP
7.7.2 Dielectric CMP
7.8 Chemical Mechanical Planarization Process Parameter
8 Chemical Mechanical Planarization Market, By Type (Page No. – 59)
8.1 Introduction
8.2 CMP Equipment
8.3 CMP Consumable
8.3.1 Slurry
8.3.1.1 Physical Properties of Slurries
8.3.1.2 Performance Properties of Slurries
8.3.1.3 Type of Slurries
8.3.2 PAD
8.3.3 PAD Conditioner
8.3.4 Others
9 Chemical Mechanical Planarization Market, By Technology (Page No. – 74)
9.1 Introduction
9.2 Leading Edge
9.3 More Than Moore’s
9.4 Emerging
10 Chemical Mechanical Planarization Market, By Application (Page No. – 87)
10.1 Introduction
10.2 Integrated Circuits
10.3 Mems & Nems
10.4 Compound Semiconductors
10.5 Optics
10.6 Others
11 Chemical Mechanical Planarization Market, By Geography (Page No. – 97)
11.1 Introduction
11.2 North America
11.2.1 U.S.
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 U.K.
11.3.2 France
11.3.3 Germany
11.4 Asia-Pacific (APAC)
11.4.1 Taiwan
11.4.2 South Korea
11.4.3 Japan
11.4.4 China
11.5 The Rest of the World (RoW)
12 Competitive Landscape (Page No. – 111)
12.1 Overview
12.2 Market Share Analysis: CMP Equipment Market, 2014
12.3 Market Share Analysis: CMP Consumable Market, 2014
12.4 Competitive Situation and Trends
12.4.1 Agreements, Partnerships, Collaborations, and Contracts
12.4.2 New Product Launches
12.4.3 Expansions, Awards, & Other Strategies
12.4.4 Mergers & Acquisitions
13 Company Profiles (Page No. – 118)
(Overview, Products and Services, Financials, Strategy & Development)*
13.1 Introduction
13.2 Applied Materials, Inc.
13.3 Ebara Corporation
13.4 Lapmaster Wolters GmbH
13.5 LAM Research Corporation
13.6 Strasbaugh Inc.
13.7 Okamoto Machine Tool Works, Ltd.
13.8 Cabot Microelectronics Corporation
13.9 DOW Electronic Materials
13.10 Fujimi Incorporated
13.11 Hitachi Chemical Company, Ltd.
13.12 Air Products & Chemicals, Inc.
*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Captured in Case of Unlisted Companies.
14 Appendix (Page No. – 143)
14.1 Insights of Industry Experts
14.2 Discussion Guide
14.3 Introducing RT: Real-Time Market Intelligence
14.4 Available Customizations
14.5 Related Reports
【レポート販売概要】
■ タイトル：化学機械平坦化（CMP）の世界市場：研磨装置、研磨消耗品■ 英文：Chemical Mechanical Planarization Market by type (Equipment & consumables), Application(IC manufacturing, MEMS & NEM, Optics and Others), Technology (Leading edge, More Than Moore’s, and Emerging), and Geography (North America, Europe, APAC and RoW) - Global Forecast to 2020
■ 発行日：2015年10月9日
■ 調査会社：MarketsandMarkets
■ 商品コード：MAM-SE-3820
■ 調査対象地域：グローバル
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