【レポートの概要(一部)】
Table Of Contents
1 Introduction (Page No. – 18)
1.1 Key Take-Aways
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Report Assumptions
1.6 Research Methodology
1.6.1 Market Size Estimation
1.6.2 Market Crackdown And Data Triangulation
1.6.3 Key Data Points Taken From Secondary Sources
1.6.4 Key Data Points Taken From Primary Sources
1.6.5 List Of Major Companies And Organizations Covered In Primary Research
2 Executive Summary (Page No. – 29)
3 Cover Story (Page No. – 32)
4 Market Overview (Page No. – 35)
4.1 Introduction
4.2 Market Definition And Scope
4.3 Market Segmentation
4.4 History & Evolution Of Laser Cutting, Drilling, Marking and Engraving Market
4.5 Technology And Application Trends
4.6 Advantages Of Laser Material Processing
4.7 The Industrial Safety Factors
4.7.1 Maximum Permissible Exposure (MPE) Levels
4.7.2 Classification
4.7.2.1 By IEC Standard
4.7.2.2 By ANSI Standard
4.8 Market Dynamics
4.8.1 Drivers
4.8.1.1 Government Regulations For Compulsory Use Of Laser Marking
4.8.1.2 Outclassing Every Other Substitute Tools
4.8.1.3 Demand For The Aesthetics
4.8.1.4 Emerging Application In Oil And Gas Exploration Field
4.8.1.5 The Introduction Of Direct Diode Lasers
4.8.2 Restraints
4.8.2.1 High Initial Investment And High Maintenance Cost
4.8.2.2 Eurozone Crises
4.8.2.3 Rare Earth Elements Mining: Environmental Concerns
4.8.3 Opportunities
4.8.3.1 High Adoption Of Disk Lasers
4.8.3.2 Automotive Lights
4.8.3.3 Other Emerging Applications And Processes
4.9 Burning Issues
4.9.1 Technical Challenges With High Power Lasers
4.9.2 Safety Issues With Lasers
4.10 Winning Imperatives
4.10.1 Product Innovation Is The Key
4.10.2 Vertical Consolidation
4.10.3 Laser Doping Of Solar Cells (Lassol): Technology For Solar Cells
4.11 Porter’s Five Forces Model
4.11.1 Threat From New Entrants
4.11.2 Threat From Substitutes
4.11.3 Bargaining Power Of Suppliers
4.11.4 Bargaining Power Of Buyers
4.11.5 Degree Of Competition
4.12 Value Chain
4.13 Price Trend Analysis
5 Segmentation By Technology (Page No. – 74)
5.1 Introduction
5.2 Lasers Source And Laser System Market Comparison
5.3 Gas Lasers
5.3.1 Co2 Lasers
5.3.2 Excimer Lasers
5.4 Solid State Lasers
5.4.1 ND:YAG Laser
5.4.2 ER: YAG Laser
5.5 Fiber Lasers
5.6 Semiconductor Lasers
6 Segmentation By Process (Page No. – 100)
6.1 Introduction
6.2 Cutting And Drilling
6.2.1 Cutting
6.2.1.1 Fusion Cutting
6.2.1.2 Flame Cutting
6.2.1.3 Sublimation Cutting
6.2.2 Drilling
6.2.2.1 Single Pulse Drilling
6.2.2.2 Percussion Drilling
6.2.2.3 Trepanning Drilling
6.2.2.4 Helical Drilling
6.3 Marking And Engraving
6.3.1 Direct Laser Engraving
6.3.2 Direct Photopolymer Laser Imaging
6.3.3 Sub Surface Laser Engraving
6.4 Micro-Processing
6.5 Advanced Processing
7 Segmentation By Machine Configuration (Page No. – 121)
7.1 Introduction
7.2 Types Of Configuration For Laser Cutting
7.2.1 Moving Material Laser Configuration
7.2.2 Flying Optics Systems Laser Configuration
7.2.3 Hybrid Laser Configuration
7.3 Types Of Configuration For Laser Engraving
7.3.1 X-Y Surface Based
7.3.2 Cylindrical Work Pieces
7.3.3 Stationed Laser Machine
8 Segmentation By Vertical (Page No. – 129)
8.1 Introduction
8.2 Aerospace
8.3 Architecture
8.3.1 Architecture Vertical Segmentation By Process
8.4 Automotive
8.4.1 Automotive Vertical Segmentation By Process
8.5 Commercial
8.5.1 Commercial Vertical Segmentation By Process
8.5.2 Commercial Vertical Segmentation By Application
8.6 Consumer Electronics
8.6.1 Consumer Electronic Vertical Segmentation By Application
8.7 General Machine Tooling
8.7.1 General Machine Tooling Vertical Segmentation By Process
8.7.2 General Machine Tooling Vertical Segmentation By Application
8.8 Semiconductor & Electronics
8.8.1 Semiconductor & Electronics Vertical Segmentation By Process
8.8.2 Semiconductor & Electronics Vertical Segmentation By Application
9 Segmentation By Geography (Page No. – 148)
9.1 Introduction
9.2 North America
9.3 Europe
9.4 APAC
9.5 Row
10 Competitive Landscape (Page No. – 155)
10.1 Overview
10.2 Market Share Analysis
10.3 Key Growth Strategies
10.4 Competitive Situation And Trends
10.4.1 New Product Developments & Announcements
10.4.2 Agreements, Partnerships, Joint Ventures And Collaborations
10.4.3 Mergers And Acquisitions
11 Company Profiles (Overview, Products & Services, Financials, Strategy And Developments)* (Page No. – 168)
11.1 Alltec GMBH
11.2 Alpha Nov Laser
11.3 Bystronic, Inc.
11.4 Coherent, Inc.
11.5 DPSS Laser, Inc.
11.6 Epilog Laser, Inc.
11.7 Eurolaser GMBH
11.8 IPG Photonics Corporation
11.9 Jenoptik Laser GMBH
11.10 Laserstar Technologies Corporation
11.11 Needham Laser Ltd.
11.12 Newport Corporation
11.13 Prima Industries S.P.A.
11.14 Q-Peak, Inc.
11.15 Rofin-Sinar Technologies, Inc.
11.16 SEI Laser S.P.A
11.17 Trotec Laser, Inc.
11.18 Trumpf Laser GMBH + Co. Kg
11.19 Universal Laser Systems, Inc.
11.20 Xenetech Global, Inc.
*Details On Overview, Products & Services, Financials, Strategy And Developments Might Not Be Captured In Case Of Unlisted Companies.
【レポート販売概要】
■ タイトル:世界のレーザー切断、レーザ穴あけ、レーザーマーキング市場■ 英文:Laser Cutting, Drilling, Marking and Engraving Market by Technology (Co2 Laser, Excimer Laser, ND: YAG Laser, Fiber Laser); Base Material (Metals, Polymers); Application (Electronics, Machine Part Marking, Medical, Signage) & Geography- (2013 - 2018)
■ 発行日:2013年5月
■ 調査会社:MarketsandMarkets
■ 商品コード:SE 1516
■ 調査対象地域:グローバル
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