ミックスドシグナル・システムオンチップ(SoC)IPコアの世界市場...市場調査レポートについてご紹介

【英文タイトル】Global Mixed Signal SoC IP Market 2014-2018

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ミックスドシグナル・システムオンチップ(SoC)IPコアの世界市場 (Code:IRTNTR4751)

【レポートの概要(一部)】

About Semiconductor IP
A semiconductor IP core or an IP block is a reusable unit of logic, a cell or a chip layout design that is the IP of a party. IP cores may be licensed to another party or owned and used by a single party alone. An IP core is used as a building block within application-specific integrated circuit chip designs or field-programmable gate array logic designs. An IP core can be described as a block of logic that can be used directly in any chip design process. IP cores are typically offered as synthesizable resistor–transistor logic. Synthesizable IP cores are delivered in a hardware description language such as Verilog or very high-speed IC hardware description language.

TechNavio’s analysts forecast the Global Mixed signal SoC IP market will grow at a CAGR of 20.35 percent over the period 2013-2018.

[Covered in this Report]
Based on application, the Global Mixed Signal SoC IP market can be segmented into eight segments: Mixed Signal SoC Processor IP, Mixed Signal SoC ARM processor IP, Mixed Signal SoC Memory IP, Mixed Signal SoC Programmable Logic IP, Mixed Signal SoC ASIC IP, Mixed Signal SoC Data Converter IP, Mixed Signal SoC Digital IP, and Mixed Signal SoC Analog IP.
TechNavio’s report, the Global Mixed Signal SoC IP market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, the APAC region, and the EMEA region; it also covers the market landscape and its growth prospects in the coming years. The report also includes a discussion on the key vendors operating in this market.

[Key Regions]
• Americas
• APAC
• EMEA

[Key Vendors]
• ARM Holdings
• Cadence Design Systems
• CEVA
• Imagination Technologies Group
• Synopsys

[Other Prominent Vendors]
• Faraday Technology
• Rambus
• Silicon Image
• Sonics

[Market Driver]
• Increasing Demand for Wireless Computing Device
• For a full, detailed list, view our report

[Market Challenge]
• High Development Cost of Mixed Signal SoC IPs
• For a full, detailed list, view our report

[Market Trend]
• Growing Technological Convergence
• For a full, detailed list, view our report

[Key Questions Answered in this Report]
• What will the market size be in 2018 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

.....

【日本語概要(※自動翻訳出力)】

※以下は、Microsoft社の翻訳システムを使用した自動翻訳結果です。レイアウト崩れと不自然な日本語表現が多く表示されます。

。。。(後略)

【レポートの目次(一部)】

01. Executive Summary

02.List of Abbreviations

03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05.Introduction

06.Market Landscape
06.1 Market Overview

07.Technology Landscape
07.1 Market Size and Forecast
Market Forecast
07.2 Five Forces Analysis

08.Market Segmentation by Product
08.1 Global Mixed Signal SoC IP Market by Product 2013-2018

09.Geographical Segmentation
09.1 Global Mixed Signal SoC IP Market by Geographical Segmentation

10.Buying Criteria

11.Market Growth Drivers

12.Drivers and their Impact

13.Market Challenges

14.Impact of Drivers and Challenges

15.Market Trends

16.Trends and their Impact

17.Vendor Landscape
17.1 Competitive Scenario
17.2 Market Share Analysis 2013
17.3 Other Prominent Vendors
17.3.1 Faraday Technology
17.3.2 Rambus
17.3.3 Silicon image
17.3.4 Sonics

18.Key Vendor Analysis
18.1 ARM Holdings
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Business Segmentation by Revenue 2012 and 2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 Cadence Design Systems
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Service Offerings
18.2.4 Solutions
18.2.5 Geographical Segmentation by Revenue 2013
18.2.6 Business Strategy
18.2.7 Recent Developments
18.2.8 SWOT Analysis
18.3 CEVA
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Business Segmentation by Revenue 2013
18.3.4 Business Segmentation by Revenue 2011-2013
18.3.5 Geographical Segmentation by Revenue 2013
18.3.6 Business Strategy
18.3.7 Recent Developments
18.3.8 SWOT Analysis
18.4 Imagination Technologies Group
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2014
18.4.4 Business Segmentation by Revenue 2013 and 2014
18.4.5 Geographical Segmentation by Revenue 2014
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Synopsys
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Business Segmentation by Revenue 2013
18.5.4 Business Segmentation by Revenue 2011-2013
18.5.5 Geographical Segmentation by Revenue 2013
18.5.6 Business Strategy
18.5.7 Recent Developments
18.5.8 SWOT Analysis

19.Other Reports in this Series

[List of Exhibits]
Exhibit 1: Market Research Methodology
Exhibit 2: Types of Semiconductor IP
Exhibit 3: Mixed Signal SoC Design
Exhibit 4: Global Mixed Signal SoC Market Value Chain
Exhibit 5: Global Mixed Signal SoC IP Market 2013-2018 (US$ million)
Exhibit 6: Global Mixed Signal SoC IP Market by Product Segmentation 2013-2018
Exhibit 7: CAGR Comparison
Exhibit 8: Global Mixed Signal SoC IP Market by Geographical Segmentation 2013-2018 (CAGR)
Exhibit 9: Global Mixed Signal SoC IP Market by Geographical Segmentation 2013-2018
Exhibit 10: Global Market for Wireless Computing Devices 2013-2018 (US$ billion)
Exhibit 11: Third Party IP Design Use in 2013
Exhibit 12: Global Mixed signal SoC IP Market by Vendor Segmentation 2013
Exhibit 13: ARM Holdings: Business Segmentation by Revenue 2013
Exhibit 14: ARM Holdings: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 15: ARM Holdings: Geographical Segmentation by Revenue 2013
Exhibit 16: Cadence Design Systems: Service Offerings
Exhibit 17: Cadence Design Systems: Solutions
Exhibit 18: Cadence Design Systems: Geographical Segmentation by Revenue 2013
Exhibit 19: CEVA: Business Segmentation by Revenue 2013
Exhibit 20: CEVA: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 21: CEVA: Geographical Segmentation by Revenue 2013
Exhibit 22: Imagination Technologies Group: Business Segmentation by Revenue 2014
Exhibit 23: Imagination Technologies Group: Business Segmentation by Revenue 2013 and 2014 (US$ billion)
Exhibit 24: Imagination Technologies Group: Geographical Segmentation by Revenue 2014
Exhibit 25: Global Global Mixed Signal SoC IP market: Business Segmentation by Revenue 2013
Exhibit 26: Global Global Mixed Signal SoC IP market: Business Segmentation by Revenue 2011-2013 (US$ billion)
Exhibit 27: Global Global Mixed Signal SoC IP market: Geographical Segmentation by Revenue 2013

.....

【日本語目次(※自動翻訳出力)】

※以下は、Microsoft社の翻訳システムを使用した自動翻訳結果です。レイアウト崩れと不自然な日本語表現が多く表示されます。

。。。(後略)

【レポート販売概要】

■ タイトル:ミックスドシグナル・システムオンチップ(SoC)IPコアの世界市場
■ 英文:Global Mixed Signal SoC IP Market 2014-2018
■ 発行日:2014年12月10日
■ 調査会社:Technavio
■ 商品コード:IRTNTR4751
■ 調査対象地域:グローバル

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼
ミックスドシグナル・システムオンチップ(SoC)IPコアの世界市場 (Global Mixed Signal SoC IP Market 2014-2018 / IRTNTR4751)

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