データバスの世界市場予測(~2021年):マイクロカプラー、ケーブル、コネクター、アクセサリー...市場調査レポートについてご紹介

【英文タイトル】Data Bus Market by Protocol (MIL-STD-1553, AFDX/ARINC 664, ARINC 429/629, CAN, TTP), Application (Marine, Commercial Aviation, Military Aviation, Automotive), Component (Micro couplers, Cables, Connectors, Accessories), and Region - Global Forecast to 2021

▼当市場調査レポートの詳細内容確認、お問い合わせ及びご購入申込は下記ページでお願いします。▼マーケットレポート

【レポートの概要(一部)】

1 Introduction (Page No. – 16)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Market Covered
1.3.2 Geographical Coverage
1.3.3 Years Considered for the Study
1.4 Currency & Pricing
1.5 Study Limitations
1.6 Market Shareholders

2 Research Methodology (Page No. – 20)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Factor Analysis
2.2.1 Demand-Side Analysis
2.2.1.1 New Airline Business Models & Emerging Economies
2.2.2 Supply Side Analysis
2.2.2.1 Global It Spending
2.2.2.2 Aircraft Deliveries (2016-2035)
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Market Breakdown & Data Triangulation
2.5 Assumptions

3 Executive Summary (Page No. – 35)
3.1 Evolution of Military Data Bus
3.2 North America to Lead Data Bus Market
3.3 Can Protocol to Have Largest Market Share During Forecast Period
3.4 New Product Launches are the Key Focus to Cater to New Requirements Across Applications

4 Premium Insights (Page No. – 41)
4.1 Increasing Global Demand for Data Bus
4.2 Data Bus Market Size, By Protocol, 2016 & 2021
4.3 Market Size, By Application, 2016 & 2021
4.4 Market Size, By Component, 2016 & 2021
4.5 Market Share and Growth Analysis, By Region
4.6 Life Cycle Analysis, By Region

5 Market Overview (Page No. – 44)
5.1 Introduction
5.2 Market Segmentation
5.2.1 By Protocol
5.2.2 By Application
5.2.3 By Component
5.2.4 By Region
5.3 Evolution of Data Bus Protocols
5.4 Market Dynamics
5.4.1 Drivers
5.4.1.1 Need to Reduce Swap Specifications
5.4.1.2 Increase in Commercial Aircraft Deliveries
5.4.1.3 Need for Data Integrity & Reliability
5.4.1.4 Need for Acquisition of Flight Data Units
5.4.1.5 Need to Reduce Wiring in Aircraft
5.4.1.6 Telematics
5.4.1.7 Modernization of Military Aircraft
5.4.1.8 Intensive Electrification in Automotive, Commercial Aviation, and Maritime Applications
5.4.2 Restraints
5.4.2.1 Defense Budget Cuts
5.4.2.2 Product Life Cycle
5.4.3 Challenges
5.4.3.1 Increasing Bandwidth
5.4.3.2 Certification Process
5.4.4 Opportunities
5.4.4.1 Glass Cockpits
5.4.4.2 Luxury Car Segment
5.4.5 Burning Issues
5.4.5.1 Safety Critical AFDX
5.4.5.2 Evolution of Mil-Std 1553
5.4.6 Wining Imperative
5.4.6.1 Developing Cost-Efficient Data Bus

6 Industry Trends (Page No. – 55)
6.1 Introduction
6.2 Supply Chain Analysis
6.3 Value Chain Analysis
6.4 Industry Trends
6.5 Strategic Benchmarking
6.5.1 Technological Integration & Product Enhancement
6.6 Technology Trends
6.6.1 Fiber Optic Cables Over Copper Cables
6.6.2 Ethernet
6.6.3 Distributed Architecture
6.6.4 Emerging TTP to As6802
6.6.5 Flexray as an Emerging Automotive Protocol
6.6.6 Fly-By-Optics
6.6.7 Lightweight Data Bus Cables

7 Data Bus Market, By Component (Page No. – 63)
7.1 Introduction
7.2 Micro Couplers
7.3 Cables
7.4 Connectors
7.5 Accessories

8 Data Bus Market, By Application (Page No. – 70)
8.1 Introduction
8.2 Marine
8.3 Commercial Aviation
8.4 Military Aviation
8.5 Automotive

9 Data Bus Market, By Protocol (Page No. – 78)
9.1 Introduction
9.2 Arinc 429/629
9.3 Can
9.4 TTP
9.5 AFDX/Arinc 664
9.6 Mil-Std 1553
9.6.1 Factors Influencing the Growth of the Mil-Std 1553 Segment in the Data Bus Market

10 Data Bus Market, By Region (Page No. – 83)
10.1 Introduction
10.2 North America
10.2.1 By Protocol
10.2.2 By Application
10.2.3 By Component
10.2.4 By Country
10.2.4.1 U.S.
10.2.4.1.1 By Protocol
10.2.4.1.2 By Application
10.2.4.1.3 By Component
10.2.4.2 Canada
10.2.4.2.1 By Protocol
10.2.4.2.2 By Application
10.2.4.2.3 By Component
10.3 Europe
10.3.1 By Protocol
10.3.2 By Application
10.3.3 By Component
10.3.4 By Country
10.3.4.1 U.K.
10.3.4.1.1 By Protocol
10.3.4.1.2 By Application
10.3.4.1.3 By Component
10.3.4.2 Russia
10.3.4.2.1 By Protocol
10.3.4.2.2 By Application
10.3.4.2.3 By Component
10.3.4.3 France
10.3.4.3.1 By Protocol
10.3.4.3.2 By Application
10.3.4.3.3 By Component
10.3.4.4 Germany
10.3.4.4.1 By Protocol
10.3.4.4.2 By Application
10.3.4.4.3 By Component
10.4 Asia-Pacific
10.4.1 By Protocol
10.4.2 By Application
10.4.3 By Component
10.4.4 By Country
10.4.4.1 China
10.4.4.1.1 By Protocol
10.4.4.1.2 By Application
10.4.4.1.3 By Component
10.4.4.2 India
10.4.4.2.1 By Protocol
10.4.4.2.2 By Application
10.4.4.2.3 By Component
10.4.4.3 South Korea
10.4.4.3.1 By Protocol
10.4.4.3.2 By Application
10.4.4.3.3 By Component
10.4.4.4 Japan
10.4.4.4.1 By Protocol
10.4.4.4.2 By Application
10.4.4.4.3 By Component
10.5 The Middle East
10.5.1 By Protocol
10.5.2 By Application
10.5.3 By Component
10.5.4 By Country
10.5.4.1 Saudi Arabia
10.5.4.1.1 By Protocol
10.5.4.1.2 By Application
10.5.4.1.3 By Component
10.5.4.2 U.A.E.
10.5.4.2.1 By Protocol
10.5.4.2.2 By Application
10.5.4.2.3 By Component
10.6 Rest of the World (RoW)
10.6.1 By Protocol
10.6.2 By Application
10.6.3 By Component
10.6.4 By Country
10.6.4.1 Brazil
10.6.4.1.1 By Protocol
10.6.4.1.2 By Application
10.6.4.1.3 By Component
10.6.4.2 South Africa
10.6.4.2.1 By Protocol
10.6.4.2.2 By Application
10.6.4.2.3 By Component

11 Competitive Landscape (Page No. – 131)
11.1 Overview
11.2 Market Share Analysis, By Company
11.3 Regional Market Share Analysis
11.4 Competitive Situation & Trends
11.4.1 New Product Launches & Developments
11.4.2 Agreements
11.4.3 Acquisitions
11.4.4 Contracts
11.4.5 Partnerships
11.4.6 Other Developments

12 Company Profiles (Page No. – 143)
12.1 Introduction
12.2 Financial Highlights of Key Players
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
12.3 TE Connectivity Ltd.
12.4 Amphenol Corporation
12.5 Fujikura Ltd.
12.6 Esterline Technologies Corporation
12.7 Corning Inc.
12.8 Rockwell Collins
12.9 Nexans SA
12.10 Astronics Corporation
12.11 Data Device Corporation
12.12 Optical Cable Corporation
12.13 Huber+Suhner AG

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. – 176)
13.1 Discussion Guide
13.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
13.3 Introducing RT: Real Time Market Intelligence
13.4 Available Customizations
13.5 Related Reports


【レポート販売概要】

■ タイトル:データバスの世界市場予測(~2021年):マイクロカプラー、ケーブル、コネクター、アクセサリー
■ 英文:Data Bus Market by Protocol (MIL-STD-1553, AFDX/ARINC 664, ARINC 429/629, CAN, TTP), Application (Marine, Commercial Aviation, Military Aviation, Automotive), Component (Micro couplers, Cables, Connectors, Accessories), and Region - Global Forecast to 2021
■ 発行日:2016年9月23日
■ 調査会社:MarketsandMarkets
■ 商品コード:MAM-AS-3144
■ 調査対象地域:グローバル
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