【レポートの概要（一部）】
Table of Contents
Chapter 1. Methodology and Scope
1.1. Research Methodology
1.2. Research Scope & Assumption
1.3. List of Data Sources
Chapter 2. Executive Summary
2.1. Industry Summary and Critical Success Factors (CSFs)
Chapter 3. Next Generation Non Volatile Memory Industry Outlook
3.1. Market Segmentation
3.2. Market Size and Growth Prospects
3.3. Next Generation Non Volatile Memory Value Chain Analysis
3.4. Next Generation Non Volatile Memory Market Dynamics
3.4.1. Market Driver Analysis
3.4.2. Market Restraint Analysis
3.5. Key Opportunities Prioritized
3.6. Industry Analysis – Porter’s
3.7. Next Generation Non Volatile Memory – Company Market Share Analysis, 2015
3.8. Next Generation Non Volatile Memory Market PESTEL Analysis, 2015
Chapter 4. Next Generation Non Volatile Memory Product Outlook
4.1. FeRAM
4.1.1. Global market estimates and forecasts, 2014 – 2024
4.2. PCM
4.2.1. Global market estimates and forecasts, 2014 – 2024
4.3. MRAM
4.3.1. Global market estimates and forecasts, 2014 – 2024
4.4. ReRAM
4.4.1. Global market estimates and forecasts, 2014 – 2024
Chapter 5. Next Generation Non Volatile Memory Application Outlook
5.1. Mobile phones
5.1.1. Global market estimates and forecasts, 2014 – 2024
5.2. Cache Memory and Enterprise Storage
5.2.1. Global market estimates and forecasts, 2014 – 2024
5.3. Industrial & Automotive
5.3.1. Global market estimates and forecasts, 2014 – 2024
5.4. Mass Storage
5.4.1. Global market estimates and forecasts, 2014 – 2024
5.5. Embedded MCU & Smart Cards
5.5.1. Global market estimates and forecasts, 2014 – 2024
Chapter 6. Next Generation Non Volatile Memory Regional Outlook
6.1. North America
6.1.1. Next Generation Non Volatile Memory market by product, 2014 – 2024
6.1.2. Next Generation Non Volatile Memory market by application, 2014 – 2024
6.2. Europe
6.2.1. Next Generation Non Volatile Memory market by product, 2014 – 2024
6.2.2. Next Generation Non Volatile Memory market by application, 2014 – 2024
6.3. Asia Pacific
6.3.1. Next Generation Non Volatile Memory market by product, 2014 – 2024
6.3.2. Next Generation Non Volatile Memory market by application, 2014 – 2024
6.4. RoW
6.4.1. Next Generation Non Volatile Memory market by product, 2014 – 2024
6.4.2. Next Generation Non Volatile Memory market by application, 2014 – 2024
Chapter 7. Competitive Landscape
7.1. Adesto Technologies
7.1.1. Company overview
7.1.2. Financial performance
7.1.3. Product benchmarking
7.1.4. Strategic initiatives
7.2. Avalanche Technology, Inc.
7.2.1. Company overview
7.2.2. Financial performance
7.2.3. Product benchmarking
7.2.4. Strategic initiatives
7.3. Crossbar Inc.
7.3.1. Company overview
7.3.2. Financial performance
7.3.3. Product benchmarking
7.3.4. Strategic initiatives
7.4. Cypress Semiconductor Corporation
7.4.1. Company overview
7.4.2. Financial performance
7.4.3. Product benchmarking
7.4.4. Strategic initiatives
7.5. Everspin Technologies, Inc.
7.5.1. Company overview
7.5.2. Financial performance
7.5.3. Product benchmarking
7.5.4. Strategic initiatives
7.6. Fujitsu Ltd
7.6.1. Company overview
7.6.2. Financial performance
7.6.3. Product benchmarking
7.6.4. Strategic initiatives
7.7. IBM Corporation
7.7.1. Company overview
7.7.2. Financial performance
7.7.3. Product benchmarking
7.7.4. Strategic initiatives
7.8. Intel Corporation
7.8.1. Company overview
7.8.2. Financial performance
7.8.3. Product benchmarking
7.8.4. Strategic initiatives
7.9. Micron Technology, Inc.
7.9.1. Company overview
7.9.2. Financial performance
7.9.3. Product benchmarking
7.9.4. Strategic initiatives
7.10. amsung Electronics Co. Ltd.
7.10.1. Company overview
7.10.2. Financial performance
7.10.3. Product benchmarking
7.10.4. Strategic initiatives
7.11. Sandisk Corporation
7.11.1. Company overview
7.11.2. Financial performance
7.11.3. Product benchmarking
7.11.4. Strategic initiatives
7.12. SK Hynix Inc
7.12.1. Company overview
7.12.2. Financial performance
7.12.3. Product benchmarking
7.12.4. Strategic initiatives
7.13. Toshiba Corporation
7.13.1. Company overview
7.13.2. Financial performance
7.13.3. Product benchmarking
7.13.4. Strategic initiatives
7.14. Winbond Electronics Corporation
7.14.1. Company overview
7.14.2. Financial performance
7.14.3. Product benchmarking
7.14.4. Strategic initiatives
【レポート販売概要】
■ タイトル：次世代不揮発性メモリの世界市場の規模と予測：製品別（FeRAM、PCM、MRAM、ReRAM）、用途別（携帯電話、キャッシュメモリ･企業用ストレージ、組み込み型MCU･スマートカード）、地域別、セグメント予測、2014-2024■ 英文：Next Generation Non Volatile Memory Market Size & Analysis By Product (FeRAM, PCM, MRAM, ReRAM), By Application (Mobile Phones, Cache Memory and Enterprise Storage, Embedded MCU & Smart Cards), By Region, And Segment Forecasts, 2014 - 2024
■ 発行日：2016年12月19日
■ 調査会社：Grand View Research
■ 商品コード：GVIEW707585
■ 調査対象地域：グローバル
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