世界のTSV（Si貫通電極）3D IC産業動向...市場調査レポートについてご紹介

[Table of Contents]

1 Development of Global Packaging Technologies
1.1 SiP to Become Mainstream Technology
1.2 TSV 3D IC: The Future Trend of Packaging Technology
1.3 Uniqueness of TSV 3D IC Technology
1.4 Existing Challenges for TSV 3D IC
1.5 Foreign Players’ Leading Position in TSV 3D IC
2 Development of TSV 3D IC Market
2.1 Strong Growth Potential
2.1 Mass Production Activities Remain Low
2.2 Market Growth to Speed Up with Technological Enhancement
3 Development of the TSV 3D IC Industry
3.1 Formation of Cross-industry Alliances
3.2 Taiwanese IC Design Houses’ Absence in HMCC
3.3 Close Cooperation between Taiwanese Upstream and Downstream Players Required
MIC Perspective
Appendix

[List of Tables]
Table 1 Current Challenges in TSV 3D IC Development
Table 2 Technology Development and Mass Production Timetable of Taiwanese and
Foreign TSC IC Chipmakers
Table 3 TSV-based ICs Mass Produced as of Year-end 2014
Table 4 Impact on Taiwan’s Semiconductor Industry

[List of Figures]
Figure 1 Development of Electronic Devices and Packaging Technologies
Figure 2 Comparison of TSV 3D IC and Other Packaging Technologies
Figure 3 Production Process of TSV 3D IC
Figure 4 Worldwide TSV 3D IC Industry Value Forecast, 2014 – 2017
Figure 5 Major Players’ Development Plan in 2015 and 2016
Figure 6 Comparison of Industry Alliances Worldwide
Figure 7 Participation of Taiwanese and Korean HMCC Members