【レポートの概要(一部)】
Table of Contents
1 Introduction (Page No. – 21)
1.1 Key Objectives
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Research Methodology
1.5.1 Market Size Estimation
1.5.2 Market Crackdown &Data Triangulation
1.5.3 Key Points Taken From Secondary Sources
1.5.4 Key Points Taken From Primary Sources
1.5.5 List of Companies Covered During Study
1.6 Report Assumptions
2 Executive Summary (Page No. – 35)
3 Market Overview (Page No. – 39)
3.1 Introduction
3.2 History & Evolution of SIP
3.2.1 Soc (System on Chip)
3.2.2 Mcm (Multi Chip Module)
3.2.3 SIP (System in Package)
3.2.4 Soc Vs. SIP
3.3 Emerging Trends
3.3.1 System on Package (SOP)
3.3.2 Photonics Convergence for Interchip Interconnects
4 Market Analysis (Page No. – 49)
4.1 Introduction
4.2 System in Package (SIP) Industry Value Chain Analysis
4.3 Market Dynamics
4.3.1 Introduction
4.3.2 Market Drivers
4.3.2.1 Increasing Demand for Miniaturized & High Performance Electronic Devices
4.3.2.2 Strong Penetration in Consumer Electronics Sector to Drive the SIP Market
4.3.2.3 Faster Time-to-Market and Lower Development Costs Acts As An Attractive Prospect for the Electronic Manufacturers
4.3.3 Market Restraints
4.3.3.1 ‘Known Good Die’– Big Challenge for SIP (System in Package)
4.3.3.2 Reliability Challenges
4.3.4 Opportunity
4.3.4.1 Rapid Adoption of Smartphone & Tablets in Emerging Countries
4.4 Burning Issue
4.4.1 Lack of Industry Infrastructure
4.5 Winning Imperative
4.5.1 Need of thermal Management for Packaged Chips
4.6 Porter’s Five forces Model
4.6.1 Degree of Competition
4.6.2 Bargaining Power of Buyers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat From Substitutes
4.6.5 Threat From New Entrants
5 Global System in Package (SIP) Market Segmentation (Page No. – 69)
5.1 Introduction
5.2 System in Package (SIP) – By Packaging Technology
5.2.1 2D Ic Packaging Technology
5.2.2 2.5D Ic Packaging Technology
5.2.2.1 Major Benefits of 2.5D Ic Packaging Over the Traditional 2D Packaging Practices
5.2.3 3D Ic Packaging Technology
5.2.4 2D Vs. 2.5D Vs. 3D Ic Packaging Technology
5.3 System in Package (SIP) – By Packaging Type
5.3.1 Ball Grid Array
5.3.1.1 Pbga (Plastic Ball Grid Array)
5.3.1.2 Sbga (Super Ball Grid Array)
5.3.1.3 Fbga (Fine Pitch Ball Grid Array)
5.3.1.4 Fcbga (Flip Chip Ball Grid Array)
5.3.1.5 Others
5.3.2 Surface Mount Package
5.3.2.1 Lga (Land Grid Array)
5.3.2.2 Ccga (Ceramic Column Grid Array)
5.3.2.3 Others
5.3.3 Pin Grid Array (Pga)
5.3.3.1 Flip Chip Pin Grid Array (FCPGA)
5.3.3.2 Ceramic Pin Grid Array (CPGA)
5.3.3.3 Others
5.3.4 Flat Packages
5.3.4.1 Qfn (Quad Flat No-Leads)
5.3.4.2 Utqfn (Ultra Thin Quad Flat No-Leads)
5.3.4.3 Others
5.3.5 Small Outline Package
5.3.5.1 Tsop(Thin Small Outline Package)
5.3.5.2 Tssop (Thin Shrink Small Outline Package)
5.3.5.3 Others
5.4 System in Package (SIP) – By interconnection Technology
5.4.1 Wire Bond Technology
5.4.2 Flip Chip Technology
5.4.2.1 Advantages of Flip Chip Technology Over the Traditional Interconnection Technology:
5.4.3 Others
6 Market By Application (Page No. – 106)
6.1 Introduction
6.2 Consumer Electronics Sector
6.2.1 Smartphone & Tablets
6.2.2 Portable Media Players
6.2.3 Set-top Boxes & Digital Tvs
6.2.4 Dvd & Blu-Ray Players
6.2.5 Others
6.3 Communications Sector
6.3.1 Network Processors
6.3.2 Wireless Communication Equipment
6.3.3 Others
6.4 Automotive & Transportation Sector
6.4.1 Automotive Radar
6.4.2 Automotive Smart Sensors
6.4.3 Automotive Local Interconnect Network (LIN)
6.4.4 Others
6.5 Industrial Sector
6.5.1 Industrial Wireless Sensor Networks (IWSN)
6.5.2 Industrial Automation Devices
6.5.3 Others
6.6 Military, Defense & Aerospace (MDA) Sector
6.6.1 Radar Equipment
6.6.2 Satellite Communication Devices
6.6.3 Others
6.7 Medical Sector
6.7.1 Patient Monitoring Devices
6.7.2 Medical Smart Sensor System
6.7.3 Others
6.8 Emerging & Other Applications Sector
7 Market By Geography (Page No. – 146)
7.1 Introduction
7.2 North America
7.2.1 U.S.
7.2.2 Canada
7.3 APAC
7.3.1 Japan
7.3.2 Taiwan
7.3.3 China
7.3.4 Others
7.4 Europe
7.4.1 U.K.
7.4.2 Germany
7.4.3 France
7.4.4 Others
7.5 Rest of The World
7.5.1 Middle East
7.5.2 Russia
7.5.3 Others
8 Competitive Landscape (Page No. – 172)
8.1 Overview
8.2 Competitive Analysis
8.2.1 Market Share Ranking Analysis
8.3 Competitive Situation &Trends
8.3.1 New Product Launch, New Product Development&Expansion
8.3.2 Agreements, Partnerships, Joint Ventures, & Collaborations
8.3.3 Mergers &Acquisitions
8.3.4 Other Developments
9 Company Profiles (Overview, Products and Services, Financials, Strategy & Development)* (Page No. – 191)
9.1 Amkor Technology Inc.
9.2 ASE Inc.
9.3 Chipmos Tech. Inc.
9.4 Chipbond Technology Corporation
9.5 Fujitsu Ltd.
9.6 GS Nanotech
9.7 Insight SIP
9.8 Jiangsu Changjiang Electronics Technology Co. Ltd.
9.9 Nanium S.A.
9.10 Powertech Technologies Inc.
9.11 Qualcomm Incorporated
9.12 Siliconware Precision Industries Co., Ltd.
9.13 Stats Chippac Ltd.
9.14 Toshiba Corporation
9.15 WI2WI Corporation
*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Capturedin Case of Unlisted Companies.
【レポート販売概要】
■ タイトル:システム・イン・パッケージ(SIP)のグローバル市場(2014 – 2020)■ 英文:System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020
■ 発行日:2014年4月
■ 調査会社:MarketsandMarkets
■ 商品コード:Markets-SE-2384
■ 調査対象地域:グローバル
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