マイクロコントローラー、DSP、IPコアチップの世界市場...市場調査レポートについてご紹介

TABLE OF CONTENTS

1 INTRODUCTION
1.1 OBJECTIVES
1.2 MARKETS COVERED
1.3 STAKEHOLDERS
1.4 RESEARCH METHODOLOGY
1.4.1 MARKET SIZE ESTIMATION
1.4.2 MARKET CRACKDOWN AND DATA TRIANGULATION
1.4.3 KEY DATA TAKEN FROM SECONDARY SOURCES
1.4.4 KEY DATA TAKEN FROM PRIMARY SOURCES
1.4.5 ASSUMPTIONS MADE FOR THIS REPORT
1.4.6 LIST OF COMPANIES COVERED DURING THE STUDY

2 EXECUTIVE SUMMARY

3 MARKET OVERVIEW
3.1 INTRODUCTION
3.2 MARKET DEFINITION
3.3 HISTORY AND EVOLUTION
3.4 MARKET DYNAMICS
3.4.1 MARKET DRIVERS
3.4.1.1 IoT and consumer electronics
3.4.1.2 Small technology nodes (process nodes) drives the IC manufacturing market
3.4.1.3 New devices in consumer electronics with novel applications
3.4.2 MARKET RESTRAINTS
3.4.2.1 Increasing competition
3.4.2.2 Increased complexity in the semiconductor design
3.4.3 MARKET OPPORTUNITY
3.4.3.1 Developing economies: A huge opportunity
3.5 BURNING ISSUES
3.5.1 IP THEFTS, COUNTERFEITS, AND CONFLICTS
3.5.2 PROGRAMMING CHALLENGE
3.6 WINNING IMPERATIVES
3.6.1 MULTICORE PROCESSORS
3.7 VALUE CHAIN ANALYSIS-IP CORE CHIPS
3.7.1 VALUE CHAIN SEGMENTS
3.7.1.1 IP core developers
3.7.1.2 IP licensing vendors
3.7.1.3 Open source IP vendors
3.7.1.4 IP aggregators
3.7.1.5 IP customers
3.7.2 THE EFFECT OF FOUNDRIES ON THE IP CORE CHIP MARKET
3.7.3 IP CORE CHIP BUSINESS MODELS
3.7.3.1 Per-use business model
3.7.3.2 Time-based business model
3.7.3.3 Royalty-based business model
3.7.3.4 Access-based business model
3.8 VALUE CHAIN ANALYSIS – MICROCONTROLLER & DSP
3.8.1 RAW MATERIAL SUPPLIERS
3.8.2 ASSEMBLY,TESTING, & PACKAGING (ATP)
3.8.3 ORIGINAL EQUIPMENT MANUFACTURERS (OEMS)
3.8.4 EXISTING PLAYERS IN THE VALUE CHAIN
3.8.4.1 Original Device Manufacturers (ODMs)
3.8.4.2 Assembly, Testing, & Packaging services (ATP)
3.8.4.3 Original Equipment Manufacturers (OEMs)
3.8.4.4 Fabrication facilities
3.8.4.5 IP vendors
3.8.4.6 Pure play foundries
3.8.4.7 EDA vendors
3.8.4.8 IDM foundries
3.9 PORTER’S FIVE FORCES MODEL – MICROCONTROLLER, DSP, AND IP CORE CHIP MARKET
3.9.1 DEGREE OF COMPETITION
3.9.2 BARGAINING POWER OF BUYERS
3.9.3 BARGAINING POWER OF SUPPLIERS
3.9.4 THREAT OF SUBSTITUTES
3.9.5 THREAT OF NEW ENTRANTS

4 MICROCONTROLLER MARKET
4.1 INTRODUCTION
4.2 MICROPROCESSOR VS. MICROCONTROLLER
4.3 GENERAL ARCHITECTURE OF A MICROCONTROLLER
4.3.1 CENTRAL PROCESSING UNIT (CPU)
4.3.2 PROGRAM COUNTER (PC)
4.3.3 INSTRUCTION REGISTER (IR)
4.3.4 ARITHMETIC LOGIC UNIT (ALU)
4.3.5 REGISTERS
4.3.6 I/O PORTS
4.4 CLASSIFICATION OF MICROCONTROLLERS
4.4.1 8-BIT MICROCONTROLLER
4.4.2 16-BIT MICROCONTROLLER
4.4.3 32-BIT MICROCONTROLLER
4.5 MARKET DYNAMICS – MICROCONTROLLERS
4.5.1 DRIVERS
4.5.1.1 Growth in the automobile sector will drive the microcontroller market
4.5.1.2 Declining price of microcontrollers is expected to fuel the growth
4.5.1.3 Increased adoption of ARM cores
4.5.1.4 Migration to the small technology nodes further drives the 32-bit microcontroller market
4.5.1.5 Smartphones boost the microcontroller market
4.5.2 MARKET RESTRAINT
4.5.2.1 Large number of companies in the market
4.5.3 MARKET OPPORTUNITY
4.5.3.1 Smart-grid projects act as attractive prospects for the microcontroller market

5 DIGITAL SIGNAL PROCESSOR (DSP) MARKET
5.1 INTRODUCTION
5.2 ARCHITECTURE OF A DIGITAL SIGNAL PROCESSOR
5.3 CLASSIFICATION BY PRODUCT SEGMENT
5.3.1 GENERAL PURPOSE DSP
5.3.2 APPLICATION SPECIFIC DSP
5.3.3 PROGRAMMABLE (FPGA & PLD) DSP
5.4 CLASSIFICATION BY CORE TYPE
5.4.1 SINGLE-CORE DSP MARKET
5.4.2 MULTI-CORE DSP MARKET
5.5 MARKET DYNAMICS –DSP
5.5.1 DRIVERS
5.5.1.1 Booming number of wireless devices and developments in the wireless infrastructure
5.5.1.2 Upsurge in the global mobile data traffic
5.5.1.3 Emergence of new devices and modish applications
5.5.1.4 Internet Protocol (IP) video surveillance
5.5.2 RESTRAINT
5.5.2.1 Price war affecting performance parameters
5.5.3 OPPORTUNITIES
5.5.3.1 Increasing demand for VoIP and IP video
5.5.3.2 Emerging economies

6 IP CORE CHIP MARKET
6.1 INTRODUCTION
6.2 CLASSIFICATION BY IP NATURE
6.2.1 SOFT CORE
6.2.2 HARD CORE
6.3 CLASSIFICATION BY CUSTOMIZATION
6.3.1 STANDARD IP CORE
6.3.2 CUSTOMIZABLE IP CORE
6.4 MARKET DYNAMICS
6.4.1 MARKET DRIVERS
6.4.1.1 Continuously rising chip design cost and expenditure acts as a major driver for the IP core chip market
6.4.1.2 Adopting third party IP core chips due to rapidly changing technology nodes
6.4.1.3 Fierce competition requiring lesser time-to-market in consumer electronics
6.4.2 MARKET RESTRAINTS
6.4.2.1 Volatility in the process nodes of chip manufacturing
6.4.2.2 Effects of changing process nodes on the global Semiconductor IP market
6.4.2.2.1
6.4.2.2.2
6.4.3 MARKET OPPORTUNITIES
6.4.3.1 Avionics, aerospace, and defense
6.4.3.2 Embedded and programmable DSP IP market segments

7 MARKET BY APPLICATION
7.1 INTRODUCTION
7.2 AUTOMOTIVE AND TRANSPORTATION
7.2.1 AUTOMOTIVE BODY ELECTRONICS
7.2.2 AUTOMOTIVE INFOTAINMENT APPLICATIONS
7.2.3 AUTOMOTIVE CONTROL SYSTEMS
7.2.4 AUTOMOTIVE SENSORS
7.2.5 IN-VEHICLE NETWORKING
7.3 COMPUTER SECTOR
7.3.1 SUPERCOMPUTER
7.3.2 MAINFRAME COMPUTERS AND COMPUTER SERVERS
7.3.3 PC & PC PERIPHERALS
7.4 CONSUMER ELECTRONICS SECTOR
7.4.1 SMARTPHONES AND TABLETS
7.4.2 WEARABLE DEVICES
7.4.3 WHITE GOODS (APPLIANCES)
7.4.4 PC AND PC PERIPHERALS
7.4.5 CAMERAS AND PROJECTORS
7.4.6 SET-TOP BOXES AND DIGITAL TVS
7.4.7 DVD, BLUE-RAY PLAYERS, AND HOME AUDIO SYSTEMS
7.4.8 OTHERS
7.5 COMMUNICATIONS SECTOR
7.5.1 WIRELESS COMMUNICATION APPLICATION
7.5.2 WIRELESS LAN
7.5.3 RFID APPLICATION
7.5.4 TELECOMMUNICATION APPLICATION
7.5.5 SURVEILLANCE APPLICATION
7.5.6 VOIP APPLICATION
7.6 INDUSTRIAL, BUILDING, & HOME SECTOR
7.6.1 INDUSTRIAL AUTOMATION APPLICATION
7.6.2 INDUSTRIAL CONTROL SYSTEMS
7.6.3 INDUSTRIAL NETWORK
7.6.4 SMART METERING APPLICATIONS
7.6.5 LIGHTING APPLICATIONS
7.6.6 INDUSTRIAL SENSORS
7.7 SECURITY SECTOR
7.7.1 SECURE MICROCONTROLLERS
7.7.2 SMART CARDS
7.8 MEDICAL AND HEALTHCARE SECTOR
7.8.1 MEDICAL TELEMETRY DEVICES
7.8.2 IMPLANTABLE MEDICAL DEVICES
7.8.3 MONITORING APPLICATION
7.8.4 HIGH VOLTAGE MEDICAL DEVICES
7.8.5 OTHERS
7.9 MILITARY, DEFENSE, AND AEROSPACE SECTOR
7.9.1 DSP -BASED FIELD PROGRAMMABLE ARRAY APPLICATIONS
7.9.2 RAD-HARD ASIC AND FPGA BASED DSP
7.1 RF AND OTHERS SECTOR
7.10.1 RF DSP APPLICATION
7.10.2 RADAR COMMUNICATION APPLICATION
7.10.3 OSCILLOSCOPE AND ANALYZER APPLICATION
7.10.4 OTHERS

8 MARKET BY GEOGRAPHY
8.1 INTRODUCTION
8.2 NORTH AMERICA
8.2.1 THE U.S.
8.2.2 CANADA
8.2.3 MEXICO
8.3 SOUTH AMERICA
8.3.1 BRAZIL
8.3.2 ARGENTINA
8.3.3 OTHERS
8.4 EUROPE
8.4.1 GERMANY
8.4.2 THE U.K.
8.4.3 FRANCE
8.4.4 THE NETHERLANDS
8.4.5 REST OF EUROPE
8.5 APAC
8.5.1 JAPAN
8.5.2 SOUTH KOREA
8.5.3 CHINA
8.5.4 INDIA
8.5.5 SOUTH EAST ASIAN COUNTRIES
8.5.6 REST OF APAC
8.6 ROW
8.6.1 MIDDLE EAST
8.6.2 AUSTRALIA
8.6.3 OTHERS

9 COMPETITIVE LANDSCAPE
9.1 INTRODUCTION
9.1.1 MARKET SHARE RANKING ANALYSIS FOR MICROCONTROLLERS
9.1.2 MARKET SHARE RANKING ANALYSIS FOR DSP
9.1.3 MARKET SHARE RANKING ANALYSIS FOR THE IP CORE CHIP
9.1.4 GROWTH STRATEGIES
9.2 COMPETITIVE SITUATIONS AND TRENDS
9.2.1 NEW PRODUCT DEVELOPMENTS & LAUNCHES
9.2.2 JOINT VENTURES, COLLABORATIONS, PARTNERSHIPS, & ALLIANCES
9.2.3 MERGERS & ACQUISITIONS
9.2.4 OTHERS

10 COMPANY PROFILES
(Overview, Products and Services, Financials, Strategy & Development)*
10.1 ANALOG DEVICES, INC.
10.2 FREESCALE SEMICONDUCTOR, INC.
10.3 STMICROELECTRONICS N.V.
10.4 PANASONIC CORPORATION
10.5 INFINEON TECHNOLOGIES AG
10.6 RENESAS ELECTRONICS CORPORATION
10.7 MAXIM INTEGRATED PRODUCTS, INC.
10.8 TEXAS INSTRUMENTS INC.
10.9 XILINX, INC.
10.10 ALTERA CORPORATION
10.11 ARM HOLDINGS PLC
10.12 CADENCE DESIGN SYSTEMS
10.13 CEVA INC.
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.