世界の半導体産業における炭化ケイ素（SiC）市場予測及び分析：SiCパワー半導体、SiC光半導体、SiC高温半導体...市場調査レポートについてご紹介

TABLE OF CONTENTS

1 MARKET OVERVIEW
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 SCOPE OF THE REPORT
1.4 MARKETS COVERED
1.5 STAKEHOLDERS
1.6 RESEARCH METHODOLOGY
1.6.1 MARKET SIZE ESTIMATION
1.6.2 MARKET CRACKDOWN AND DATA TRIANGULATION
1.6.3 KEY DATA TAKEN FROM SECONDARY SOURCES
1.6.4 ASSUMPTIONS MADE FOR THIS REPORT
1.6.5 LIST OF COMPANIES COVERED DURING THE STUDY

2 EXECUTIVE SUMMARY

3 MARKET OVERVIEW
3.1 INTRODUCTION
3.1.1 OVERVIEW – SIC SEMICONDUCTOR DEVICES
3.1.2 OVERVIEW – SIC SEMICONDUCTOR MATERIAL
3.2 HISTORY AND EVOLUTION – SILICON CARBIDE MARKET
3.3 MARKET DYNAMICS
3.3.1 DRIVERS
3.3.1.1 The ability of SiC to perform in high temperature, power, and frequency
3.3.1.1.1 High temperature
3.3.1.1.2 High power
3.3.1.1.3 High frequency
3.3.1.2 The growing solar power market
3.3.1.3 A Surge in demand for high resistant material
3.3.1.4 Huge demand for high-voltage power semiconductor applications
3.3.1.5 Demand from the military, defense, and aerospace sector
3.3.2 RESTRAINTS
3.3.2.1 Gallium Nitride- a huge competition to the silicon carbide based device market
3.3.2.2 Poor oxidation resistance at high temperatures expected to create a technical challenge
3.3.3 OPPORTUNITIES
3.3.3.1 Huge opportunities expected from the Automotive sector
3.4 BURNING ISSUE
3.4.1 HIGH DEVELOPMENT EXPENDITURE OF SIC IN SEMICONDUCTOR
3.5 WINNING IMPERATIVE
3.5.1 DEVELOPMENT OF SIC USING DIFFERENT VARIETY OF COMPOSITION MATERIALS
3.6 PRODUCT LIFE CYCLE
3.6.1 INTRODUCTION
3.6.2 EPITAXIAL GROWTH
3.6.3 WAFER BONDING
3.6.4 DEVICE FABRICATION
3.6.5 PACKAGING AND SYSTEM INTEGRATION
3.7 VALUE AND SUPPLY CHAIN ANALYSIS
3.7.1 VALUE CHAIN ANALYSIS
3.7.1.1 Raw Material Vendors
3.7.1.2 EDA and design tool vendors
3.7.1.3 Intellectual Property Vendors
3.7.1.4 Foundry Vendors
3.7.1.5 Fabrication Facilities
3.7.1.6 Integrated Device Manufacturers
3.7.1.7 Original Device Manufacturers
3.7.1.8 Original Equipment Manufacturers
3.7.1.9 Assembly, Testing, and Packaging Players
3.7.2 SUPPLY CHAIN ANALYSIS
3.7.2.1 Upstream Chain
3.7.2.1.1 Extraction of silicon carbide
3.7.2.1.2 Purification and refining
3.7.2.1.3 Etching and doping
3.7.2.1.4 Wafer coating and manufacturing
3.7.2.2 Downstream chain
3.7.2.2.1 Device fabrication
3.7.2.2.2 Cutting and mounting
3.7.2.2.3 Assembly and packaging
3.8 PORTER’S FIVE FORCE ANALYSIS
3.8.1 BARGAINING POWER OF SUPPLIERS
3.8.2 BARGAINING POWER OF CUSTOMERS (BUYERS)
3.8.3 THREAT OF NEW ENTRANTS
3.8.4 THREAT OF SUBSTITUTE PRODUCTS OR SERVICES
3.8.5 INTENSITY OF COMPETITIVE RIVALRY

4 MARKET BY TECHNOLOGY
4.1 INTRODUCTION
4.2 MARKET BY SIC POLYTYPES
4.2.1 2H-SIC SEMICONDUCTORS MARKET
4.2.2 3C-SIC SEMICONDUCTORS MARKET
4.2.2.1 3C- SIC growth in hexagonal SIC substrates
4.2.2.2 3C-SIC growth on Si substrates
4.2.3 4H-SIC SEMICONDUCTORS MARKET
4.2.3.1 Developments
4.2.3.1.1 High voltage unipolar power switching devices
4.2.3.1.2 Bipolar junctions transistors for power electronic applications
4.2.4 6H-SIC SEMICONDUCTORS MARKET
4.3 MARKET BY SEMICONDUCTOR MATERIALS
4.3.1 IV-IV SIC SEMICONDUCTORS MARKET
4.3.1.1 SiC-on-Silicon semiconductors market
4.3.1.2 SiC-on-Sapphire semiconductors market
4.3.1.3 SiC-on-Graphite semiconductors market
4.3.1.4 SiC-on-Graphene semiconductors market
4.3.1.4.1 Applications
4.3.2 III-V SIC SEMICONDUCTORS MARKET
4.3.2.1 SiC-on-GaN semiconductors market
4.3.2.1.1 Applications
4.3.2.2 SiC-on-A|N semiconductors market
4.3.2.3 Composite materials-based SiC semiconductors market
4.3.2.4 Alloy materials-based SiC semiconductors market

5 MARKET BY PRODUCT
5.1 INTRODUCTION
5.2 SIC POWER SEMICONDUCTORS MARKET
5.2.1 SIC POWER SEMICONDUCTOR DEVICES AND INVERTORS
5.2.2 SIC POWER DIODES CLASSIFICATION BY TECHNOLOGY NODE
5.2.2.1 350NMSiC power devices
5.2.2.2 250NMSiC power devices
5.2.2.3 180NM SiC power devices
5.2.2.4 150NM SiC power devices
5.2.2.5 130NMSiC power devices
5.2.2.6 90 NM SiC power devices
5.2.2.7 65 NM SiC power devices
5.2.2.8 45 NM SiC power devices
5.2.2.9 32 NM SiC power devices
5.2.2.10 28 NM SiC power devices
5.2.2.11 22 NM SiC power devices
5.2.2.12 14 NM SiC power devices
5.3 SIC OPTOSEMICONDUCTORS MARKET
5.3.1 LED (LIGHT EMITTING DIODE)
5.4 SIC HIGH-TEMPERATURE SEMICONDUCTORS MARKET
5.5 SIC POWER DISCRETE MARKET
5.5.1 SIC POWER MOSFETS
5.5.2 SIC POWER JFETS
5.5.3 SIC POWER IGBTS (INSULATED-GATE BIPOLAR TRANSISTOR)
5.5.4 SIC POWER DIODES AND RECTIFIERS
5.5.4.1 SIC Power Schottky Diodes
5.5.5 SIC OTHER POWER DISCRETES

6 MARKET BY APPLICATION
6.1 INTRODUCTION
6.2 AUTOMOTIVE SECTOR
6.2.1 ELECTRIC VEHICLES & HYBRID ELECTRIC VEHICLES (HEVS)
6.2.2 AUTOMOTIVE BRAKING SYSTEMS
6.2.3 AUTOMOBILE MOTOR DRIVES
6.3 AEROSPACE AND DEFENSE
6.3.1 COMBAT VEHICLES
6.3.2 SHIPS & VESSELS
6.3.3 MICROWAVE RADIATION APPLICATIONS
6.3.4 RADIATION-HARD ELECTRONICS
6.4 COMPUTERS
6.4.1 COMPUTER HARDWARE POWER MODULES
6.4.2 UPS SYSTEMS
6.5 CONSUMER ELECTRONICS
6.5.1 INVERTERS
6.5.2 LED (LIGHT EMITTING DIODE) LIGHTING
6.5.3 SMPS (SWITCH MODE POWER SUPPLY)
6.6 ICT (INFORMATION & COMMUNICATION TECHNOLOGY)
6.6.1 SIGNAL AMPLIFIERS AND SWITCHING SYSTEMS
6.6.2 WIRELESS APPLICATION DEVICES
6.6.3 WIRED COMMUNICATION DEVICES
6.6.4 SATELLITE COMMUNICATION APPLICATIONS
6.6.5 RADAR APPLICATIONS
6.6.6 RF (RADIO FREQUENCY) APPLICATIONS
6.7 INDUSTRIAL SECTOR
6.7.1 INDUSTRIAL MOTOR DRIVES
6.7.2 COMMERCIAL MOTOR DRIVES
6.7.3 ELECTRO-MECHANICAL COMPUTING SYSTEMS
6.7.4 HIGH-TEMPERATURE ELECTRONICS & SENSORS
6.8 MEDICAL & HEALTHCARE
6.9 IMPLANTABLE MEDICAL DEVICES
6.9.1 BIO-MEDICAL ELECTRONICS
6.10 POWER SECTOR
6.10.1 SMART GRID POWER SYSTEMS
6.10.2 POWER FACTOR CORRECTION (PFC) SYSTEM
6.10.3 POWER DISTRIBUTION SYSTEMS
6.10.4 HIGH VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS
6.11 RAILWAYS
6.11.1 RAILWAY TRACTION
6.12 SOLAR & WIND POWER SECTOR
6.12.1 WIND TURBINES AND WIND POWER SYSTEMS
6.12.2 PHOTOVOLTAIC (PV) INVERTERS
6.12.3 SOLAR PANELS
6.13 OTHERS
6.13.1 ASTRONOMY
6.13.2 PYROMETER

7 MARKET BY GEOGRAPHY
7.1 INTRODUCTION
7.2 NORTH AMERICA
7.2.1 U.S.
7.2.2 OTHERS
7.3 EUROPE
7.4 APAC (EXCLUDING JAPAN)
7.4.1 CHINA
7.4.2 INDIA
7.4.3 OTHERS
7.5 JAPAN
7.6 ROW (REST OF THE WORLD)
7.6.1 LATIN AMERICA
7.6.2 MIDDLE EAST
7.6.3 OTHERS

8 COMPETITIVE LANDSCAPE
8.1 INTRODUCTION
8.2 KEY GROWTH STRATEGIES
8.3 KEY PLAYERS
8.4 COMPETITIVE ANALYSIS
8.4.1 TOP FIVE INDUSTRY PLAYERS – ANALYSIS
8.5 COMPETITIVE SITUATION AND TRENDS
8.5.1 NEW PRODUCT DEVELOPMENTS
8.5.2 AGREEMENTS/CONTRACTS/COLLABORATIONS/ PARTNERSHIPS
8.5.3 EXPANSION
8.5.4 ACQUISITIONS
8.5.5 OTHERS

9 COMPANY PROFILES
(Overview, Products and Services, Financials, Strategy & Development)*
9.1 CREE INCORPORATED
9.2 FAIRCHILD SEMICONDUCTOR INTERNATIONAL INC.
9.3 GENESIC SEMICONDUCTOR INC.
9.4 INFINEON TECHNOLOGIES AG
9.5 MICROSEMI CORPORATION
9.6 NORSTEL AB
9.7 RENESAS ELECTRONICS CORPORATION
9.8 ROHM CO. LTD.
9.9 STMICROELECTRONICS N.V
9.10 TOSHIBA CORPORATION
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.