【レポートの概要（一部）】
Table of Contents
1 Introduction (Page No. – 15)
1.1 Objectives of the Study
1.2 Market Definition
1.3 Study Scope
1.3.1 Markets Covered
1.3.2 Geographic Scope
1.3.3 Years Considered for the Study
1.4 Currency
1.5 Package Size
1.6 Limitations
1.7 Stakeholders
2 Research Methodology (Page No. – 20)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primaries
2.2 Factor Analysis
2.2.1 Introduction
2.2.2 Demand-Side Analysis
2.2.2.1 Growing Traditional Semiconductor Memory Market
2.2.2.2 Increasing Demand of High-Capacity Memory Solutions in the Consumer Electronics Sector
2.2.2.3 Wearable Electronics Market to Grow at A Steady Rate
2.2.3 Supply-Side Analysis
2.2.3.1 Number of New Product Launches: the Next-Generation Semiconductor Memory Solutions Market
2.2.3.2 Disruption in Memory Production in the APAC Region
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Market Breakdown & Data Triangulation
2.5 Research Assumptions and Limitations
2.5.1 Assumptions
2.5.2 Limitations
3 Executive Summary (Page No. – 34)
4 Premium Insights (Page No. – 40)
4.1 Increasing Research and Development Activities Are Expected to Offer New Application Market for Next-Generation Semiconductor Memory Solution
4.2 Next-Generation Semiconductor Memory Solution Market Growth, By Application
4.3 APAC: the Leader in the Next-Generation Semiconductor Memory Solution Market, By Application (2013)
4.4 China: Highest Growing Market for the Next-Generation Semiconductor Memory Solution Market in APAC
4.5 the Next-Generation Semiconductor Nonvolatile Memory Solution Market, By Application (2013)
4.6 the Next-Generation Semiconductor Memory Solution Market: Comparison Among Growth Rates of Top Countries in Various Regions in 2013 and 2020
4.7 the Next-Generation Semiconductor Memory Solution Market Size for Application, By Type of Memory
5 Market Overview (Page No. – 47)
5.1 Introduction
5.2 Market Segmentation
5.3 Market Evolution
5.4 Market Dynamics
5.4.1 Drivers
5.4.1.1 Need for High Speed, Low Power Consumption, and Highly Scalable Memory Device
5.4.1.2 Demand for Universal Memory Devices
5.4.1.3 Growing Demand for Mass Storage
5.4.2 Restraints
5.4.2.1 Stability in Extreme Environmental Conditions
5.4.2.2 Low Write Endurance Rate
5.4.2.3 Issues With Storage Densities and High Costs
5.4.3 Opportunities
5.4.3.1 Emerging Application Sectors
5.4.3.1.1 Industrial Applications
5.4.3.1.2 Flexible Electronics
5.4.3.1.3 Neural Network
5.4.3.2 Replacement to the Flash Memory
5.4.3.3 Flexible and Wearable Electronics Sector
5.4.4 Challenges
5.4.4.1 Manufacturing Challenges
5.5 Burning Issues
5.5.1 High Design Costs
5.5.2 Density Consideration
5.6 Winning Imperatives
5.6.1 Early Adoption of the Universal Memory Technologies
5.6.2 Strategy of Geographic Expansion in the Emerging Markets
6 Industry Trends (Page No. – 62)
6.1 Introduction
6.2 Value Chain Analysis
6.2.1 Value Chain Analysis: Next-Generation Semiconductor Memory Solution Market
6.3 Industry Trends
6.4 Porter’s Five Forces Analysis
6.4.1 Threats From New Entrants
6.4.2 Threats From Substitutes
6.4.3 Bargaining Power of Suppliers
6.4.4 Bargaining Power of Buyers
6.4.5 Intensity of Rivary
7 Next-Generation Semiconductor Memory Market, By Technology (Page No. – 71)
7.1 Introduction
7.2 Nonvolatile Next-Generation Memory Technologies
7.2.1 Memristor Or Resistive Random Access Memory (RCRAM)
7.2.2 Phase-Change Random-Access Memory (PCRAM)
7.2.3 Magnetoresistive Random-Access Memory (MRAM)
7.2.4 Ferroelectric Ram (FRAM)
7.2.5 Others
7.3 Volatile Next-Generation Memory Technologies
7.3.1 Dynamic Random Access Memory (DRAM)
7.3.1.1 T-Ram
7.3.1.2 T-Tram
7.3.1.3 Other Emerging DRAM Technologies
7.3.2 Static Random-Access Memory (SRAM)
7.3.2.1 Z-Ram
8 Market Analysis, By Application (Page No. – 98)
9 Next-Generation Memory Market, By Application (Page No. – 99)
9.1 Introduction
9.1.1 Consumer Electronics
9.1.2 Mass Storage
9.1.3 Mobile Phones
9.1.4 Industrial and Automotive
9.1.5 Aerospace and Defense
9.1.6 Others
10 Geographic Analysis (Page No. – 141)
10.1 Introduction
10.2 North America
10.2.1 U.S.
10.2.2 Canada
10.2.3 Mexico
10.3 Europe
10.3.1 Germany
10.3.2 U.K.
10.3.3 France
10.3.4 Italy
10.3.5 Others
10.4 Asia-Pacific
10.4.1 China
10.4.2 Japan
10.4.3 Taiwan
10.4.4 South Korea
10.4.5 Others
10.5 Rest of the World
11 Competitive Landscape (Page No. – 169)
11.1 Overview
11.2 Market Share Analysis of the Next-Generation Memory Market
11.3 Competitive Situation and Trends
11.3.1 New Product Launches
11.3.2 Collaborations, Partnerships, and Agreements
12 Company Profiles (Page No. – 177)
12.1 Introduction
12.2 Toshiba Corporation
12.2.1 Business Overview
12.2.2 Product Portfolio
12.2.3 Key Strategies
12.2.4 Recent Developments
12.2.5 SWOT Analysis
12.2.6 MNM View
12.3 Intel Corporation
12.3.1 Business Overview
12.3.2 Products & Services
12.3.3 Key Strategies
12.3.4 Recent Developments
12.3.5 SWOT Analysis
12.3.6 MNM View
12.4 Micron Technology, Inc.
12.4.1 Business Overview
12.4.2 Product Portfolio
12.4.3 Key Strategies
12.4.4 Recent Developments
12.4.5 SWOT Analysis
12.4.6 MNM View
12.5 Sandisk Corporation
12.5.1 Business Overview
12.5.2 Product Portfolio
12.5.3 Key Strategies
12.5.4 Recent Developments
12.5.5 SWOT Analysis
12.5.6 MNM View
12.6 Adesto Technologies
12.6.1 Business Overview
12.6.2 Product Portfolio
12.6.3 Key Strategy
12.6.4 Recent Developments
12.7 Fujitsu Ltd
12.7.1 Business Overview
12.7.2 Products, Services, and Solutions Offerings
12.7.3 Key Strategy
12.7.4 Recent Developments
12.8 SK Hynix, Inc.
12.8.1 Business Overview
12.8.2 Products and Solutions Offerings
12.8.3 Key Strategy
12.8.4 Recent Developments
12.8.5 SWOT Analysis
12.8.6 MNM View
12.9 Samsung Electronics Co., Ltd.
12.9.1 Business Overview
12.9.2 Product Offerings
12.9.3 Key Strategy
12.9.4 Recent Developments
12.9.5 SWOT Analysis
12.9.6 MNM View
12.10 Cypress Semiconductor Corporation
12.10.1 Business Overview
12.10.2 Product Offerings
12.10.3 Key Strategy
12.10.4 Recent Developments
12.11 IBM Corporation
12.11.1 Business Overview
12.11.2 Product Offerings
12.11.3 Key Strategy
12.11.4 Recent Developments
13 Appendix (Page No. – 218)
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Introducing RT: Real-Time Market Intelligence
13.4 Available Customizations
13.5 Related Reports
【レポート販売概要】
■ タイトル：次世代半導体技術の世界市場：MRAM、FRAM、PCRAM、RCRAM、T-RAM、T-T-RAM、Z-RAM■ 英文：Next Generation Memory Market by Technology (Nonvolatile memory (MRAM, FRAM, PCM, and RRAM), Volatile Memory (DRAM (T-RAM, T-T-RAM, and others) and SRAM (Z-RAM and others)), Application & Geography - Global Forecast to 2013 - 2020
■ 発行日：2015年1月23日
■ 調査会社：MarketsandMarkets
■ 商品コード：MAM-SE-3111
■ 調査対象地域：グローバル
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