【レポートの概要（一部）】
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Market overview
• Product offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by type
• Wafer fab equipment
• Die-level packaging and assembly equipment
• Automated test equipment
• Wafer-level packaging and assembly equipment
PART 07: Market Drivers
PART 08: Market drivers and their impacts
PART 09: Market challenges
PART 10: Impact of drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors
PART 13: Key vendor analysis
• Global Foundries
• Intel
• Micron
• Samsung Electronics
• SK Hynix
PART 14: Key recommendations for vendors/investors
PART 15: Appendix
• List of abbreviation
PART 16: Explore Technavio
[List of Exhibits]
Exhibit 01: Semiconductor capital spending market in the US
Exhibit 02: Semiconductor capital spending market in the US ($ billions)
Exhibit 03: Five forces analysis
Exhibit 04: Semiconductor capital spending market in the US by type 2014-2019 (% share)
Exhibit 05: Capital spending in wafer fab equipment market($ billions)
Exhibit 06: Capital spending in die-level packaging and assembly equipment market 2014-2019 ($ billions)
Exhibit 07: Capital spending in automated test equipment market 2014-2019 ($ billions)
Exhibit 08: Capital spending in wafer-level packaging and assembly equipment market 2014-2019 ($ billions)
Exhibit 09: Impact of drivers
Exhibit 10: Impact of drivers and challenges
Exhibit 11: Global Foundries: Service offerings
Exhibit 12: Intel: Business segmentation 2014 by revenue
Exhibit 13: Intel: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 14: Micron: Business segmentation 2014: By revenue
Exhibit 15: Micron: Business segmentation by revenue 2013 and 2014 ($ billion)
Exhibit 16: Micron: Geographical segmentation by revenue 2014
Exhibit 17: Samsung Electronics: Business segmentation 2013
Exhibit 18: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billion)
Exhibit 19: Samsung Electronics: Geographical segmentation by revenue 2014
Exhibit 20: SK Hynix: Product segmentation 2014
Exhibit 21: SK Hynix: Product segmentation revenue by 2014 ($ billions)
Exhibit 22: SK Hynix: Geographical segmentation by revenue 2014
【レポート販売概要】
■ タイトル：アメリカの半導体設備投資市場：ウエハ製造装置、ダイレベルパッケージング装置、自動検査装置、ウエハレベルパッケージング装置■ 英文：Semiconductor Capital Spending Market in the US 2015-2019
■ 発行日：2016年1月6日
■ 調査会社：Technavio
■ 商品コード：IRTNTR7795
■ 調査対象地域：米国
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- 世界の防爆装置市場2015The Global Explosion Proof Equipment Industry Report 2015 is a professional and in-depth study on the current state of the Explosion Proof Equipment industry. The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The Explosion Proof Equipment market analysis is provided for the international markets including develop …
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