【レポートの概要（一部）】
Table Of Contents
1 Introduction (Page No. – 24)
1.1 Objective of the Study
1.2 Analyst Insights
1.3 Report Description
1.4 Report Scope & Markets Covered
1.5 Stakeholders
1.6 Report Assumptions
1.7 Research Methodology
1.8 GAN Semiconductor Devices Market Size Estimation
1.9 GAN Substrate Wafer Market Size Estimation
1.9.1 Market Crackdown
1.9.2 Forecasting Model
1.9.3 Key Data Points from Secondary Sources
1.9.4 Key Data Points from Primary Sources
1.9.5 Key Companies of Primary Research
2 Executive Summary (Page No. – 53)
2.1 Gallium Nitride Devices
2.2 Gallium Nitride Wafers
3 Market Overview (Page No. – 60)
3.1 GAN Device and Wafer Market Overview
3.1.1 Market Introduction
3.1.2 History & Evolution
3.1.3 Design Architecture
3.1.3.1 GAN Semiconductor Devices
3.1.3.2 GAN Electronic Systems
4 Market Analysis (Page No. – 77)
4.1 Introduction
4.1.1 Global GAN Semiconductor Devices Market
4.1.2 GAN Semiconductor Devices VS. Overall Semiconductor Devices Market
4.1.3 GAN Semiconductor Devices and Substrate Wafer Market Roadmap
4.2 Market Dynamics
4.2.1 Drivers
4.2.1.1 Vast Addressable Markets for GAN Power Semiconductor Devices
4.2.1.2 Emergence of New Technologies
4.2.1.3 Success of GAN in RF-Power Electronics
4.2.2 Restraints
4.2.2.1 Competition from SIC in High-Voltage Semiconductor Applications
4.2.3 Opportunities
4.2.3.1 Applications in Electric & Hybrid-Electric Vehicles
4.3 Burning Issues
4.3.1 Costlier Industry Processes
4.4 Winning Imperatives
4.4.1 Material Composition of GAN Devices
4.5 Porter’s Five Force Analysis
4.5.1 Threat from New Entrants
4.5.2 Threat from Substitutes
4.5.3 Bargaining Power of Suppliers
4.5.4 Bargaining Power of Customers
4.5.5 Degree of Competition
5 Value & Supply Chain Analysis (Page No. – 112)
5.1 GAN Devices and Wafer Value Chain
5.1.1 Introduction
5.1.2 Industry Segments & Value Chain
5.1.2.1 Eda & Design Tool Vendors
5.1.2.2 Intellectual Property Vendors
5.1.2.3 Foundry Vendors
5.1.2.4 Fabrication Facilities
5.1.2.5 Integrated Device Manufacturers
5.1.2.6 Original Device Manufacturers
5.1.2.7 Original Equipment Manufacturers
5.1.2.8 Assembly, Testing & Packaging Players
5.1.3 GAN Device Industry & Product Life Cycle
5.1.3.1 Epitaxial Growth
5.1.3.2 Wafer Bonding
5.1.3.3 Device Fabrication
5.1.3.4 Testing & Packaging
5.1.4 Supply Chain
5.1.4.1 Supply Chain Analysis
5.1.4.2 UPStream Chain
5.1.4.2.1 Raw Material Acquisition
5.1.4.2.2 Etching & Doping
5.1.4.2.3 Wafer Coating & Manufacturing
5.1.4.3 Downstream Chain
5.1.4.3.1 Device Fabrication
5.1.4.3.2 Cutting & Mounting
5.1.4.3.3 Assembly & Packaging
6 Market By Application (Page No. – 134)
6.1 Introduction
6.2 Computers Sector
6.2.1 Computer Hardware Power Modules
6.2.2 Computer UPS Systems
6.3 Communication Infrastructure Sector
6.3.1 Signal Amplifiers & Switching Systems
6.3.2 Wireless Applications
6.3.3 Wired Communication Devices
6.3.4 Satellite Communication Applications
6.3.5 Radar Applications
6.3.6 RF Applications
6.4 Consumer Electronics Sector
6.4.1 Inverters in Consumer Applications
6.4.2 Led Lighting in Consumer Applications
6.4.3 Switch Mode Consumer Power Supply Systems
6.5 Automotive Sector
6.5.1 Electric Vehicles, Hybrid Electric Vehicles (HEVS)
6.5.2 Automotive Braking Systems
6.5.3 Rail Traction
6.5.4 Automobile Motor Drives
6.6 Industrial, Power, Solar, and Wind Sectors (IPSW)
6.6.1 Smart Grid Power Systems
6.6.2 Wind Turbines and Wind Power Systems
6.6.3 Power Factor Correction (PFC) Systems
6.6.4 Photo-Voltaic Inverters
6.6.5 Solar Panels
6.6.6 Industrial Motor Drives
6.6.7 Power Distribution Systems
6.6.8 High Voltage Direct Current (HVDC) Systems
6.6.9 Electro-Mechanical Computing Systems
6.7 Military, Defense & Aerospace Sector
6.7.1 Combat Vehicles
6.7.2 Ships & Vessels
6.7.3 Microwave Radiation Applications
6.7.4 Radiation-Hard Electronics
6.7.5 Electronic Warfare Communication
6.8 Medical Sector
6.8.1 Implantable Medical Devices
6.8.2 Biomedical Electronics
7 Market By Products (Page No. – 234)
7.1 Introduction
7.2 Opto-Semiconductor Devices
7.2.1 GAN Opto-Semiconductor Devices Market
7.2.2 GAN Opto-Semiconductor Devices VS. Overallopto-Semiconductor Devices
7.3 Power Semiconductor Devices
7.3.1 GAN Power Semiconductor Devices Market
7.3.2 GAN Power Semiconductor Devices VS. Overall Power Semiconductor Devices
8 Power Semiconductors Market By Devices (Page No. – 253)
8.1 Introduction
8.2 GAN Power Discretes Market
8.2.1 GAN Power Transistors Market
8.2.1.1 GAN HEMTS Market
8.2.1.2 GAN Mosfets Market
8.2.1.3 GAN Power Transistors VS. Overall Power Transistors
8.2.2 GAN Diodes & Rectifiers Market
8.2.2.1 GAN Power Diodes & Rectifiers VS. Overall Power Diodes & Rectifiers
8.3 GAN Power ICS Market
8.3.1 GAN MMICS Market
8.3.2 GAN RFICS Market
9 Market By Technology (Page No. – 293)
9.1 Introduction
9.2 Market By Semiconductor Materials
9.2.1 IV-IV & GAN Semiconductor Devices Market
9.2.1.1 GAN-On-Silicon Semiconductor Devices Market
9.2.1.2 GAN-On-Sapphire Semiconductor Devices Market
9.2.1.3 GAN & SIC Semiconductor Devices Market
9.2.2 III-V & GAN Semiconductor Devices Market
9.2.2.1 GAN-On-GAN Semiconductor Devices Market
9.2.2.2 GAN-On-ALN Semiconductor Devices Market
9.2.2.3 Composite & Other GAN Semiconductor Devices Market
9.3 Market By Transistor Application Technologies
9.3.1 RF Applications
9.3.2 DC-DC & AC-DC Converters
9.3.3 UPS Systems & Inverters
9.3.4 Motor Drives
10 GAN Substrate Wafer Market (Page No. – 325)
10.1 Introduction
10.2 GAN Substrate Wafer Processes
10.3 GAN Substrate Wafer: Benefits & Impact on the Market
10.4 GAN Marke By Wafer Size
10.5 GAN Market By Design Configuration
11 Market By Geography (Page No. – 339)
11.1 Introduction
11.2 North America
11.3 Europe
11.4 Japan
11.5 Apac (Excluding Japan)
11.6 Rest of the World
12 Competitive Landscape (Page No. – 355)
12.1 Competitive Landscape Overview
12.2 GAN Device Market Leaders
12.3 GAN Wafer Market Leaders
12.4 Competitive Situation and Trends
12.4.1 New Product Developments/Launch Analysis
12.4.2 Agreement/Collaboration/Joint Venture & Expansion Analysis
12.4.3 Partnership, Merger & Acquisition Analysis
12.4.4 Other Development’s Analysis
13 Company Profiles (Page No. – 368)
13.1 Device Manufacturers
13.1.1 Fujitsu Limited
13.1.1.1 Company Snapshot
13.1.1.2 Products and Services
13.1.1.3 Strategies and Insights
13.1.1.4 Developments
13.1.1.5 Swot Analysis
13.1.2 Toshiba Corporation
13.1.2.1 Company Snapshot
13.1.2.2 Products and Services
13.1.2.3 Strategies and Insights
13.1.2.4 Developments
13.1.2.5 Swot Analysis
13.1.3 Koninklijke Philips N.V.
13.1.3.1 Company Snapshot
13.1.3.2 Products and Services
13.1.3.3 Strategies and Insights
13.1.3.4 Developments
13.1.3.5 Swot Analysis
13.1.4 Texas Instruments Incorporated
13.1.4.1 Company Snapshot
13.1.4.2 Products and Services
13.1.4.3 Strategies and Insights
13.1.4.4 Developments
13.1.4.5 Swot Analysis
13.2 Substrate Manufacturers
13.2.1 Mitsubishi Chemical Corporation
13.2.1.1 Company Snapshot
13.2.1.2 Products and Services
13.2.1.3 Strategies and Insights
13.2.1.4 Developments
13.2.2 Azzurro Semiconductors Ag
13.2.2.1 Company Snapshot
13.2.2.2 Products and Services
13.2.2.3 Strategies and Insights
13.2.2.4 Developments
13.2.3 EpiGAN Nv
13.2.3.1 Company Snapshot
13.2.3.2 Products and Services
13.2.3.3 Strategies and Insights
13.2.3.4 Developments
13.2.4 Nippon Telegraph & Telephone – Advance Technology Corporation
13.2.4.1 Company Snapshot
13.2.4.2 Products and Services
13.2.4.3 Strategies and Insights
13.2.4.4 Developments
13.3 Device and Substrate Manufacturers
13.3.1 RF Micro Devices Incorporated
13.3.1.1 Company Snapshot
13.3.1.2 Products and Services
13.3.1.3 Strategies and Insights
13.3.1.4 Developments
13.3.1.5 Swot Analysis
13.3.2 Cree Incorporated
13.3.2.1 Company Snapshot
13.3.2.2 Products and Services
13.3.2.3 Strategies and Insights
13.3.2.4 Developments
13.3.3 Aixtron Se
13.3.3.1 Company Snapshot
13.3.3.2 Products and Services
13.3.3.3 Strategies and Insights
13.3.3.4 Developments
13.3.4 International Quantum Epitaxy PLC
13.3.4.1 Company Snapshot
13.3.4.2 Products and Services
13.3.4.3 Strategies and Insights
13.3.4.4 Developments
【レポート販売概要】
■ タイトル：世界における窒化ガリウム(GaN)半導体デバイス及び基板ウエハー市場予測と分析（2013 – 2022）■ 英文：Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market by Technology, Application, Product, Device & by Geography - Forecast & Analysis to 2013 - 2022
■ 発行日：2014年3月
■ 調査会社：MarketsandMarkets
■ 商品コード：SE 2294
■ 調査対象地域：グローバル
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